JPH0237795A - Reinforcement sheet for flexible printed-wiring board - Google Patents
Reinforcement sheet for flexible printed-wiring boardInfo
- Publication number
- JPH0237795A JPH0237795A JP18769488A JP18769488A JPH0237795A JP H0237795 A JPH0237795 A JP H0237795A JP 18769488 A JP18769488 A JP 18769488A JP 18769488 A JP18769488 A JP 18769488A JP H0237795 A JPH0237795 A JP H0237795A
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- adhesive
- wiring board
- reinforcement sheet
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002787 reinforcement Effects 0.000 title abstract description 6
- 239000012790 adhesive layer Substances 0.000 claims abstract description 12
- 239000003063 flame retardant Substances 0.000 claims abstract description 12
- 229920006267 polyester film Polymers 0.000 claims abstract description 9
- 230000003014 reinforcing effect Effects 0.000 claims description 16
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 abstract description 13
- 230000001070 adhesive effect Effects 0.000 abstract description 13
- 239000012943 hotmelt Substances 0.000 abstract 1
- 230000000717 retained effect Effects 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- QRFTXHFUNIFHST-UHFFFAOYSA-N 4,5,6,7-tetrabromoisoindole-1,3-dione Chemical compound BrC1=C(Br)C(Br)=C2C(=O)NC(=O)C2=C1Br QRFTXHFUNIFHST-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- QHWKHLYUUZGSCW-UHFFFAOYSA-N Tetrabromophthalic anhydride Chemical compound BrC1=C(Br)C(Br)=C2C(=O)OC(=O)C2=C1Br QHWKHLYUUZGSCW-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、ポリエチレンテレフタレート等のポリエステ
ルフィルムを基材の構成フィルムとし、優れな難燃性を
有するフレキシブルプリント配線板用補強板に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a reinforcing plate for a flexible printed wiring board, which uses a polyester film such as polyethylene terephthalate as a base film and has excellent flame retardancy.
（従来の技術及びその課趙）
電卓、キーボード等の電子機器の配線板として軽量で屈
曲性に優れたフレキシブルプリント配線板（ＦＰＣ）が
使用されている。このフレキシブルプリント配線板用の
基材としては、各種樹脂からなるフィルムが使用されて
いるが、難燃化の要求からポリイミドフィルム等の難燃
性樹脂からなるフィルムを使用することがなされている
。また上記フレキシブルプリント配線板のコネクター等
への挿入を容易にするなめに第２図の斜視図で示したよ
うにフレキシブルプリント配線板１の端部に補強板３を
貼り合せることがなされている。(Prior Art and its Problems) Flexible printed wiring boards (FPC), which are lightweight and have excellent flexibility, are used as wiring boards for electronic devices such as calculators and keyboards. Films made of various resins are used as base materials for flexible printed wiring boards, but films made of flame-retardant resins such as polyimide films are being used due to the demand for flame retardancy. Further, in order to facilitate the insertion of the flexible printed wiring board into a connector or the like, a reinforcing plate 3 is bonded to the end of the flexible printed wiring board 1, as shown in the perspective view of FIG.
通常、このような精強板３としては、難燃性の付与やそ
の強度を増すなめに、肉厚の厚いポリイミド樹脂フィル
ムやエポキシ樹脂含浸ガラス布等が使用されている。Normally, a thick polyimide resin film, an epoxy resin-impregnated glass cloth, or the like is used as such a reinforced plate 3 in order to impart flame retardancy and increase its strength.
しかしながら、上記のフィルムでは、使用する樹脂によ
っては難燃性が得られず、また肉厚が厚いなめにコスト
がかかることや、薄くすると所定の強度が得られにくい
欠点がある。However, the above-mentioned films have the disadvantage that flame retardancy cannot be obtained depending on the resin used, that they are expensive due to their thick walls, and that it is difficult to obtain the desired strength when they are thin.
