JPH0240027B2 - HISANKABUTSUSERAMITSUKUSUYOSETSUCHAKUZAISHIITOOYOBI HISANKABUTSUSERAMITSUKUSUYOSETHICHAKUTSUUSERAMITSUKUSUNOSETSUCHAKUHOHO - Google Patents
HISANKABUTSUSERAMITSUKUSUYOSETSUCHAKUZAISHIITOOYOBI HISANKABUTSUSERAMITSUKUSUYOSETHICHAKUTSUUSERAMITSUKUSUNOSETSUCHAKUHOHOInfo
- Publication number
- JPH0240027B2 JPH0240027B2 JP14723485A JP14723485A JPH0240027B2 JP H0240027 B2 JPH0240027 B2 JP H0240027B2 JP 14723485 A JP14723485 A JP 14723485A JP 14723485 A JP14723485 A JP 14723485A JP H0240027 B2 JPH0240027 B2 JP H0240027B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- oxide
- parts
- silicon nitride
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000001070 adhesive effect Effects 0.000 claims description 96
- 239000000853 adhesive Substances 0.000 claims description 87
- 229910052575 non-oxide ceramic Inorganic materials 0.000 claims description 36
- 239000011225 non-oxide ceramic Substances 0.000 claims description 36
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 24
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 24
- 229910001404 rare earth metal oxide Inorganic materials 0.000 claims description 18
- 239000004480 active ingredient Substances 0.000 claims description 17
- 239000011230 binding agent Substances 0.000 claims description 17
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 16
- 239000000395 magnesium oxide Substances 0.000 claims description 15
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 11
- 238000002156 mixing Methods 0.000 claims description 7
- 239000012298 atmosphere Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 230000001590 oxidative effect Effects 0.000 claims description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 12
- 239000002245 particle Substances 0.000 description 11
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 5
- 239000000806 elastomer Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 229910010271 silicon carbide Inorganic materials 0.000 description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000011812 mixed powder Substances 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 238000013001 point bending Methods 0.000 description 3
- 229920005549 butyl rubber Polymers 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- -1 sialon Chemical compound 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000004902 Softening Agent Substances 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000001513 hot isostatic pressing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 239000000075 oxide glass Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000006072 paste Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 150000003097 polyterpenes Chemical class 0.000 description 1
- 229920001289 polyvinyl ether Polymers 0.000 description 1
- 238000001272 pressureless sintering Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000010734 process oil Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Ceramic Products (AREA)
Description
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ãããDETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an adhesive for sheet-shaped non-oxide ceramics and a method for bonding non-oxide ceramics.
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ç±äº€æåšçãžã®å¿çšéçºãé²ããããŠãããConventional technology and its problems Non-oxide ceramics such as silicon nitride and silicon carbide have superior high-temperature strength, corrosion resistance, and wear resistance compared to metals, so they are attracting attention as high-temperature components, and are used in gas turbines. , car engine,
Application development for heat exchangers, etc. is underway.
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äžå¯æ¬ ã§ããã In order for non-oxide ceramics to fully exhibit their excellent functions in the various uses mentioned above, it is necessary to bond these non-oxide ceramics together during the manufacturing process. In particular, it is difficult to mold and process non-oxide ceramic molded bodies into complex shapes, so it is necessary to assemble simple-shaped members into complex shapes, and it is essential to develop adhesive technology for mutually bonding non-oxide ceramic parts. It is.
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ã«ããã®æ¥çã¯æ¥µããŠå°é£ã§ããã However, non-oxide ceramics generally have extremely poor affinity for molten materials, so-called wettability, and unlike oxide ceramics such as alumina and magnesia, they have strong covalent bonds.
Furthermore, since the reactivity to various substances is extremely low, adhesion is extremely difficult.
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ãã Conventionally, non-oxide ceramics have been bonded by interposing an adhesive between the members to be bonded, or by hot pressing at high temperature and pressure without intervening any adhesive. However, the hot press method requires high temperature and pressure, so
Bonding complex or large components is extremely difficult. Similar problems also exist in the hot isostatic pressing method, so-called HIP method, which has recently been in the spotlight.
