JPH0241292A - Ic card - Google Patents
Ic cardInfo
- Publication number
- JPH0241292A JPH0241292A JP63190697A JP19069788A JPH0241292A JP H0241292 A JPH0241292 A JP H0241292A JP 63190697 A JP63190697 A JP 63190697A JP 19069788 A JP19069788 A JP 19069788A JP H0241292 A JPH0241292 A JP H0241292A
- Authority
- JP
- Japan
- Prior art keywords
- card
- resistance
- module
- static electricity
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 abstract description 12
- 239000011347 resin Substances 0.000 abstract description 12
- 238000007789 sealing Methods 0.000 abstract description 10
- 239000003822 epoxy resin Substances 0.000 abstract description 8
- 229920000647 polyepoxide Polymers 0.000 abstract description 8
- 230000015556 catabolic process Effects 0.000 abstract 1
- 230000005611 electricity Effects 0.000 description 18
- 230000003068 static effect Effects 0.000 description 18
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000010998 test method Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ＩＣカードに関し、特に静電破壊に強いＩＣ
カードに関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an IC card, and particularly to an IC card that is resistant to electrostatic damage.
Regarding cards.
この発明は、カード本体にＩＣ素子を装着したＩＣカー
ドに関する。このＩＣカードは、従来の磁気ストライブ
カードに比べてその記憶容量が大きいことから、金融関
係では、預金通帳に代えて預貯金の履歴を記録、記憶し
たり、クレジット関係では、買物などの取引履歴を記録
、記憶させるような事が考えられている。このＩＣカー
ドは、メモリーやデーター処理回路等の電子回路を内蔵
したｒｅ素子と、外部装置に電気的に接続する・ための
電極を、カード表面に具備している。そしてＩＣカード
表面の外部接続用の電極と埋設されたＩＣ素子のリード
端子とは、導体ワイヤーにより電気的に接続されて、い
るため、ＩＣカードの携帯時やＩＣカードの未使用時に
、電極に静電的負荷又は、意図しない電圧がかかり、Ｉ
Ｃ素子ないしは、電子回路が破壊されてしまう恐れがあ
った。The present invention relates to an IC card in which an IC element is mounted on a card body. This IC card has a larger storage capacity than conventional magnetic strip cards, so it can be used in the financial field to record and store the history of deposits and savings in place of a bankbook, and in the credit field, it can record and store the history of transactions such as shopping. It is being considered that things can be recorded and memorized. This IC card is equipped with a re element containing electronic circuits such as a memory and a data processing circuit, and electrodes for electrical connection to an external device on the card surface. The external connection electrodes on the surface of the IC card and the lead terminals of the embedded IC element are electrically connected by conductor wires, so when the IC card is carried or not in use, the electrodes If an electrostatic load or unintended voltage is applied, I
There was a risk that the C element or the electronic circuit would be destroyed.
特に、この種のＩＣカードの性質として通常携帯される
事が多い為、人体からの静電気によりＩＣ素子が静電破
壊されるなど問題があった。In particular, since this type of IC card is often carried around, there have been problems such as electrostatic damage to IC elements caused by static electricity from the human body.
本発明は、かかる従来技術の有する欠点を解消し、携帯
しても静電破壊される事の無いＩＣカードを提供するこ
とを目的としている。It is an object of the present invention to eliminate the drawbacks of the prior art and to provide an IC card that will not be damaged by electrostatic discharge even when carried.
！、 半導体素子を内蔵もしくは、装着したＩＣカード
において、該ＩＣカード表面に露出した外都電極間およ
び／または、外部電極に接続する回路間を電気抵抗が１
０３〜１０”Ωを有するように接続したことを特徴とす
るＩＣカード２、 導電性封止樹脂で、ＩＣチップを封
止したことを特徴とする前記第１項記載のＩＣカード３
、ＩＣモジュール周囲を、導電性樹脂でコートした事を
特徴とする前記第１項記載のＩＣカード
を提供する。! , In an IC card with a built-in or attached semiconductor element, an electrical resistance of 1 is required between external electrodes exposed on the surface of the IC card and/or between circuits connected to external electrodes.
IC card 2 characterized in that the IC chip is connected to have a resistance of 03 to 10''Ω; and IC card 3 according to item 1 above, characterized in that the IC chip is sealed with a conductive sealing resin.
