JPH0238733U - - Google Patents
Info
- Publication number
- JPH0238733U JPH0238733U JP1988117494U JP11749488U JPH0238733U JP H0238733 U JPH0238733 U JP H0238733U JP 1988117494 U JP1988117494 U JP 1988117494U JP 11749488 U JP11749488 U JP 11749488U JP H0238733 U JPH0238733 U JP H0238733U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- lead frame
- ground electrode
- semiconductor
- conductive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
-
- H10W72/884—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988117494U JPH0238733U (enExample) | 1988-09-07 | 1988-09-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988117494U JPH0238733U (enExample) | 1988-09-07 | 1988-09-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0238733U true JPH0238733U (enExample) | 1990-03-15 |
Family
ID=31361002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988117494U Pending JPH0238733U (enExample) | 1988-09-07 | 1988-09-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0238733U (enExample) |
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1988
- 1988-09-07 JP JP1988117494U patent/JPH0238733U/ja active Pending