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ãŠããªãã Therefore, in order to assemble large, complex-shaped members, it is desired to develop an adhesive that can be easily bonded by simply heating without requiring pressure. Conventionally, adhesives for non-oxide ceramics include -A group oxide alone, alumina-silica-alkaline earth metal oxide system, calcium fluoride-kaolin system, or adhesives with a small amount of rare earth oxide added thereto. is used. However, these are all adhesives based on oxide glass, and due to differences in coefficient of thermal expansion with non-oxide ceramics, their adhesive strength is generally low, and the excellent properties of non-oxide ceramic molded products cannot be fully demonstrated. I haven't gotten to the point where I can take advantage of it.
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KgïŒmm2ïŒã«è¿ãæ¥ç匷床ã瀺ããããã匷床ãçŽ
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ãé²æ¢ã®èŠ³ç¹ããæ¹åã®äœå°ãæ®ãããŠããã In view of the current situation, the present inventors have conducted various studies and have completed an adhesive for non-oxide ceramics containing silicon nitride, magnesium oxide, and two or more rare earth oxides as active ingredients ( special request
59-82712). This adhesive has the strength of pressureless sintered products of commercially available non-oxide ceramics (for example, about 53 Kg/mm 2 for silicon nitride and about 50 Kg/mm 2 for silicon carbide).
Kg/mm 2 ), and the strength is approximately
It has excellent performance of maintaining up to 900â. However, since this adhesive is in the form of powder, pellets, or paste, when it is used to join members with complex shapes such as curved surfaces or uneven parts, it is necessary to apply the adhesive to the desired bonding area during work. It is extremely difficult to apply it thickly and uniformly. Therefore, there is still room for improvement in terms of improving workability and preventing variations in adhesive properties.
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ãæäŸãããMeans for Solving the Problems As a result of continued research to further improve the excellent properties of the adhesive for non-oxide ceramics disclosed in Japanese Patent Application No. 59-82712, the inventor discovered that the adhesive When adding a binder component to and forming this into a sheet, the desired thickness of adhesive can be applied uniformly and easily to any bonding site, regardless of the shape of the members to be bonded. It has been found that as a result, variations in adhesive properties are suppressed. That is, the present invention provides an adhesive sheet for non-oxide ceramics, which is formed by uniformly mixing and molding an adhesive component containing silicon nitride, magnesium oxide, and two or more rare earth oxides as active ingredients and a binder. .
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ã®æ¥çæ¹æ³ããæäŸããã The present invention further provides a sheet formed by uniformly mixing and molding an adhesive component containing silicon nitride, magnesium oxide, and two or more rare earth oxides and a binder as active ingredients, and interposing the sheet between the non-oxide ceramics. The present invention also provides a method for bonding non-oxide ceramics, characterized by heating at a temperature of 1400 to 1800° C. in a non-oxidizing atmosphere.
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æ¥çãã¹ãéšæã¯åäžåœ¢ç¶ã§ãç°åœ¢ç¶ã§ãããã Non-oxide ceramics to which the adhesive of the present invention is applied include, for example, silicon nitride, silicon carbide, sialon, aluminum nitride, etc., and can be made by hot pressing, pressureless sintering, reaction sintering, etc. There are no particular limitations on the shape or size, and the members to be bonded may have the same shape or different shapes.
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ãã As silicon nitride, which is an active ingredient in the adhesive sheet of the present invention, any commercially available silicon nitride can be used, and its manufacturing method, particle size, purity, etc. are not particularly limited. Furthermore, not only those in powder form but also those in whisker form can be used. In order to increase adhesive strength, it is desirable to use a material with high purity.
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ãæãŸããã Further, as magnesium oxide, any commercially available magnesium oxide can be used, and its purity and particle size are not particularly limited, but in order to increase adhesive strength, it is desirable to have as high a purity as possible and a particle size as small as possible.
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ãæãŸããã Further, as the rare earth oxide which is another active ingredient of the adhesive sheet of the present invention, it is necessary to use two or more kinds of rare earth oxides. If only one type of rare earth oxide is used, sufficient adhesive strength cannot be obtained because sufficient wettability with respect to non-oxide ceramics cannot be obtained.
The combination of rare earth oxides is not particularly limited, but a combination of yttrium oxide and lanthanum oxide is optimal. The purity and particle size of the rare earth oxide used are not particularly limited, but in order to increase adhesive strength, it is desirable to have as high a purity as possible and a small particle size.