, provides an IC card according to item 1 above, characterized in that the periphery of the IC module is coated with a conductive resin.
すなわち、本発明のポイントは、カード表面の電極間、
および／または電極に接続する基板上の回路間を相互に
半導・１的へに接続し、すなわち、各電極間抵抗が１０
３〜１０’Ωの範囲になる様にした事を特徴とし、その
方法としてはいろいろな方法があげられるが、本発明の
代表的な方法について説明する。通常、ＩＣチップの封
止に用いられる封止樹脂は、絶縁性の高いエポキシ樹脂
が、使用されているが、本発明はこの封止エポキシ樹脂
の代わりに、導電性樹脂を使用する。That is, the key point of the present invention is that between the electrodes on the card surface,
and/or the circuits on the substrate connected to the electrodes are connected to each other semiconductingly, that is, the resistance between each electrode is 10
It is characterized in that the resistance is within the range of 3 to 10'Ω, and various methods can be used to achieve this, but a typical method of the present invention will be described. Usually, a highly insulating epoxy resin is used as a sealing resin for sealing an IC chip, but the present invention uses a conductive resin instead of this sealing epoxy resin.
一般に導電性樹脂としては、カーボンや金属粉等の導電
性を有する物質をエポキシ樹脂等に混合して導電性を持
たせたものであるが、この導電性樹脂でＩＣチップを封
止する事により、電極に接続する回路を半導電的に接続
する。各電極間抵抗は、カーボンや金属粉等の導電性物
質の混合量を変える事により調整する。この様にして電
極間抵抗を１０１〜１０’Ωにする方法や、あるいは、
ＩＣモジール周囲を導電性樹脂又は、導電性塗料でコー
トする事により外部電極に接続されているモジュール内
部の回路パターンを半導電的に接続し、その電気抵抗を
１０１〜１０’ρにする方法等がある。In general, conductive resin is made by mixing conductive substances such as carbon or metal powder with epoxy resin to make it conductive. By sealing an IC chip with this conductive resin, , semiconductively connects the circuit connected to the electrode. The resistance between each electrode is adjusted by changing the amount of conductive material such as carbon or metal powder mixed. In this way, the inter-electrode resistance can be set to 101 to 10'Ω, or
A method of semi-conductively connecting the circuit pattern inside the module that is connected to the external electrode by coating the area around the IC module with conductive resin or conductive paint, and making the electrical resistance 101 to 10'ρ. There is.
上記の様に電極間抵抗を１０３〜Ｉ Ｏ”、好ましくは
１０４〜１０７ρにすることにより、電極端子から流入
した静電気は、各抵抗回路に分散され、ＩＣ素子に対す
る静電気の局所集中を防ぐ事ができ、静電破壊を防止し
たＩＣカードが得られる。電極の各端子間抵抗は、低い
方が静電気に対して効果はあるが、あまり低いと短絡を
生じ、ＩＣ素子は、動作しない我々の実験によれば、電
極の各端子間抵抗が、ｔｏ”９未満では、各電極間が電
気的に短絡し、ＩＣチップは正常に動作しない。又電極
の各端子間抵抗が、１０”ｇを超える高い抵抗では、静
電気に対する防止効果はなくなる。その為電極の各端子
間抵抗は１０８〜１０’、好ましくは１０’〜１０？ρ
の範囲である。この範囲であれば、チップに対する障害
も無く、静電気によるＩＣチップの静電破壊を有効に防
止する事ができる。As mentioned above, by setting the inter-electrode resistance to 103 to IO'', preferably 104 to 107ρ, static electricity flowing from the electrode terminals is dispersed to each resistance circuit, and local concentration of static electricity on IC elements can be prevented. This results in an IC card that prevents electrostatic damage.The lower the resistance between each terminal of the electrode, the more effective it is against static electricity, but if it is too low, a short circuit will occur and the IC element will not work. According to the above, if the resistance between the terminals of the electrodes is less than 9, an electrical short circuit will occur between the electrodes, and the IC chip will not operate normally. Also, if the resistance between each terminal of the electrode exceeds 10"g, the effect of preventing static electricity will be lost. Therefore, the resistance between each terminal of the electrode should be 108 to 10', preferably 10' to 10?ρ
is within the range of Within this range, there will be no damage to the chip, and electrostatic damage to the IC chip due to static electricity can be effectively prevented.
