JPH0234277B2 - - Google Patents
Info
- Publication number
- JPH0234277B2 JPH0234277B2 JP59142817A JP14281784A JPH0234277B2 JP H0234277 B2 JPH0234277 B2 JP H0234277B2 JP 59142817 A JP59142817 A JP 59142817A JP 14281784 A JP14281784 A JP 14281784A JP H0234277 B2 JPH0234277 B2 JP H0234277B2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- laser
- slit
- laser beam
- hole drilling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004744 fabric Substances 0.000 claims description 24
- 238000005553 drilling Methods 0.000 claims description 12
- 239000002994 raw material Substances 0.000 description 4
- 102100025490 Slit homolog 1 protein Human genes 0.000 description 3
- 101710123186 Slit homolog 1 protein Proteins 0.000 description 3
- 239000003818 cinder Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 235000019504 cigarettes Nutrition 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
- B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Description
【発明の詳細な説明】
この発明は、パルスレーザビームを用いて長尺
な帯状の被加工物に所定間隔毎に連続して開孔を
設けるためのレーザ開孔装置に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laser hole drilling device for continuously forming holes at predetermined intervals in a long strip-shaped workpiece using a pulsed laser beam.
従来この種の装置として第1図、第2図に示す
ものがあつた。 Conventionally, there have been devices of this type as shown in FIGS. 1 and 2.
第1図は従来装置の平面図、第2図は正面断面
図であり、図において、1はパルス状のレーザビ
ームを出力するパルスレーザ発振器、2はパルス
レーザ発振器1からのレーザビームを反射させる
反射鏡、3は反射鏡2からのレーザビームを集束
させる集光レンズ、4は保持筒、5は保持筒4内
へ加工ガスを供給する加工ガス導入口、6はノズ
ル、7は紙等を長尺な帯状の被加工物(以下原反
と称する)、8は原反7を連続送り駆動させる送
り装置(図示せず)により回転させられるテンシ
ヨンローラ、9は原反7をガイドする受光台、1
0は受光台9に原反7の走行方向と直角に設けら
れたスリツトであり、集光レンズ3の原反7への
レーザビーム集光照射位置に設けられている。1
1は排気口であり、受光台9内部からスリツト1
0を介して原反7を吸引している。 Fig. 1 is a plan view of a conventional device, and Fig. 2 is a front cross-sectional view. A reflecting mirror, 3 a condensing lens for focusing the laser beam from the reflecting mirror 2, 4 a holding cylinder, 5 a processing gas inlet for supplying processing gas into the holding cylinder 4, 6 a nozzle, 7 a paper etc. A long strip-shaped workpiece (hereinafter referred to as the original fabric); 8 is a tension roller rotated by a feeding device (not shown) that continuously drives the original fabric 7; 9 is a light receiving device that guides the original fabric 7; stand, 1
0 is a slit provided in the light receiving table 9 at a right angle to the running direction of the original fabric 7, and is provided at a position where the condensing lens 3 condenses and irradiates the laser beam onto the original fabric 7. 1
1 is an exhaust port, which connects the slit 1 from inside the light receiving table 9.
The original fabric 7 is sucked through the
次に、このように構成された従来装置の動作に
ついて説明する。先ず、パルスレーザ発振器1よ
り出力されたパルス状のレーザビームは反射鏡2
により下向に反射され、集光レンズ3へ導かれ
る。集光レンズ3においてレーザビームは集束さ
れ、丁度原反7の開孔位置、即ちスリツト10の
上部付近で焦点を結ぶようになつている。一方、
原反7はテンシヨンローラ8間で、受光台9の上
を矢印Aの方向に走行している。なお、スリツト
10は集束レーザ光及び開孔後の原反7の燃えカ
スが容易に通過できるように設けられており、原
反7の走行方向と直角な方向に巾10〜20mm程度の
寸法で設けられている。また、受光台9の内部を
排気口11より吸引することにより、スリツト1
0を介して原反7を受光台9に吸いつけて、テン
シヨンローラ8間の原反7の開孔部における安定
走行を確保している。さらに、原反7の開孔部の
上部に於ては、集光レンズ3を原反7の燃えカス
等から保護する目的で、保持筒4における集光レ
ンズ3の下部に加工ガス導入口5が設けられ、ノ
ズル6よりレーザ光と同軸上に乾燥空気を噴出す
るようになつている。従つて、集光レンズ3によ
り集束されたパルス状レーザビームにより原反7
に開孔を連続的に形成できることになる。 Next, the operation of the conventional device configured as described above will be explained. First, a pulsed laser beam outputted from a pulsed laser oscillator 1 passes through a reflecting mirror 2.