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ãããã Among the active ingredients of the adhesive of the present invention, the blending ratio of silicon nitride and rare earth oxide is 35 to 65 mol% of silicon nitride and 35 to 65 mol% of silicon nitride and rare earth oxide. It is preferable that one of the oxides is yttrium oxide, the content of which is 10 to 35 mol %, and the remainder is at least one other rare earth oxide. especially,
40-55 mol% silicon nitride, yttrium oxide
Very strong adhesive strength can be obtained when the amount is 15 to 30 mol % and the remainder is at least one other rare earth oxide.
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æºè¶³ãã¹ãæ¥çäœçšã¯åŸãããªãã Further, the optimum amount of magnesium oxide to be added is 10 to 80 wt%, based on the above-mentioned mixture of silicon nitride and rare earth oxide. 10wt%
If it is less than 80wt% or more than 80wt%, the adhesive will not wet the non-oxide ceramics sufficiently;
A satisfactory adhesive effect cannot be obtained.
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ãã¿ãã»ãšãã©ãªãããã§ããã The reason why the effective composition range in the present invention is set to the above range is that within this range, the active ingredients of the adhesive will melt and good wetting will be obtained, and since it will contain an appropriate amount of silicon nitride, the adhesive will This is because the coefficient of thermal expansion is close to that of the non-oxide ceramic molded body to be adhered, and there is almost no residual strain in the adhesive layer after bonding.
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åããŠãè¯ãã In the present invention, the binder used to form the adhesive component containing silicon nitride, magnesium oxide, and two or more rare earth oxides as active ingredients into a sheet shape is An elastomer that generates a small amount and does not produce a residue that inhibits adhesion after decomposition is suitable. Such elastomers include ethylene-propylene copolymer, ethylene-propylene copolymer,
Examples include synthetic rubbers such as dienterpolymer, polyisobutylene, polyisoprene, styrene-butadiene copolymer, natural rubbers, and synthetic resins such as ethylene-vinyl acetate copolymer, and one or two of these. Use the above. The molecular weight of the binder is not particularly limited, but in order to maintain good sheet formability, the average molecular weight is preferably about 50,000 to 1,000,000. If necessary, these elastomers may be combined with one or more of alkylphenol-based, coumaron-indene-based, polyterpene-based, rosin-based, petroleum-based, and polyvinyl ether-based resins for the purpose of improving adhesion. Furthermore, a xylene resin, paraffin wax, process oil, abiethyl alcohol, etc. may be added as a softening agent.
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ãæå³ãããã®ãšããã In addition, the binder made of the above elastomer or the elastomer and other combined components should be used at a temperature of 0.1 to 50% at 25°C to prevent the adhesive sheet from cracking due to bending or curving when bonding parts with complex shapes.
It is desirable to select one having an elastic modulus of about Kg/mm 2 , more preferably about 0.5 to 40 Kg/mm 2 . Here, the elastic modulus refers to the tangential modulus expressed by the following formula when a sample is stretched at a speed of 300 mm/min with a chuck distance of 50 mm at a temperature of 25°C.
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ãã Elastic modulus = F/S However, F: Force at the intersection of the point where the sample is stretched 100% and the tangent line (Kg/mm 2 ) S: Cross-sectional area of the sample (mm 2 ) The blending ratio of the binder to the adhesive component is:
While minimizing the effects of gas generation and decomposition residue on adhesive properties during heat bonding, it also provides good sheet formability and a flexible adhesive sheet (elastic modulus).
0.3 to 45 Kg/mm 2 and radius of curvature of 10 mm or less), the latter is approximately 3 to 50 parts by weight per 100 parts by weight of the former.
More preferably, the amount is about 5 to 25 parts by weight. Furthermore, it is preferable that the blending ratio of the binder is determined in consideration of the particle size of the adhesive component (if whiskers are used, their diameter and length). Generally, the larger the particle size of the adhesive component, the more
Although it becomes possible to reduce the amount of binder blended, the wettability of the adhesive on the other side decreases. Therefore, in order to obtain an adhesive sheet with excellent adhesive properties and moldability, when the average particle size of the adhesive component is about 1 to 10 ÎŒm, the amount of binder blended is 10 to 20 parts by weight per 100 parts by weight of the adhesive component. It is best to
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ã€ãŠãè¡ãªãåŸãããšã¯ãèšããŸã§ããªãã The adhesive sheet of the present invention can be manufactured by various methods. For example, after dissolving the binder in an organic solvent such as acetone, toluene, or methyl ethyl ketone, an adhesive component is added and kneaded uniformly. Next, the kneaded product is poured onto a mold covered with release paper, and after the solvent is evaporated, the molded product is passed through rolling rolls and formed into a sheet, film, or other shape. It goes without saying that the shaping can also be carried out by any other method such as extrusion, press rolling, and doctor blasting.