実施例１
従来のＩＣモジュールの構造は、第２図の様な構造をし
ており、表の面が外部装置と電気的に接続する為の外部
電極１になっており、外部電極の表面には、基板９を介
してＩＣチップ６が装着され、ＩＣチップ６と、配線パ
ターン３とは、ワイヤー７で接続され、ＩＣチップ６は
、ＩＣチップを保護する為、エポキシ樹脂８で封止され
ている。Example 1 The structure of a conventional IC module is as shown in Figure 2, with the front surface serving as an external electrode 1 for electrical connection to an external device, and the surface of the external electrode , an IC chip 6 is mounted via a substrate 9, the IC chip 6 and the wiring pattern 3 are connected with a wire 7, and the IC chip 6 is sealed with an epoxy resin 8 to protect the IC chip. ing.
２はスルーホール、４は接着剤、５はポツティング枠、
ｌＯは銀ペーストである。2 is a through hole, 4 is an adhesive, 5 is a potting frame,
IO is silver paste.
通常、この様な構造を有するＩＣモジュールにおいては
、８の封止樹脂として、絶縁性の高い、エポキシ樹脂が
使用されているが、本実施例は、このエポキシ樹脂８０
代わりに、カーボン入り導電性エポキシ樹脂１１を用い
て封止し、表面電極ｌに接続する回路間を半導電的に短
絡させ、外部電極ｌのそれぞれの電極間抵抗が１０’〜
１０’＃のＩＣモジュールを作り、第１図に示すとおり
カードにした。このＩＣカードについて、耐静電気試験
を行なった。Usually, in an IC module having such a structure, a highly insulating epoxy resin is used as the sealing resin 8, but in this example, this epoxy resin 80 is used.
Instead, the carbon-containing conductive epoxy resin 11 is used for sealing, and the circuits connected to the surface electrodes 1 are semiconductively short-circuited, so that the interelectrode resistance of each of the external electrodes 1 is 10'~
A 10'# IC module was made and made into a card as shown in FIG. A static electricity resistance test was conducted on this IC card.
耐静電気試験は、（東ノイズ研究所製の静電気許容度試
験機ＥＳＳ−６２５Ｓを用いて、下記沈水す静電気試験
方法で行なった。The static electricity resistance test was conducted using the static electricity tolerance tester ESS-625S (manufactured by Higashi Noise Institute) according to the following submersion static electricity test method.
静電気試験方法（第５図参照）
（Ｉ）テスト方法
次の方法に従って、１００ｐＦのキャパシター１３から
、１ｋｇの抵抗１４を通して、カードのコンタクトに向
けて放電する。始めは正常の極性で、次に逆の極性でＧ
ＮＤコンタクトエ５と他のコンタクト１６の間で放電さ
せる。１７がＩＣカードである。Electrostatic test method (see Figure 5) (I) Test method According to the following method, a 100 pF capacitor 13 is discharged through a 1 kg resistor 14 to the contacts of the card. G at first with normal polarity, then with reverse polarity.
A discharge is caused between the ND contact 5 and the other contact 16. 17 is an IC card.
■ 測定方法
ＩＣカードの機能チエツクは、最初の状態で書込み／読
取りがテスト修了後も行えることを調査すること
試験の結果、従来の静電気対策をしてないＩＣモジュー
ルにおいては、印加電圧４〜５ＫＶで、ＩＣチップは、
静電破壊されるのに対し、本実施例の導電性樹脂で封止
したＩＣモジュールは、印加電圧８〜ＱＫＶ迄静電破壊
される事は無く、耐静電気性は、従来カードに比較して
、約２倍に向上した。■Measurement method The function check of the IC card is to check that writing/reading can be performed in the initial state even after the test is completed.As a result of the test, the applied voltage is 4 to 5 KV for IC modules that do not have conventional static electricity countermeasures. So, the IC chip is
In contrast, the IC module sealed with conductive resin of this example will not be damaged by static electricity up to an applied voltage of 8 to QKV, and its resistance to static electricity is higher than that of conventional cards. , the improvement was approximately doubled.
