JPH0241455U - - Google Patents
Info
- Publication number
- JPH0241455U JPH0241455U JP12075688U JP12075688U JPH0241455U JP H0241455 U JPH0241455 U JP H0241455U JP 12075688 U JP12075688 U JP 12075688U JP 12075688 U JP12075688 U JP 12075688U JP H0241455 U JPH0241455 U JP H0241455U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- footprint
- adhesion
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12075688U JPH0241455U (de) | 1988-09-14 | 1988-09-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12075688U JPH0241455U (de) | 1988-09-14 | 1988-09-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0241455U true JPH0241455U (de) | 1990-03-22 |
Family
ID=31367149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12075688U Pending JPH0241455U (de) | 1988-09-14 | 1988-09-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0241455U (de) |
-
1988
- 1988-09-14 JP JP12075688U patent/JPH0241455U/ja active Pending