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0.05ã0.3ïœçšåºŠãšãªãæ§ã«ããã°è¯ãã In order to bond non-oxide ceramics using the adhesive sheet of the present invention, the adhesive sheet cut or processed into a predetermined shape is interposed between the surfaces of the non-oxide ceramic members to be bonded. Heating is performed. The thickness of the adhesive sheet is determined appropriately depending on the composition of the adhesive component, heating conditions, shape of the member, etc., but usually the amount of adhesive component applied is about 0.01 to 1 g per 1 cm 2 of adhesive area, or more. Preferably
The amount may be adjusted to about 0.05 to 0.3 g.
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å¹çã®é¢ããã奜ãŸãããªãã In the bonding method of the present invention, the temperature at which the adhesive sheet is heat-treated with the adhesive sheet interposed between the non-oxide ceramic molded members is in the range of 1400 to 1800°C.
If the heating temperature is less than 1400â, the adhesive component will not melt and the adhesive effect will not be exhibited;
If it exceeds the above range, the non-oxide ceramic molded member to be adhered may be deformed or deteriorated, and the active ingredients of the adhesive may also evaporate, which is also undesirable from the standpoint of thermal efficiency.
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ãæãŸããã As the heat treatment atmosphere, a non-oxidizing atmosphere such as a vacuum, an inert gas, or a nitrogen gas is used, and it is particularly preferable to perform the heat treatment in a vacuum or a nitrogen atmosphere.
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確ã§ã¯ãªããã以äžã®åŠãæšå®ããããFunction The reason why the adhesive sheet of the present invention exhibits an excellent adhesive effect is not yet clear, but it is presumed as follows.
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ããé«ãæ¥ç匷床ãåŸããããã®ãšèããããã That is, the adhesive component of the adhesive sheet of the present invention is:
and has a melting point of 1,400 to 1,800°C, so when a non-oxide ceramic molded member with an adhesive sheet interposed is heated to 1,400°C or higher, the adhesive component melts and the surface of the non-oxide ceramic molded member is sufficiently heated. It is thought that some kind of reaction occurs between the non-oxide ceramic molded body parts and the non-oxide ceramic molded body parts are firmly bonded to each other. When the adhesive active ingredient is a combination of magnesium oxide and two or more rare earth oxides, adhesion is possible to some extent by a similar mechanism, but sufficient strength cannot be obtained. From this, by including silicon nitride as an adhesive active ingredient, the coefficient of thermal expansion of the adhesive becomes close to that of the non-oxide ceramic molded member, and as a result, the residual strain in the adhesive layer after bonding is reduced. It is thought that high adhesive strength can be obtained.
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å±€çºæ®ã§ãããEffects of the Invention According to the present invention, large, complex, and irregularly shaped non-oxide ceramic members, which have been difficult to bond using conventional methods, can be easily and strongly bonded to each other. Also,
The adhesive layer formed after adhesion is chemically stable,
Has sufficient heat resistance up to 900â. Furthermore, since the adhesive sheet of the present invention can be rolled to a uniform thickness of approximately 0.05 to 5 mm, the adhesive thickness formed by heat treatment is also constant, and there is little variation in adhesive properties. Furthermore, since the adhesive sheet of the present invention can be cut and deformed, it is also possible to join members with complicated shapes, greatly improving workability. Therefore, non-oxide ceramics can exhibit its excellent functions even further.
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ç·Žããåžžæž©ã§ããŒã«å§å»¶ããåã100ÎŒïœã®æ¬çº
æã®æ¥çå€ã·ãŒããåŸããåŸãããæ¥çå€ã·ãŒã
ã¯ã匟æ§ç3.6KgïŒmm2ãæ²çååŸ0.5mm以äžã§ãã€
ããExample 1 Silicon nitride whiskers (diameter 0.5 to 2 ÎŒm, length 50
~300ÎŒm) 45mol%, yttrium oxide 27.5mol
% and lanthanum oxide 27.5mol%
30 parts by weight of magnesium oxide was added to 100 parts by weight to form an adhesive component. Then the adhesive component
To 100 parts by weight, 20 parts by weight of butyl rubber (molecular weight approximately 250,000) as a binder and 30 parts by weight of toluene as a solvent were added and mixed, and then thoroughly kneaded with rolls heated to approximately 50°C while vaporizing the toluene. , and rolled at room temperature to obtain an adhesive sheet of the present invention having a thickness of 100 Όm. The obtained adhesive sheet had an elastic modulus of 3.6 Kg/mm 2 and a radius of curvature of 0.5 mm or less.
ãã®æ¥çå€ã·ãŒãã10Ã10mm2ã«åæãã10Ã10
Ã15mm3ã®ïŒåã®çªåã±ã€çŽ æ圢äœéã«ã¯ãã¿èŸŒ
ã¿ãçªçŽ é°å²æ°äžã1600âã§ïŒæéå ç±åŠçã
ãã Cut this adhesive sheet into 10 x 10 mm 2 and 10 x 10
It was sandwiched between two silicon nitride molded bodies measuring 15 mm 3 and heat-treated at 1600° C. for 1 hour in a nitrogen atmosphere.
åŸãããæ¥çäœè©ŠæããïŒÃïŒÃ30mm3ã®è§æ£
ãåãåºããã¹ãã³20mmãè·éé床0.5mmïŒmin
ã®æ¡ä»¶äžã«äžç¹æ²ãè©Šéšãè¡ãªã€ãçµæã32.5
KgïŒmm2ã®åŒ·åºŠãåŸãããã A square bar of 3 x 3 x 30 mm was cut out from the obtained adhesive sample, with a span of 20 mm and a loading rate of 0.5 mm/min.
As a result of a three-point bending test under the conditions of 32.5
A strength of Kg/mm 2 was obtained.
å®æœäŸ ïŒ
çªåã±ã€çŽ ç²æ«ïŒå¹³åç²åŸ15ÎŒïœïŒ45molïŒ
ã
é
žåã€ãããªãŠã 27.5molïŒ
åã³é
žåã©ã³ã¿ã³
27.5molïŒ
ãããªãæ··åç²æ«100éééšã«é
žåã
ã°ãã·ãŠã 30éééšãæ·»å æ··åããæ¥çå€æåãš
ãããExample 2 Silicon nitride powder (average particle size 15 ÎŒm) 45 mol%,
Yttrium oxide 27.5mol% and lanthanum oxide
30 parts by weight of magnesium oxide was added to 100 parts by weight of a mixed powder consisting of 27.5 mol % to form an adhesive component.
該æ¥çå€æå100éééšã«ãã€ã³ããŒãšããŠã¢
ã¯ãªã«ãŽã 25éééšåã³æº¶å€ãšããŠãã«ãšã³30é
ééšãå ããå®æœäŸïŒãšåæ§ã®æ¹æ³ã«ãããåã
300ÎŒïœã匟æ§ç2.4KgïŒmm2ãæ²çååŸ0.5mm以äžã®
æ¬çºæã®æ¥çå€ã·ãŒããåŸãã 25 parts by weight of acrylic rubber as a binder and 30 parts by weight of toluene as a solvent were added to 100 parts by weight of the adhesive component, and the thickness was determined by the same method as in Example 1.
An adhesive sheet of the present invention having a diameter of 300 ÎŒm, an elastic modulus of 2.4 Kg/mm 2 and a radius of curvature of 0.5 mm or less was obtained.
ãã®æ¥çå€ã·ãŒããæå®ã®å€§ããã«åæããçª
åã±ã€çŽ æ圢äœéã«ã¯ãã¿èŸŒã¿ãçªçŽ é°å²æ°äžã
1650âã§ïŒæéå ç±åŠçããã This adhesive sheet was cut to a predetermined size, sandwiched between silicon nitride molded bodies, and placed in a nitrogen atmosphere.
Heat treatment was performed at 1650°C for 1 hour.
åŸãããæ¥çäœè©Šæã®äžç¹æ²ã匷床ã¯32.4KgïŒ
mm2ã§ãã€ãã The three-point bending strength of the obtained adhesive sample was 32.4 kg/
It was warm in mm2 .
