JPH042594U - - Google Patents
Info
- Publication number
- JPH042594U JPH042594U JP4214990U JP4214990U JPH042594U JP H042594 U JPH042594 U JP H042594U JP 4214990 U JP4214990 U JP 4214990U JP 4214990 U JP4214990 U JP 4214990U JP H042594 U JPH042594 U JP H042594U
- Authority
- JP
- Japan
- Prior art keywords
- cutting tool
- presser portion
- cut
- cut workpiece
- teing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001105 regulatory effect Effects 0.000 claims 1
Landscapes
- Nonmetal Cutting Devices (AREA)
Description
第１図は本考案に係るＸ−Ｙプロツタにおける
カツテイングツールの一実施例を示す一部切欠き
正面図、第２図はその要部拡大断面図、第３図は
その底面図、第４図はＸ−Ｙプロツタを示す概略
平面図、第５図は従来のカツテイングツールを示
す正面図である。
１１……被カツト部材、１５……キヤリツジヘ
ツド、２２……カツト刃、２５……ベアリング。
Fig. 1 is a partially cutaway front view showing an embodiment of the cutting tool for an X-Y plotter according to the present invention, Fig. 2 is an enlarged cross-sectional view of the main part thereof, Fig. 3 is a bottom view thereof, and Fig. 4 The figure is a schematic plan view showing an X-Y plotter, and FIG. 5 is a front view showing a conventional cutting tool. 11... Member to be cut, 15... Carriage head, 22... Cutting blade, 25... Bearing.
Claims (1)
相対移動して前記被カツト部材をカツトするカツ
テイングツールを装着したＸ−Ｙプロツタにあつ
て、カツト刃と、前記被カツト部材に押接して前
記カツト刃の切り込み深さを規制する押え部とを
備えたカツテイングツールにおいて、前記押え部
を前記被カツト部材に対して接触可能な突起で形
成したことを特徴とするＸ−Ｙプロツタにおける
カツテイングツール。 In an X-Y plotter equipped with a cutting tool that cuts the to-be-cut workpiece by moving relative to the to-be-cut workpiece in the X direction and the Y direction, A cutting tool equipped with a presser portion for regulating the cutting depth of the cutter blade, wherein the presser portion is formed of a protrusion that can come into contact with the cut member. Teing tools.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990042149U JP2500215Y2 (en) | 1990-04-20 | 1990-04-20 | Cutting tool for XY plotter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990042149U JP2500215Y2 (en) | 1990-04-20 | 1990-04-20 | Cutting tool for XY plotter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH042594U true JPH042594U (en) | 1992-01-10 |
| JP2500215Y2 JP2500215Y2 (en) | 1996-06-05 |
Family
ID=31553435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990042149U Expired - Fee Related JP2500215Y2 (en) | 1990-04-20 | 1990-04-20 | Cutting tool for XY plotter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2500215Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010005781A (en) * | 2008-05-28 | 2010-01-14 | Shin Etsu Polymer Co Ltd | Cutter for support tape of semiconductor wafer |
| JP2014108464A (en) * | 2012-11-30 | 2014-06-12 | Brother Ind Ltd | Cutter cartridge and cutting device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61141092U (en) * | 1985-02-22 | 1986-09-01 | ||
| JPS61214997A (en) * | 1985-03-15 | 1986-09-24 | 株式会社 写研 | Method of adjusting edge of cutter for cutting laminated sheet |
| JPS632691A (en) * | 1986-06-20 | 1988-01-07 | 日本電子株式会社 | Cutter for drawing device |
-
1990
- 1990-04-20 JP JP1990042149U patent/JP2500215Y2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61141092U (en) * | 1985-02-22 | 1986-09-01 | ||
| JPS61214997A (en) * | 1985-03-15 | 1986-09-24 | 株式会社 写研 | Method of adjusting edge of cutter for cutting laminated sheet |
| JPS632691A (en) * | 1986-06-20 | 1988-01-07 | 日本電子株式会社 | Cutter for drawing device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010005781A (en) * | 2008-05-28 | 2010-01-14 | Shin Etsu Polymer Co Ltd | Cutter for support tape of semiconductor wafer |
| JP2014108464A (en) * | 2012-11-30 | 2014-06-12 | Brother Ind Ltd | Cutter cartridge and cutting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2500215Y2 (en) | 1996-06-05 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |