JPH0241147Y2 - - Google Patents
Info
- Publication number
- JPH0241147Y2 JPH0241147Y2 JP1985009156U JP915685U JPH0241147Y2 JP H0241147 Y2 JPH0241147 Y2 JP H0241147Y2 JP 1985009156 U JP1985009156 U JP 1985009156U JP 915685 U JP915685 U JP 915685U JP H0241147 Y2 JPH0241147 Y2 JP H0241147Y2
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- adhesive layer
- sheet
- holes
- electromagnetic waves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 9
- 239000004831 Hot glue Substances 0.000 claims description 8
- 239000010410 layer Substances 0.000 claims description 7
- 239000002390 adhesive tape Substances 0.000 claims description 4
- 230000035699 permeability Effects 0.000 claims 1
- 238000009423 ventilation Methods 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000004033 plastic Substances 0.000 description 7
- 229920003023 plastic Polymers 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000009940 knitting Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000005300 metallic glass Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Landscapes
- Non-Insulated Conductors (AREA)
- Adhesive Tapes (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Elimination Of Static Electricity (AREA)
Description
【考案の詳細な説明】
本案は電子機器等から発生する電磁波等の障害
電波の遮蔽用導電性接着テープまたはシートに関
する。[Detailed Description of the Invention] The present invention relates to a conductive adhesive tape or sheet for shielding interference radio waves such as electromagnetic waves generated from electronic equipment and the like.
テレビ、ラジオ、VTRその他の電子機器類の
筐体は近年その製作の容易、価格の低廉等の関係
上プラスチツク製が多くなつている。しかしプラ
スチツク製筐体は電磁波シールド能がないため内
蔵する電子機器の発生する電磁波が周囲の電子機
器に電磁妨害を与える。また外部からの電磁波に
より内蔵しているIC、電子部品が電磁障害をう
ける。これらを防止するため、例えばプラスチツ
ク筐体の壁面に導電性塗装を施こしているが、塗
装には多くの手数を要するばかりでなく、壁面に
は多数の放熱孔が設けられているものがあり、放
熱孔の部分の電磁波シールドは極めて困難である
等の欠点がある。 In recent years, the housings of televisions, radios, VTRs, and other electronic devices have increasingly been made of plastic because of their ease of manufacture and low cost. However, since the plastic housing does not have the ability to shield electromagnetic waves, the electromagnetic waves generated by the built-in electronic devices cause electromagnetic interference to surrounding electronic devices. In addition, internal ICs and electronic components may be subject to electromagnetic interference due to external electromagnetic waves. To prevent this, for example, the walls of plastic cases are coated with conductive paint, but not only does painting require a lot of work, but some of the walls have many heat dissipation holes. However, there are drawbacks such as the fact that it is extremely difficult to shield electromagnetic waves around the heat radiation holes.
本案は導電性基体とその面に一体的に設けられ
たホツトメルト系接着剤層を貫通する電磁波遮蔽
性を保持することができる所定大の通気孔を設け
たもので、電子機器等を収容する筐体に通気孔が
あつても、簡単に熱圧着して容易に電磁波等によ
る電波障害を防止できると共に電子機器等からの
発生熱を筐体外に容易に放散できる。 This design has a ventilation hole of a predetermined size that can maintain electromagnetic wave shielding properties that penetrates a conductive substrate and a hot melt adhesive layer that is integrally provided on the surface of the conductive substrate. Even if there is a ventilation hole in the body, it can be easily thermocompressed to prevent radio wave interference caused by electromagnetic waves, etc., and the heat generated from electronic equipment etc. can be easily dissipated to the outside of the housing.
