JPH0238472U - - Google Patents
Info
- Publication number
- JPH0238472U JPH0238472U JP11389988U JP11389988U JPH0238472U JP H0238472 U JPH0238472 U JP H0238472U JP 11389988 U JP11389988 U JP 11389988U JP 11389988 U JP11389988 U JP 11389988U JP H0238472 U JPH0238472 U JP H0238472U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- plating solution
- contact
- cathode
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 12
- 239000007788 liquid Substances 0.000 description 2
Landscapes
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11389988U JPH0238472U (is) | 1988-08-30 | 1988-08-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11389988U JPH0238472U (is) | 1988-08-30 | 1988-08-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0238472U true JPH0238472U (is) | 1990-03-14 |
Family
ID=31354157
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11389988U Pending JPH0238472U (is) | 1988-08-30 | 1988-08-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0238472U (is) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04280992A (ja) * | 1991-03-11 | 1992-10-06 | Electroplating Eng Of Japan Co | ウエーハ用メッキ装置 |
-
1988
- 1988-08-30 JP JP11389988U patent/JPH0238472U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04280992A (ja) * | 1991-03-11 | 1992-10-06 | Electroplating Eng Of Japan Co | ウエーハ用メッキ装置 |