JPH0235668U - - Google Patents
Info
- Publication number
- JPH0235668U JPH0235668U JP11403788U JP11403788U JPH0235668U JP H0235668 U JPH0235668 U JP H0235668U JP 11403788 U JP11403788 U JP 11403788U JP 11403788 U JP11403788 U JP 11403788U JP H0235668 U JPH0235668 U JP H0235668U
- Authority
- JP
- Japan
- Prior art keywords
- tool
- micro
- view
- hole machining
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003754 machining Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 5
- 238000005553 drilling Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11403788U JPH0235668U (de) | 1988-09-01 | 1988-09-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11403788U JPH0235668U (de) | 1988-09-01 | 1988-09-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0235668U true JPH0235668U (de) | 1990-03-07 |
Family
ID=31354418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11403788U Pending JPH0235668U (de) | 1988-09-01 | 1988-09-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0235668U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010150350A1 (ja) * | 2009-06-23 | 2010-12-29 | 東芝三菱電機産業システム株式会社 | 超音波接合用ツール、超音波接合用ツールの製造方法、超音波接合方法及び超音波接合装置 |
-
1988
- 1988-09-01 JP JP11403788U patent/JPH0235668U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010150350A1 (ja) * | 2009-06-23 | 2010-12-29 | 東芝三菱電機産業システム株式会社 | 超音波接合用ツール、超音波接合用ツールの製造方法、超音波接合方法及び超音波接合装置 |
| CN102802817A (zh) * | 2009-06-23 | 2012-11-28 | 东芝三菱电机产业系统株式会社 | 超声波接合用工具、超声波接合用工具的制造方法、超声波接合方法及超声波接合装置 |
| JP5303643B2 (ja) * | 2009-06-23 | 2013-10-02 | 東芝三菱電機産業システム株式会社 | 超音波接合用ツール、超音波接合用ツールの製造方法、超音波接合方法及び超音波接合装置 |
| CN102802817B (zh) * | 2009-06-23 | 2015-03-11 | 东芝三菱电机产业系统株式会社 | 超声波接合用工具、超声波接合用工具的制造方法、超声波接合方法及超声波接合装置 |
| US10864597B2 (en) | 2009-06-23 | 2020-12-15 | Toshiba Mitsubishi-Electric Industrial Systems Corporation | Ultrasonic bonding tool, method for manufacturing ultrasonic bonding tool, ultrasonic bonding method, and ultrasonic bonding apparatus |