以下実施例について説明すると、通気孔2を有
する導電性基体1は、銅、銅合金、鉄、ステンレ
ススチールその他の鉄合金、アルミニウム、ニツ
ケルその他の導電性金属、導電性アモロフアス金
属等の箔又は薄いシート、導電性プラスチツク等
を型等で打抜く等して所定配列にした所定大の通
気孔2を穿設したもの、あるいは前記の導電性金
属、導電性プラスチツク、カーボン等で形成され
た線材、テープ材等を用い所定大の網目に編成、
織成したもの等がある。上記の所定大の通気孔若
しくは網目等の孔2の大きさは電子機器等が発生
する熱を筐体外に放出するに必要な通気ができる
と共に該電子機器から発生する電磁波を遮断でき
ることが必要であり、孔の形状は丸形、楕円形、
角形、異形に適宜でき、その最大開口部寸法を
0.5〜10mm程度としている。この最大開口部寸法
とは例えば円形孔では孔径、楕円形孔では長軸、
角形孔では孔を横断するほぼ最長線の長さを云
う。最大開口部寸法が0.5mm以下では充分な放熱
用通気ができず、また10mmを超えると電磁波を遮
蔽する効果が得難くなる。 To explain an example below, the conductive substrate 1 having the ventilation hole 2 is made of a foil or thin film made of copper, copper alloy, iron, stainless steel or other iron alloy, aluminum, nickel or other conductive metal, conductive amorphous metal, etc. A sheet, a conductive plastic, etc., punched out with a mold or the like, with ventilation holes 2 of a predetermined size arranged in a predetermined arrangement, or a wire made of the above-mentioned conductive metal, conductive plastic, carbon, etc. Organized into a mesh of a predetermined size using tape material, etc.
There are also woven ones. The size of the holes 2, such as the above-mentioned ventilation holes or mesh holes, must be such that they can provide the ventilation necessary to release the heat generated by the electronic equipment to the outside of the case, and can also block the electromagnetic waves generated by the electronic equipment. Yes, the hole shape is round, oval,
Can be made into square or irregular shapes as appropriate, and its maximum opening size can be
It is approximately 0.5 to 10 mm. This maximum opening dimension is, for example, the hole diameter for a circular hole, the long axis for an oval hole,
For square holes, the length is approximately the length of the longest line that crosses the hole. If the maximum opening size is less than 0.5 mm, sufficient ventilation for heat dissipation will not be possible, and if it exceeds 10 mm, it will be difficult to obtain the effect of shielding electromagnetic waves.
上記導電性基体1の一方の面には、エチレン−
酢酸ビニル共重合体系、ポリアミド系、ポリエス
テル系、エチレン−アクリル共重合体系、合成ゴ
ム系その他の熱可塑性、熱硬化性等のホツトメル
ト系接着剤層3が該導電性基体に穿設されている
通気孔2を閉塞しないようにして設けられてい
る。上記接着剤層2は基体の一方の面の全面に設
けられるほか、必要に応じては接着剤層の不存在
部4を存して所要部に設けることもできる(第4
〜6図)。特に通気孔が小さな場合に有効である。
上記ホツトメルト系接着剤層は接着剤に応じてノ
ヅル法、ホイール法、ローラ法、ポータブルガン
法等の公知の方法で適宜形成できる。またホツト
メルト系接着剤層2は必要に応じて前記導電性基
体の両面にも前記一方の面と同様に形成できる。 One surface of the conductive substrate 1 has ethylene-
A hot melt adhesive layer 3 made of vinyl acetate copolymer, polyamide, polyester, ethylene-acrylic copolymer, synthetic rubber, or other thermoplastic or thermosetting adhesive is formed on the conductive substrate. It is provided so as not to block the pores 2. The adhesive layer 2 is provided on the entire surface of one surface of the base body, and if necessary, it can be provided in a desired part with an area 4 where the adhesive layer is not present (a fourth
~Figure 6). This is particularly effective when the vent hole is small.
The above-mentioned hot melt adhesive layer can be appropriately formed by a known method such as a nozzle method, a wheel method, a roller method, or a portable gun method depending on the adhesive. Furthermore, the hot melt adhesive layer 2 can be formed on both sides of the conductive substrate in the same manner as on the one side, if necessary.
