JPH0235453U - - Google Patents
Info
- Publication number
- JPH0235453U JPH0235453U JP11473788U JP11473788U JPH0235453U JP H0235453 U JPH0235453 U JP H0235453U JP 11473788 U JP11473788 U JP 11473788U JP 11473788 U JP11473788 U JP 11473788U JP H0235453 U JPH0235453 U JP H0235453U
- Authority
- JP
- Japan
- Prior art keywords
- gate electrode
- ceramic substrate
- electrode
- thermally conductive
- conductive ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000000605 extraction Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11473788U JPH0514519Y2 (US07655688-20100202-C00086.png) | 1988-08-30 | 1988-08-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11473788U JPH0514519Y2 (US07655688-20100202-C00086.png) | 1988-08-30 | 1988-08-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0235453U true JPH0235453U (US07655688-20100202-C00086.png) | 1990-03-07 |
| JPH0514519Y2 JPH0514519Y2 (US07655688-20100202-C00086.png) | 1993-04-19 |
Family
ID=31355761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11473788U Expired - Lifetime JPH0514519Y2 (US07655688-20100202-C00086.png) | 1988-08-30 | 1988-08-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0514519Y2 (US07655688-20100202-C00086.png) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003511864A (ja) * | 1999-10-09 | 2003-03-25 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 電力半導体モジュール |
| JP2006093679A (ja) * | 2004-08-24 | 2006-04-06 | Sony Corp | 半導体パッケージ |
| JP2010103231A (ja) * | 2008-10-22 | 2010-05-06 | Denso Corp | 電子装置 |
| JP2016021558A (ja) * | 2014-06-19 | 2016-02-04 | パナソニックＩｐマネジメント株式会社 | 電子装置およびその製造方法 |
-
1988
- 1988-08-30 JP JP11473788U patent/JPH0514519Y2/ja not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003511864A (ja) * | 1999-10-09 | 2003-03-25 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 電力半導体モジュール |
| JP2006093679A (ja) * | 2004-08-24 | 2006-04-06 | Sony Corp | 半導体パッケージ |
| JP4626445B2 (ja) * | 2004-08-24 | 2011-02-09 | ソニー株式会社 | 半導体パッケージの製造方法 |
| JP2010103231A (ja) * | 2008-10-22 | 2010-05-06 | Denso Corp | 電子装置 |
| JP2016021558A (ja) * | 2014-06-19 | 2016-02-04 | パナソニックＩｐマネジメント株式会社 | 電子装置およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0514519Y2 (US07655688-20100202-C00086.png) | 1993-04-19 |