本発明は肉厚を厚くせずに強度を保持し、かつ優れた難
燃性を有するフレキシブルプリント配線板用補強板を提
供することを目的としている。An object of the present invention is to provide a reinforcing plate for a flexible printed wiring board that maintains strength without increasing the wall thickness and has excellent flame retardancy.
（課萌を解決するための手段）
上記目的を達成するなめに、本発明のフレキシブルプリ
ント配線板用補強板では特定の難燃剤層をポリエステル
フィルム間に介在させたものであって、その要旨とする
ところは、補強板３を、ポリエステルフィルム３１．３
１間に粉体状難燃剤を含有した接着剤層３２を介在させ
た積層フィルムから形成することにある。(Means for solving problems) In order to achieve the above object, the reinforcing board for flexible printed wiring boards of the present invention has a specific flame retardant layer interposed between polyester films. The reinforcing plate 3 is replaced with a polyester film 31.3.
The present invention is to form a laminated film having an adhesive layer 32 containing a powdered flame retardant interposed therebetween.
以下、本発明を図面により説明する。Hereinafter, the present invention will be explained with reference to the drawings.
第１図は、本発明のフレキシブルプリント配線板用補強
板の使用状態を示す断面概略図である。第１図の例では
フレキシブルプリント配線板１の端部に補強板３が接着
剤層２を介して貼り合せてあり、この補強板３をポリエ
ステルフィルム３１．３１間に粉体状難燃剤を含有した
接着剤層３２を介在させた積層フィルムとしたものであ
る。補強板３を貼り合せるための接着剤層２に使用する
接着剤としてはホットメルト型接着剤や反応硬化型接着
剤等の通常の接着剤が使用できる。FIG. 1 is a schematic cross-sectional view showing how the reinforcing plate for a flexible printed wiring board of the present invention is used. In the example shown in FIG. 1, a reinforcing plate 3 is bonded to the end of a flexible printed wiring board 1 via an adhesive layer 2, and this reinforcing plate 3 is sandwiched between polyester films 31 and 31 containing a powdered flame retardant. This is a laminated film with an adhesive layer 32 interposed therebetween. As the adhesive used for the adhesive layer 2 for bonding the reinforcing plate 3, a conventional adhesive such as a hot melt adhesive or a reaction curing adhesive can be used.
上記積層フィルムにおいて、ポリエステルフィルム３１
としては通常の無延伸、延伸フィルムが使用でき、厚み
は３８〜１１００Ａ１の範囲のものが好適に使用できる
。In the above laminated film, the polyester film 31
As the film, ordinary unstretched or stretched films can be used, and those having a thickness in the range of 38 to 1100 A1 can be suitably used.
接着剤層３２には粉体状難燃剤を６０〜４００重量％程
度含有したものを使用すればよく、接着剤としては、無
溶剤ホットメルト型接着剤や反応硬化型接着剤が好適に
使用でき、エポキシ系、ウレタン系、ポリエステル系、
エチレン−酢酸ビニル系等各種組成のものが使用できる
。The adhesive layer 32 may contain about 60 to 400% by weight of a powdered flame retardant, and as the adhesive, a solvent-free hot melt adhesive or a reaction curing adhesive can be suitably used. , epoxy, urethane, polyester,
Various compositions such as ethylene-vinyl acetate can be used.
粉体状難燃剤としては、テトラブロモフタルイミド、テ
トラブロモ無水フタル酸、デカブロモジフェニルエーテ
ル等のハロゲン含有有機化合物や三酸化アンチモン、水
酸化アルミニウム等の無機化合物等が挙げられ、適宜組
合せて使用できる。ここで液状難燃剤等の粉体状以外の
難燃剤を使用すると、接着剤の眉間接着力を低下させ易
く不都合である。また粉体状難燃剤の含有率が６０重量
％未満では難燃性の向上がみられず、４００重量％を越
すものでは接着剤の特性ご阻害し易いという間組がある
。Examples of the powder flame retardant include halogen-containing organic compounds such as tetrabromophthalimide, tetrabromo phthalic anhydride, and decabromodiphenyl ether, and inorganic compounds such as antimony trioxide and aluminum hydroxide, which can be used in appropriate combinations. If a flame retardant other than powder, such as a liquid flame retardant, is used here, it is disadvantageous because it tends to reduce the glabella adhesive strength of the adhesive. Further, if the content of the powdered flame retardant is less than 60% by weight, no improvement in flame retardancy is observed, and if it exceeds 400% by weight, the properties of the adhesive are likely to be impaired.
