JPH0235464U - - Google Patents
Info
- Publication number
- JPH0235464U JPH0235464U JP11484688U JP11484688U JPH0235464U JP H0235464 U JPH0235464 U JP H0235464U JP 11484688 U JP11484688 U JP 11484688U JP 11484688 U JP11484688 U JP 11484688U JP H0235464 U JPH0235464 U JP H0235464U
- Authority
- JP
- Japan
- Prior art keywords
- laminated
- dielectric film
- aluminum plate
- circuit board
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
Landscapes
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11484688U JPH0235464U (fr) | 1988-08-30 | 1988-08-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11484688U JPH0235464U (fr) | 1988-08-30 | 1988-08-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0235464U true JPH0235464U (fr) | 1990-03-07 |
Family
ID=31355965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11484688U Pending JPH0235464U (fr) | 1988-08-30 | 1988-08-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0235464U (fr) |
-
1988
- 1988-08-30 JP JP11484688U patent/JPH0235464U/ja active Pending