JPH0240058U - - Google Patents
Info
- Publication number
- JPH0240058U JPH0240058U JP11817088U JP11817088U JPH0240058U JP H0240058 U JPH0240058 U JP H0240058U JP 11817088 U JP11817088 U JP 11817088U JP 11817088 U JP11817088 U JP 11817088U JP H0240058 U JPH0240058 U JP H0240058U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- bottom tape
- concave portion
- taping
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011358 absorbing material Substances 0.000 claims description 2
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Description
第1図は本考案に係る第1の実施例を示すテー
ピング部品の下部から見た一部破断斜視図、第2
図は第2の実施例を示す縦断面図、第3図は第3
の実施例を示す縦断面図である。第4図は従来の
テーピング部品の下部から見た斜視図、第5図は
同じく縦断面図である。
1……ボトムテープ、2……凹部、3……チツ
プ部品、4……トツプシールテープ、5,6,7
……吸湿材。
FIG. 1 is a partially cutaway perspective view of a taping component seen from the bottom, showing a first embodiment of the present invention;
The figure is a vertical sectional view showing the second embodiment, and FIG.
FIG. FIG. 4 is a perspective view of a conventional taping component seen from the bottom, and FIG. 5 is a longitudinal cross-sectional view. 1... Bottom tape, 2... Recess, 3... Chip parts, 4... Top seal tape, 5, 6, 7
...Moisture absorbing material.
Claims (1)
ープと、前記ボトムテープの凹部開口側を閉じる
ようにボトムテープに貼着するトツプシールテー
プとからなるテーピング部材において、 上記凹部内に吸湿材を配置したことを特徴とす
るテーピング部品。[Scope of Claim for Utility Model Registration] A taping member consisting of a bottom tape in which a concave portion for accommodating a chip component is provided in series, and a top seal tape that is attached to the bottom tape so as to close the opening side of the concave portion of the bottom tape, A taping part characterized by having a moisture-absorbing material placed inside the recess.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11817088U JPH0240058U (en) | 1988-09-07 | 1988-09-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11817088U JPH0240058U (en) | 1988-09-07 | 1988-09-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0240058U true JPH0240058U (en) | 1990-03-19 |
Family
ID=31362293
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11817088U Pending JPH0240058U (en) | 1988-09-07 | 1988-09-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0240058U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003037743A1 (en) * | 2001-11-01 | 2003-05-08 | Idemitsu Unitech Co., Ltd. | Atmosphere improving tape for package, package with atmosphere improving tape and method of manufacturing the package, package container with atmosphere improving tape, engaging device, and package with engaging device |
-
1988
- 1988-09-07 JP JP11817088U patent/JPH0240058U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003037743A1 (en) * | 2001-11-01 | 2003-05-08 | Idemitsu Unitech Co., Ltd. | Atmosphere improving tape for package, package with atmosphere improving tape and method of manufacturing the package, package container with atmosphere improving tape, engaging device, and package with engaging device |
CN100443382C (en) * | 2001-11-01 | 2008-12-17 | 出光统一科技株式会社 | Atmosphere improving tape for package, package with atmosphere improving tape and method of manufacturing the package, package container with atmosphere improving tape, engaging device and package wit |
KR100893643B1 (en) * | 2001-11-01 | 2009-04-17 | 이데미쓰 유니테크 가부시키가이샤 | Atmosphere improving tape for package, package with atmosphere improving tape and method of manufacturing the package, package container with atmosphere improving tape, engaging device, and package with engaging device |