JPH0235668U - - Google Patents
Info
- Publication number
- JPH0235668U JPH0235668U JP11403788U JP11403788U JPH0235668U JP H0235668 U JPH0235668 U JP H0235668U JP 11403788 U JP11403788 U JP 11403788U JP 11403788 U JP11403788 U JP 11403788U JP H0235668 U JPH0235668 U JP H0235668U
- Authority
- JP
- Japan
- Prior art keywords
- tool
- micro
- view
- hole machining
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003754 machining Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 5
- 238000005553 drilling Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Description
第１図は本考案の一実施例に係る微細孔加工用
工具の先端部の斜視図、第２図は一実施例に係る
工具による微細孔加工状態の正面図、第３図は一
実施例に係る工具の製作過程の斜視図、第４図は
製作途中の工具の正面図、第５図は製作途中の工
具を用いて穿孔加工したときに生ずるクラツクを
示す斜視図、第６図は製作終了後の実施例工具の
正面図、第７図ないし第１０図はいずれも突起コ
ーナ部の丸め方法を示す説明図、第１１図ないし
第１３図はいずれも従来の微小穴加工方法の説明
図である。
図面中、１……微細孔加工用工具、２……工具
先端の突起、３……超音波発振器、４……超音波
振動子、５……ノズル、６……粒子、７……被加
工物、８……ワイヤカツト用ワイヤ、９……粒子
、１０……電極、１１……直流電源、１２……電
解液、１３……振動、１４……レーザ光、１５…
…細線、１６……工具、１７……微細孔、１８…
…クラツク。
FIG. 1 is a perspective view of the tip of a tool for micro-hole machining according to an embodiment of the present invention, FIG. 2 is a front view of a micro-hole machining state using the tool according to an embodiment, and FIG. 3 is an embodiment of the present invention. Figure 4 is a front view of the tool in the process of being manufactured, Figure 5 is a perspective view showing cracks that occur when drilling using the tool in the process of manufacturing, and Figure 6 is the process of manufacturing the tool. The front view of the example tool after completion, FIGS. 7 to 10 are all explanatory views showing the method of rounding the protrusion corner, and FIGS. 11 to 13 are all explanatory views of the conventional microhole drilling method. It is. In the drawings, 1... tool for micro-hole machining, 2... protrusion at the tip of the tool, 3... ultrasonic oscillator, 4... ultrasonic vibrator, 5... nozzle, 6... particle, 7... workpiece Object, 8... Wire for wire cutting, 9... Particle, 10... Electrode, 11... DC power supply, 12... Electrolyte, 13... Vibration, 14... Laser light, 15...
...Thin wire, 16...Tool, 17...Minute hole, 18...
…Kratsk.
Claims (1)
を形成し、各突起のコーナ部に丸みを付けたこと
を特徴とする脆性材料の微細孔加工用工具。 A tool for micro-hole machining in brittle materials, characterized by making vertical and horizontal cuts in the tip of the tool to form a large number of protrusions, and rounding the corners of each protrusion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11403788U JPH0235668U (en) | 1988-09-01 | 1988-09-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11403788U JPH0235668U (en) | 1988-09-01 | 1988-09-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0235668U true JPH0235668U (en) | 1990-03-07 |
Family
ID=31354418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11403788U Pending JPH0235668U (en) | 1988-09-01 | 1988-09-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0235668U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010150350A1 (en) * | 2009-06-23 | 2010-12-29 | 東芝三菱電機産業システム株式会社 | Ultrasonic bonding tool, method for manufacturing ultrasonic bonding tool, ultrasonic bonding method, and ultrasonic bonding apparatus |
-
1988
- 1988-09-01 JP JP11403788U patent/JPH0235668U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010150350A1 (en) * | 2009-06-23 | 2010-12-29 | 東芝三菱電機産業システム株式会社 | Ultrasonic bonding tool, method for manufacturing ultrasonic bonding tool, ultrasonic bonding method, and ultrasonic bonding apparatus |
| CN102802817A (en) * | 2009-06-23 | 2012-11-28 | 东芝三菱电机产业系统株式会社 | Ultrasonic bonding tool, method for manufacturing ultrasonic bonding tool, ultrasonic bonding method, and ultrasonic bonding apparatus |
| JP5303643B2 (en) * | 2009-06-23 | 2013-10-02 | 東芝三菱電機産業システム株式会社 | Ultrasonic bonding tool, method for manufacturing ultrasonic bonding tool, ultrasonic bonding method, and ultrasonic bonding apparatus |
| CN102802817B (en) * | 2009-06-23 | 2015-03-11 | 东芝三菱电机产业系统株式会社 | Ultrasonic bonding tool, method for manufacturing ultrasonic bonding tool, ultrasonic bonding method, and ultrasonic bonding apparatus |
| US10864597B2 (en) | 2009-06-23 | 2020-12-15 | Toshiba Mitsubishi-Electric Industrial Systems Corporation | Ultrasonic bonding tool, method for manufacturing ultrasonic bonding tool, ultrasonic bonding method, and ultrasonic bonding apparatus |
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