JPH0238742U - - Google Patents

Info

Publication number
JPH0238742U
JPH0238742U JP11811588U JP11811588U JPH0238742U JP H0238742 U JPH0238742 U JP H0238742U JP 11811588 U JP11811588 U JP 11811588U JP 11811588 U JP11811588 U JP 11811588U JP H0238742 U JPH0238742 U JP H0238742U
Authority
JP
Japan
Prior art keywords
substrate
recess
board
connection pads
glass epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11811588U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11811588U priority Critical patent/JPH0238742U/ja
Publication of JPH0238742U publication Critical patent/JPH0238742U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP11811588U 1988-09-07 1988-09-07 Pending JPH0238742U (US06650917-20031118-M00005.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11811588U JPH0238742U (US06650917-20031118-M00005.png) 1988-09-07 1988-09-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11811588U JPH0238742U (US06650917-20031118-M00005.png) 1988-09-07 1988-09-07

Publications (1)

Publication Number Publication Date
JPH0238742U true JPH0238742U (US06650917-20031118-M00005.png) 1990-03-15

Family

ID=31362187

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11811588U Pending JPH0238742U (US06650917-20031118-M00005.png) 1988-09-07 1988-09-07

Country Status (1)

Country Link
JP (1) JPH0238742U (US06650917-20031118-M00005.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0459621U (US06650917-20031118-M00005.png) * 1990-09-29 1992-05-21
JPH05275561A (ja) * 1992-03-25 1993-10-22 Nec Corp リードレスチップキャリア基板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0459621U (US06650917-20031118-M00005.png) * 1990-09-29 1992-05-21
JPH05275561A (ja) * 1992-03-25 1993-10-22 Nec Corp リードレスチップキャリア基板

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