上記積層フィルムの厚み構成は、必要とする難燃性に応
じて、上記接着剤層の厚み比率を変えればよく、通常、
接着剤層の厚みはプラスチックフィルムの総厚みに対し
、２０％乃至同等の範囲とすればよく、この厚みが２０
％未満では難燃性が不十分であり、同等を越えるもので
は接着剤をフィルム上に塗布することが困難になり易い
。The thickness structure of the laminated film can be determined by changing the thickness ratio of the adhesive layer depending on the flame retardance required.
The thickness of the adhesive layer may be within a range of 20% or equivalent to the total thickness of the plastic film;
If it is less than %, the flame retardance will be insufficient, and if it is more than the same, it will be difficult to apply the adhesive onto the film.
上記内容の積層フィルムを使用することにより優れた難
燃性を有し強度に優れた補強板が得られ、また強度に優
れたポリエステルフィルムを使用し、肉厚を薄くできる
ために低コストのものが得られる。By using the above laminated film, a reinforcing plate with excellent flame retardancy and excellent strength can be obtained, and it is also low cost because it uses a polyester film with excellent strength and can be made thinner. is obtained.
（発 明 の 効 果）
上述したように本発明のフレキシブルプリント配線板用
補強板によれば、肉厚が薄くて強度に優れ、かつ難燃性
に優れているという利点を有している。(Effects of the Invention) As described above, the reinforcing plate for a flexible printed wiring board of the present invention has the advantage of being thin, having excellent strength, and having excellent flame retardancy.
第１図は本発明のフレキシブルプリント配線板用補強板
の使用状態を示す断面概略図、第２図は本発明のフレキ
シブルプリント配線板用補強板の使用状態を示す斜視図
である。
１・・・・・・フレキシブルプリント配線板３・・・・
・・補強板FIG. 1 is a schematic cross-sectional view showing how the reinforcing plate for a flexible printed wiring board of the present invention is used, and FIG. 2 is a perspective view showing how the reinforcing plate for a flexible printed wiring board of the present invention is used. 1...Flexible printed wiring board 3...
・Reinforcement plate
Claims (1)
る補強板（３）において、当該補強板（３）を、ポリエ
ステルフィルム（３１）、（３１）間に粉体状難燃剤を
含有した接着剤層（３２）を介在させた積層フィルムか
ら形成することを特徴とするフレキシブルプリント配線
板用補強板。In the reinforcing plate (3) to be bonded to a part of the flexible printed wiring board (1), the reinforcing plate (3) is bonded to a polyester film (31), an adhesive layer containing a powdery flame retardant between (31). A reinforcing plate for a flexible printed wiring board, characterized in that it is formed from a laminated film in which (32) is interposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18769488A JPH0237795A (en) | 1988-07-27 | 1988-07-27 | Reinforcement sheet for flexible printed-wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18769488A JPH0237795A (en) | 1988-07-27 | 1988-07-27 | Reinforcement sheet for flexible printed-wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0237795A true JPH0237795A (en) | 1990-02-07 |
Family
ID=16210516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18769488A Pending JPH0237795A (en) | 1988-07-27 | 1988-07-27 | Reinforcement sheet for flexible printed-wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0237795A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02205093A (en) * | 1989-02-02 | 1990-08-14 | Sumitomo Electric Ind Ltd | Flexible printed wiring board |
| EP0675673A2 (en) * | 1994-03-30 | 1995-10-04 | Nitto Denko Corporation | Reinforcement for flexible printed circuit board and reinforced flexible circuit board |
| JP2007109950A (en) * | 2005-10-14 | 2007-04-26 | Bridgestone Corp | Reinforcing plate with adhesive and flexible printed board |
| US8173828B2 (en) | 2005-12-14 | 2012-05-08 | Exxonmobil Chemical Patents Inc. | Halogen substituted heteroatom-containing metallocene compounds for olefin polymerization |