å®æœäŸ ïŒ
çªåã±ã€çŽ ç²æ«ïŒå¹³åç²åŸ15ÎŒïœïŒ55molïŒ
ã
é
žåã€ãããªã 22.5molïŒ
åã³é
žåã©ã³ã¿ã³
22.5molïŒ
ãããªãæ··åç²æ«100éééšã«ãé
žå
ãã°ãã·ãŠã 20éééšãæ·»å ããç·å¹³åç²åŸçŽïŒ
ã7ÎŒïœã®æ¥çå€æå¹æåãšãããExample 3 Silicon nitride powder (average particle size 15 ÎŒm) 55 mol%,
Ittrim oxide 22.5mol% and lanthanum oxide
20 parts by weight of magnesium oxide was added to 100 parts by weight of mixed powder consisting of 22.5 mol%, and the total average particle size was about 3.
~7ÎŒm adhesive active ingredient.
äžèšæå¹æå100éééšã«ãã€ã³ããŒãšããŠã
ã¿ãžãšã³ãŽã 15éééšåã³æº¶å€ãšããŠãã«ãšã³30
éééšãå ããå
åã«æ··ç·ŽããåŸã50âã§180å
é也ç¥ããåžžæž©ã§ããŒã«å§å»¶ããåãçŽïŒmmã®ã·
ãŒããšããæŽã«åŸãããã·ãŒãããã¬ã¹ã«ãããŠ
åã300ÎŒïœã®æ¬çºæã®æ¥çå€ã·ãŒããåŸãã 100 parts by weight of the above active ingredient, 15 parts by weight of butadiene rubber as a binder and 30 parts by weight of toluene as a solvent.
After adding parts by weight and thoroughly kneading, the adhesive of the present invention was dried at 50°C for 180 minutes, rolled at room temperature to form a sheet with a thickness of about 1 mm, and the obtained sheet was further pressed to have a thickness of 300 Όm. Got a sheet.
äžèšæ¥çå€ã·ãŒãã¯ã匟æ§ç1.4KgïŒmm2ãæ²ç
ååŸ0.5mm以äžã®å€ã瀺ããã The adhesive sheet had an elastic modulus of 1.4 Kg/mm 2 and a radius of curvature of 0.5 mm or less.
ãã®æ¥çå€ã·ãŒããã10Ã10mm2ã«åæãã10Ã
10Ã15mm3ã®çåã±ã€çŽ æ圢äœéã«ã¯ãã¿èŸŒã¿ã
ã¢ã«ãŽã³é°å²æ°äž1700âã§30åéå ç±åŠçããã Cut this adhesive sheet into 10 x 10 mm 2 pieces,
Sandwiched between 10 x 15 mm 3 silicon carbide molded bodies,
Heat treatment was performed at 1700°C for 30 minutes in an argon atmosphere.
åŸãããæ¥çäœè©ŠæãããïŒÃïŒÃ30mm3ã®è§
æ£ãåãåºããã¹ãã³20mmãè·éé床0.5mmïŒ
minã®æ¡ä»¶äžã§äžç¹æ²ãè©Šéšãè¡ãªã€ããšããã
28.5KgïŒmm2ã®åŒ·åºŠãåŸãããã A square bar of 3 x 3 x 30 mm was cut out from the obtained adhesive sample, and the span was 20 mm and the loading speed was 0.5 mm/
When a three-point bending test was conducted under conditions of min.
A strength of 28.5Kg/mm 2 was obtained.
å®æœäŸ ïŒ
çªåã±ã€çŽ ãŠã€ã¹ã«ãŒïŒåŸ0.5ã20ÎŒïœãé·ã50
ã300ÎŒïœïŒ55molïŒ
ãé
žåã€ãããªãŠã 22.5mol
ïŒ
åã³é
žåã©ã³ã¿ã³22.5molïŒ
ã®æ··åç²æ«100é
ééšã«ãé
žåãã°ãã·ãŠã 30éééšãæ·»å ããæ¥
çå€æå¹æåãšãããExample 4 Silicon nitride whiskers (diameter 0.5 to 20 ÎŒm, length 50
~300ÎŒm) 55mol%, yttrium oxide 22.5mol
30 parts by weight of magnesium oxide was added to 100 parts by weight of a mixed powder of 22.5 mol% of lanthanum oxide and 22.5 mol% of lanthanum oxide to form an adhesive active ingredient.
äžèšæå¹æå100éééšã«å¯Ÿãããã€ã³ããŒãš
ããŠããã«ãŽã ïŒéééšåã³æº¶å€ãšããŠãã«ãšã³
30éééšãå ããå
åæ··ç·ŽããåŸããã¯ã¿ãŒãã¬
ãŒãæ³ã«ããåãçŽ50ÎŒïœãæ²çååŸ0.5mm以äžã®
æ¬çºæã®ãã€ã«ã ç¶æ¥çå€çµæç©ãåŸãã For 100 parts by weight of the above active ingredient, 5 parts by weight of butyl rubber as a binder and toluene as a solvent.
After adding 30 parts by weight and thoroughly kneading, a film-like adhesive composition of the present invention having a thickness of about 50 ÎŒm and a radius of curvature of 0.5 mm or less was obtained by a doctor blade method.
ãã®ãã€ã«ã ç¶æ¥çå€ããåªããæ¥çç¹æ§ã瀺
ããã This film adhesive also showed excellent adhesive properties.
Claims (1)
ã®åžåé¡é žåç©ãæå¹æåãšããæ¥çå€æåãšã
ã€ã³ããŒãšãåäžã«æ··åãæ圢ããŠãªãéé žåç©
ã»ã©ããã¯ã¹çšæ¥çå€ã·ãŒãã ïŒ çªåã±ã€çŽ ãé žåãã°ãã·ãŠã åã³ïŒçš®ä»¥äž
ã®åžåé¡é žåç©ãæå¹æåãšããæ¥çå€æåãšã
ã€ã³ããŒãšãåäžã«æ··åãæ圢ããŠãªãã·ãŒãã
éé žåç©ã»ã©ããã¯ã¹çžäºéã«ä»åšãããéé žå
æ§é°å²æ°äž1400ã1800âã®æž©åºŠã§å ç±ããããšã
ç¹åŸŽãšããéé žåç©ã»ã©ããã¯ã¹ã®æ¥çæ¹æ³ã[Scope of Claims] 1. An adhesive sheet for non-oxide ceramics formed by uniformly mixing and molding an adhesive component containing silicon nitride, magnesium oxide, and two or more rare earth oxides as active ingredients and a binder. 2. A sheet formed by uniformly mixing and molding an adhesive component containing silicon nitride, magnesium oxide, and two or more rare earth oxides and a binder as active ingredients is interposed between non-oxide ceramics and placed in a non-oxidizing atmosphere. A method for bonding non-oxide ceramics characterized by heating at a temperature of 1400 to 1800â.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14723485A JPH0240027B2 (en) | 1985-07-04 | 1985-07-04 | HISANKABUTSUSERAMITSUKUSUYOSETSUCHAKUZAISHIITOOYOBI HISANKABUTSUSERAMITSUKUSUYOSETHICHAKUTSUUSERAMITSUKUSUNOSETSUCHAKUHOHO |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14723485A JPH0240027B2 (en) | 1985-07-04 | 1985-07-04 | HISANKABUTSUSERAMITSUKUSUYOSETSUCHAKUZAISHIITOOYOBI HISANKABUTSUSERAMITSUKUSUYOSETHICHAKUTSUUSERAMITSUKUSUNOSETSUCHAKUHOHO |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS627678A JPS627678A (en) | 1987-01-14 |
JPH0240027B2 true JPH0240027B2 (en) | 1990-09-10 |
Family
ID=15425605
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14723485A Expired - Lifetime JPH0240027B2 (en) | 1985-07-04 | 1985-07-04 | HISANKABUTSUSERAMITSUKUSUYOSETSUCHAKUZAISHIITOOYOBI HISANKABUTSUSERAMITSUKUSUYOSETHICHAKUTSUUSERAMITSUKUSUNOSETSUCHAKUHOHO |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0240027B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3627358B2 (en) * | 1996-03-26 | 2005-03-09 | æ ªåŒäŒç€Ÿè±ç°èªåç¹æ© | Single side swash plate compressor |
-
1985
- 1985-07-04 JP JP14723485A patent/JPH0240027B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS627678A (en) | 1987-01-14 |
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