実施例２
実施例１において使用した従来モジュール第２図の周囲
に、金属粉入り導電性塗料をコートし、表面電極１と接
続されている回路パターン３を半導電的に短絡し、外部
電極１のそれぞれの電極間抵抗が１０４〜１０７ｇのＩ
Ｃモジュール（第３図及びそのＡ−Ａにおける断面図、
第４図に示す。）を作りカードにした。このＩＣカード
について耐静電気試験を行なった。耐静電気試験は、（
株）ノイズ研究所製の静電気許容度試験機ＥＳＳ−６２
５８を用いて、実施例１に記載と同じ方法で行なった。Example 2 A conductive paint containing metal powder was coated around the conventional module shown in FIG. I with an interelectrode resistance of 104 to 107 g
C module (Fig. 3 and its sectional view along A-A,
It is shown in Figure 4. ) and turned it into a card. A static electricity resistance test was conducted on this IC card. Electrostatic resistance test (
Static electricity tolerance tester ESS-62 manufactured by Noise Institute Co., Ltd.
58 in the same manner as described in Example 1.
試験の結果、従来の静電気対策をしてないＩＣモジュー
ルにおい【は、印加電圧４〜５ＫＶでＩＣチップは静電
破壊され、ＩＣチップは作動しないのに対し、本実施例
の静電対策を施したＩＣモジュールは、印加電圧８〜Ｑ
ＫＶ迄静電破壊される事は無く、耐静電気性は従来カー
ドに比較して約２倍に向上した。As a result of the test, it was found that in an IC module without conventional static electricity countermeasures, the IC chip was destroyed by static electricity and did not operate at an applied voltage of 4 to 5 KV, whereas the IC chip did not operate with the static electricity countermeasures of this example. The applied voltage of the IC module is 8~Q.
There was no electrostatic damage up to KV, and the electrostatic resistance was approximately twice as high as that of conventional cards.
Ｍ２図は、一般的な従来型ＩＣモジュールの断面構造図
、
第１図は、本発明の実施例１で考案されたｆＣモジュー
ル断面構造図、第３図は、本発明の実施例２で考案され
たＩＣモジュールを示す平面図、第４図は、本発明の実
施例２で考案されたＩＣモジュールを示す、第３図のＡ
−Ａ線断面構造図、第５図は、静電気試験方法の説明図
である。
各図において
ｌ・・・外［［，２・・・スルーホール、３・・・回路
パターン、４・・・接着剤、５・・・ボッティング枠、
６・・・ＩＣチップ、７・・・ワイヤー ８・・・エポ
キシ封止樹脂、９・・・基板、１０・・・銀ペースト、
１１・・・導電性封止樹脂、１２・・・導電性塗料。
第１図
特許出願人 旭化成工業株式会社Figure M2 is a cross-sectional structural diagram of a general conventional IC module, Figure 1 is a cross-sectional structural diagram of an fC module devised in Embodiment 1 of the present invention, and Figure 3 is a cross-sectional structural diagram of an fC module devised in Embodiment 2 of the present invention. FIG. 4 is a plan view showing the IC module according to the second embodiment of the present invention, and A of FIG.
- A cross-sectional structural diagram, FIG. 5 is an explanatory diagram of the electrostatic test method. In each figure, l... outside [[, 2... through hole, 3... circuit pattern, 4... adhesive, 5... botting frame,
6... IC chip, 7... Wire 8... Epoxy sealing resin, 9... Substrate, 10... Silver paste,
11... Conductive sealing resin, 12... Conductive paint. Figure 1 Patent applicant Asahi Kasei Industries, Ltd.
Claims (1)
おいて、該ＩＣカード表面に露出した外部電極間および
／または外部電極に接続する回路間を電気抵抗が１０＾
３〜１０＾８Ωを有するように接続したことを特徴とす
るＩＣカード1. In an IC card with a built-in or attached semiconductor element, the electrical resistance between external electrodes exposed on the surface of the IC card and/or between circuits connected to the external electrodes is 10^.
An IC card characterized by being connected to have a resistance of 3 to 10^8 Ω.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63190697A JPH0241292A (en) | 1988-08-01 | 1988-08-01 | Ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63190697A JPH0241292A (en) | 1988-08-01 | 1988-08-01 | Ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0241292A true JPH0241292A (en) | 1990-02-09 |
Family
ID=16262349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63190697A Pending JPH0241292A (en) | 1988-08-01 | 1988-08-01 | Ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0241292A (en) |
-
1988
- 1988-08-01 JP JP63190697A patent/JPH0241292A/en active Pending
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