JPH0240058U - - Google Patents

Info

Publication number
JPH0240058U
JPH0240058U JP11817088U JP11817088U JPH0240058U JP H0240058 U JPH0240058 U JP H0240058U JP 11817088 U JP11817088 U JP 11817088U JP 11817088 U JP11817088 U JP 11817088U JP H0240058 U JPH0240058 U JP H0240058U
Authority
JP
Japan
Prior art keywords
tape
bottom tape
concave portion
taping
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11817088U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11817088U priority Critical patent/JPH0240058U/ja
Publication of JPH0240058U publication Critical patent/JPH0240058U/ja
Pending legal-status Critical Current

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  • Packages (AREA)
  • Packaging Frangible Articles (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案に係る第1の実施例を示すテー
ピング部品の下部から見た一部破断斜視図、第2
図は第2の実施例を示す縦断面図、第3図は第3
の実施例を示す縦断面図である。第4図は従来の
テーピング部品の下部から見た斜視図、第5図は
同じく縦断面図である。 1……ボトムテープ、2……凹部、3……チツ
プ部品、4……トツプシールテープ、5,6,7
……吸湿材。
FIG. 1 is a partially cutaway perspective view of a taping component seen from the bottom, showing a first embodiment of the present invention;
The figure is a vertical sectional view showing the second embodiment, and FIG.
FIG. FIG. 4 is a perspective view of a conventional taping component seen from the bottom, and FIG. 5 is a longitudinal cross-sectional view. 1... Bottom tape, 2... Recess, 3... Chip parts, 4... Top seal tape, 5, 6, 7
...Moisture absorbing material.

Claims (1)

【実用新案登録請求の範囲】 チツプ部品を収納する凹部を連設したボトムテ
ープと、前記ボトムテープの凹部開口側を閉じる
ようにボトムテープに貼着するトツプシールテー
プとからなるテーピング部材において、 上記凹部内に吸湿材を配置したことを特徴とす
るテーピング部品。
[Scope of Claim for Utility Model Registration] A taping member consisting of a bottom tape in which a concave portion for accommodating a chip component is provided in series, and a top seal tape that is attached to the bottom tape so as to close the opening side of the concave portion of the bottom tape, A taping part characterized by having a moisture-absorbing material placed inside the recess.
JP11817088U 1988-09-07 1988-09-07 Pending JPH0240058U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11817088U JPH0240058U (en) 1988-09-07 1988-09-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11817088U JPH0240058U (en) 1988-09-07 1988-09-07

Publications (1)

Publication Number Publication Date
JPH0240058U true JPH0240058U (en) 1990-03-19

Family

ID=31362293

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11817088U Pending JPH0240058U (en) 1988-09-07 1988-09-07

Country Status (1)

Country Link
JP (1) JPH0240058U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003037743A1 (en) * 2001-11-01 2003-05-08 Idemitsu Unitech Co., Ltd. Atmosphere improving tape for package, package with atmosphere improving tape and method of manufacturing the package, package container with atmosphere improving tape, engaging device, and package with engaging device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003037743A1 (en) * 2001-11-01 2003-05-08 Idemitsu Unitech Co., Ltd. Atmosphere improving tape for package, package with atmosphere improving tape and method of manufacturing the package, package container with atmosphere improving tape, engaging device, and package with engaging device
CN100443382C (en) * 2001-11-01 2008-12-17 出光统一科技株式会社 Atmosphere improving tape for package, package with atmosphere improving tape and method of manufacturing the package, package container with atmosphere improving tape, engaging device and package wit
KR100893643B1 (en) * 2001-11-01 2009-04-17 이데미쓰 유니테크 가부시키가이샤 Atmosphere improving tape for package, package with atmosphere improving tape and method of manufacturing the package, package container with atmosphere improving tape, engaging device, and package with engaging device

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