本案の導電性粘着テープまたはシートは上記の
ほか、前記の導電性基体を構成する各種の導電性
金属の箔または薄いシート、導電性プラスチツク
シート、又は前記導電性金属の線材、カーボン繊
維、導電性プラスチツク繊維等を用い編成、織成
して得られる導電性布帛若しくは導電性不織布等
の裏面、あるいは表裏両面にホツトメルト系接着
剤層を前記同様に設けて積層体を形成し、該積層
体を貫通して上記所定大の通気孔2を打抜き等に
より所定配列に穿設しても極めて容易に形成でき
る。 In addition to the above, the conductive adhesive tape or sheet of the present invention includes foils or thin sheets of various conductive metals constituting the conductive substrate, conductive plastic sheets, wires of the conductive metal, carbon fiber, conductive A laminate is formed by providing a hot-melt adhesive layer on the back side or both front and back surfaces of a conductive fabric or a conductive non-woven fabric obtained by knitting and weaving plastic fibers, etc., and penetrating the laminate. The vent holes 2 of a predetermined size can be formed very easily by punching or the like in a predetermined arrangement.
本案は上述の如き構成で、例えば上記電子機器
類のプラスチツク製筐体の内面等に、この接着シ
ートの接着剤層を当てるようにして、ホツトプレ
ス等を用いて押圧すれば容易に貼付けることがで
きて電磁波の遮蔽を行うことができる。そして、
特に筐体に放熱孔等が設けられているような場合
であつてもそのままその内面にこの接着シートを
貼付ければ、このシートは通気孔を備えているの
で、上記放熱孔を塞がず、通気、放熱作用を何等
妨げることはないし、その通気孔の大きさが上記
した如き大きさであることから、充分な電磁波シ
ールドを行うことができる。 The present invention has the above-mentioned structure, and can be easily pasted by applying the adhesive layer of the adhesive sheet to the inner surface of the plastic casing of the above-mentioned electronic devices, for example, and pressing it using a hot press or the like. It can be used to shield electromagnetic waves. and,
In particular, even if the casing has heat dissipation holes etc., if this adhesive sheet is pasted on the inner surface of the case, the heat dissipation holes will not be blocked since the sheet is equipped with ventilation holes. Since the ventilation and heat dissipation effects are not hindered in any way, and the size of the ventilation hole is as described above, sufficient electromagnetic wave shielding can be achieved.
また、上記接着剤層にはホツトメルト系の接着
剤を用いているので、接着が強固にできるし、筐
体の放熱孔があるために筐体の内面に接すること
なく、接着剤が裸のままに露出されていても、通
常の粘着剤のようにゴミやほこり等が付着して放
熱孔が塞がれるようになつたり、汚れたりするよ
うなこともなく、長期間にわたつて安定的な放熱
作用と電磁波シールドを行うことができる。また
本案の導電性接着テープまたはシートは筐体等の
通気孔のある部分に用い、他の部分は例えば導電
性塗料を塗布する等併用も可能なものであり、そ
の構造は簡単で施工も容易にできる。 In addition, since a hot melt adhesive is used for the adhesive layer, the bond is strong, and because there are heat radiation holes in the housing, the adhesive does not come into contact with the inner surface of the housing, leaving the adhesive exposed. Even if it is exposed to the environment, it will not get dirty or get dirty due to dirt or dust adhering to it like normal adhesives, and it will remain stable for a long period of time. It can perform heat dissipation and electromagnetic shielding. In addition, the conductive adhesive tape or sheet of the present invention can be used in areas with ventilation holes such as the housing, and can be used in combination with other areas, such as by applying conductive paint, and its structure is simple and easy to install. Can be done.
図面は本案の実施例を示し、第1図は平面図、
第2図は第1図の−線断面図、第3図は変形
例を示す平面図、第4図は他の変形例を示す平面
図、第5図は第4図の−線断面図、第6図は
第4図の−線断面図である。
1は導電性基体、2は通気孔、3はホツトメル
ト系接着剤層、4は接着剤不存在部。
The drawings show an embodiment of the present invention, and FIG. 1 is a plan view;
2 is a sectional view taken along the - line in FIG. 1, FIG. 3 is a plan view showing a modified example, FIG. 4 is a plan view showing another modified example, and FIG. 5 is a sectional view taken along the - line in FIG. FIG. 6 is a sectional view taken along the line -- in FIG. 4. 1 is a conductive substrate, 2 is a ventilation hole, 3 is a hot melt adhesive layer, and 4 is an adhesive-free area.
Claims (1)
性基体に適度の通気性を有しかつ電磁波遮蔽性を
保持するようにその最大開口部寸法を0.5〜10mm
の大きさにした通気孔を複数個形成し、上記導電
性基体の少くも一方の面に上記通気孔を閉塞しな
いようにホツトメルト系接着剤層を設けた電磁波
遮蔽用導電性接着テープまたはシート。 It has a substantially sheet-like conductive base, and its maximum opening size is 0.5 to 10 mm so that the conductive base has appropriate air permeability and electromagnetic wave shielding properties.
A conductive adhesive tape or sheet for shielding electromagnetic waves, which has a plurality of vent holes each having a size of 1, and a hot melt adhesive layer provided on at least one surface of the conductive substrate so as not to block the vent holes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985009156U JPH0241147Y2 (en) | 1985-01-28 | 1985-01-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985009156U JPH0241147Y2 (en) | 1985-01-28 | 1985-01-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61129842U JPS61129842U (en) | 1986-08-14 |
JPH0241147Y2 true JPH0241147Y2 (en) | 1990-11-01 |
Family
ID=30489107
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985009156U Expired JPH0241147Y2 (en) | 1985-01-28 | 1985-01-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0241147Y2 (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4994739A (en) * | 1972-11-27 | 1974-09-09 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6140750Y2 (en) * | 1980-11-13 | 1986-11-20 |
-
1985
- 1985-01-28 JP JP1985009156U patent/JPH0241147Y2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4994739A (en) * | 1972-11-27 | 1974-09-09 |
Also Published As
Publication number | Publication date |
---|---|
JPS61129842U (en) | 1986-08-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO1995007600A2 (en) | Laminated shielding material and method for shielding an enclosure therewith | |
CA2339557A1 (en) | Laminate having shapability | |
US20090029094A1 (en) | Structure with capability of conducting/absorbing electromagnetic waves | |
JPH0241147Y2 (en) | ||
JP2778754B2 (en) | Electromagnetic shielding gasket tape | |
JP2007149761A (en) | Electromagnetic shielding sheet, and method of manufacturing same | |
US20020071551A1 (en) | Cellular phone electromagnetic wave earpiece shield | |
WO1994004014A1 (en) | Shielding panel | |
JP2006324645A (en) | Structure having property for conducting or absorbing electromagnetic wave | |
JPH1041679A (en) | Electromagnetic wave shielding material and enclosure for electronic component | |
JPS6336026Y2 (en) | ||
JPH1187980A (en) | Composite magnetic sheet | |
JP2001267781A (en) | Shield member of wire harness | |
CN219960920U (en) | Anti-interference structure, carrying coil structure, flexible printed circuit board and display module assembly | |
JP2522294Y2 (en) | Electromagnetic shield plate | |
JP3007035U (en) | Post-coated tube with shield | |
JPH0410036Y2 (en) | ||
JPH025598Y2 (en) | ||
JP3063233U (en) | Electromagnetic wave shielding tape | |
JPS6381899A (en) | Cubicle equipment | |
JPH023679Y2 (en) | ||
JPH054209Y2 (en) | ||
JPH0639058U (en) | Electronic circuit board cover for amusement machines | |
JPS6114102Y2 (en) | ||
JPH0126743Y2 (en) |