| EP3336611A1 (en) | 2016-12-19 | 2018-06-20 | Canon Kabushiki Kaisha | Electrophotographic belt and electrophotographic image forming apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62240545A (en) * | 1986-04-11 | 1987-10-21 | 三菱樹脂株式会社 | Flame-retardant laminated film |
-
1988
- 1988-07-27 JP JP18769488A patent/JPH0237795A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62240545A (en) * | 1986-04-11 | 1987-10-21 | 三菱樹脂株式会社 | Flame-retardant laminated film |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02205093A (en) * | 1989-02-02 | 1990-08-14 | Sumitomo Electric Ind Ltd | Flexible printed wiring board |
| EP0675673A2 (en) * | 1994-03-30 | 1995-10-04 | Nitto Denko Corporation | Reinforcement for flexible printed circuit board and reinforced flexible circuit board |
| EP0675673A3 (en) * | 1994-03-30 | 1997-03-05 | Nitto Denko Corp | Reinforcement for flexible printed circuit board and reinforced flexible circuit board. |
| JP2007109950A (en) * | 2005-10-14 | 2007-04-26 | Bridgestone Corp | Reinforcing plate with adhesive and flexible printed board |
| US8173828B2 (en) | 2005-12-14 | 2012-05-08 | Exxonmobil Chemical Patents Inc. | Halogen substituted heteroatom-containing metallocene compounds for olefin polymerization |
| US8546595B2 (en) | 2005-12-14 | 2013-10-01 | Exxonmobil Chemical Patents Inc. | Halogen substituted heteroatom-containing metallocene compounds for olefin polymerization |
| EP3336611A1 (en) | 2016-12-19 | 2018-06-20 | Canon Kabushiki Kaisha | Electrophotographic belt and electrophotographic image forming apparatus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4997702A (en) | Shape retaining flexible electrical circuit | |
| US5785789A (en) | Low dielectric constant microsphere filled layers for multilayer electrical structures | |
| JPH0860108A (en) | Adhesive sheet and flat cable | |
| KR940701633A (en) | Printed wire boards and manufacturing method thereof | |
| JPH0237795A (en) | Reinforcement sheet for flexible printed-wiring board | |
| US5194307A (en) | High performance epoxy based coverlay and bond fly adhesive with heat activated cure mechanism | |
| DK0795398T3 (en) | Foil for coating post-processable substrates | |
| US5095077A (en) | High performance epoxy based coverlay and bond ply adhesive with heat activated cure mechanism using polyester-aziridine reaction products | |
| US4486505A (en) | Flame-retarded copper clad laminates | |
| JP2600300B2 (en) | Flame retardant adhesive tape | |
| JPH02301186A (en) | Flexible printed wiring board and cover lay film | |
| CN214727092U (en) | High-reflectivity reinforcing plate | |
| JPH027315A (en) | Fire retardant membrane switch | |
| CA2004131C (en) | A high performance epoxy based coverlay and bond ply adhesive with heat activated cure mechanism | |
| CN210157451U (en) | High-density flexible multilayer electronic circuit board structure | |
| JPS5943747Y2 (en) | Flexible printed wiring board | |
| JPH1083721A (en) | Covering material for flat cable and flat cable using it | |
| JPH02120039A (en) | Highly heat-conductive board | |
| JPH037791A (en) | Adhesive composition for sticking foil | |
| JPH03210377A (en) | Adhesive sheet | |
| JP3392285B2 (en) | Flame retardant thermoplastic adhesive for insulation tape | |
| JPH08143846A (en) | Flame-retardant adhesive | |
| JPH03197043A (en) | Preparation of flame-retardant composite film | |
| JPS588773A (en) | Adhesive composition | |
| JPS59156746A (en) | Colored film for illumination |