JPH0236053U - - Google Patents
Info
- Publication number
- JPH0236053U JPH0236053U JP1988116058U JP11605888U JPH0236053U JP H0236053 U JPH0236053 U JP H0236053U JP 1988116058 U JP1988116058 U JP 1988116058U JP 11605888 U JP11605888 U JP 11605888U JP H0236053 U JPH0236053 U JP H0236053U
- Authority
- JP
- Japan
- Prior art keywords
- width
- inner lead
- ceramic package
- lead
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 239000008188 pellet Substances 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/494—Connecting portions
- H01L2224/4943—Connecting portions the connecting portions being staggered
- H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988116058U JPH0236053U (US06229276-20010508-P00022.png) | 1988-09-02 | 1988-09-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988116058U JPH0236053U (US06229276-20010508-P00022.png) | 1988-09-02 | 1988-09-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0236053U true JPH0236053U (US06229276-20010508-P00022.png) | 1990-03-08 |
Family
ID=31358268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988116058U Pending JPH0236053U (US06229276-20010508-P00022.png) | 1988-09-02 | 1988-09-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0236053U (US06229276-20010508-P00022.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946201A (zh) * | 2017-12-19 | 2018-04-20 | 哈尔滨工业大学 | 一种基于局域电沉积的引线键合焊点结构的制备方法 |
| CN108054108A (zh) * | 2017-12-19 | 2018-05-18 | 哈尔滨工业大学 | 一种基于快速局域电沉积的引线键合方法 |
-
1988
- 1988-09-02 JP JP1988116058U patent/JPH0236053U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946201A (zh) * | 2017-12-19 | 2018-04-20 | 哈尔滨工业大学 | 一种基于局域电沉积的引线键合焊点结构的制备方法 |
| CN108054108A (zh) * | 2017-12-19 | 2018-05-18 | 哈尔滨工业大学 | 一种基于快速局域电沉积的引线键合方法 |