The light is reflected downward and guided to the condenser lens 3. The laser beam is focused by the condenser lens 3, and is focused exactly at the opening position of the original fabric 7, that is, near the top of the slit 10. on the other hand,
The original fabric 7 is running between tension rollers 8 on a light receiving table 9 in the direction of arrow A. The slit 10 is provided so that the focused laser beam and the burnt residue of the original fabric 7 after opening can easily pass through, and has a width of about 10 to 20 mm in a direction perpendicular to the running direction of the original fabric 7. It is provided. In addition, by suctioning the inside of the light receiving table 9 through the exhaust port 11, the slit 1
The original fabric 7 is attracted to the light-receiving table 9 through the tension roller 8 to ensure stable running in the opening of the original fabric 7 between the tension rollers 8. Further, in the upper part of the opening of the web 7, a processing gas inlet 5 is provided at the lower part of the condenser lens 3 in the holding tube 4 in order to protect the condenser lens 3 from the burnt residue of the web 7. is provided so that dry air is ejected from the nozzle 6 coaxially with the laser beam. Therefore, the pulsed laser beam focused by the condensing lens 3
This means that openings can be formed continuously.
ところで、従来のレーザ開孔装置は以上のよう
に構成されており、原反7を第1図及び第2図の
矢印方向に移動させているので、原反7に開孔を
設けた際に生ずる燃えカスが雲散し、スリツト1
0の端部に付着するという現象が生ずる。この現
象は、特に原反7の走行方向の後方、即ち下流側
に顕著に現われるものである。この燃えカスの付
着は徐々に成長し、スリツト10を塞ぐことにな
る。このため、原反7の吸引動作が適確に行なわ
れなくなるとともに、スリツト10近傍の受光台
9上部にも燃えカスが成長し原反7を汚し、原反
7を持ち上げることによりレーザビームの焦点位
置が変わり、開孔品質を低下させるという欠点が
あつた。また、スリツト10に付着した燃えカス
が成長し、これにレーザビームを照射すると燃え
出すという欠点があつた。従つて、これらの欠点
を除去するためには、頻繁にスリツト10近傍を
掃除する必要があり、作業性が著しく低下すると
いう問題があつた。 By the way, the conventional laser hole-opening device is configured as described above, and since the original fabric 7 is moved in the direction of the arrow in FIGS. 1 and 2, when holes are made in the original fabric 7, The resulting cinders are scattered and the slit 1
The phenomenon of adhesion to the edge of 0 occurs. This phenomenon is particularly noticeable at the rear of the web 7 in the running direction, that is, on the downstream side. The adhesion of this burnt residue gradually grows and blocks the slit 10. For this reason, the suction operation of the web 7 cannot be performed properly, and burnt residue also grows on the upper part of the light receiving table 9 near the slit 10, staining the web 7, and lifting the web 7 causes the laser beam to become focused. The disadvantage was that the position changed and the hole quality deteriorated. Further, there was a drawback that the cinders adhering to the slit 10 grew and started to burn when irradiated with the laser beam. Therefore, in order to eliminate these defects, it is necessary to frequently clean the vicinity of the slit 10, resulting in a problem that workability is significantly reduced.
この発明は、上述の欠点に鑑みなされたもので
あり、原反から生ずる燃えカスの付着を減少さ
せ、安全で作業性のよいレーザ開孔装置を得ると
ともに、原反の吸引保持を確実に行なうことがで
きるレーザ開孔装置を得ることを目的とする。 This invention was made in view of the above-mentioned drawbacks, and it is an object of the present invention to reduce the adhesion of burnt residue generated from the original fabric, to obtain a laser perforation device that is safe and has good workability, and to securely suction and hold the original fabric. The purpose of the present invention is to obtain a laser hole drilling device that can perform the following steps.
この発明は、上記目的を達成するために、受光
台に形成されるスリツトを、原反の走行方向の前
方及び後方に伸びる第1のスリツトと、原反の走
行方向と直角方向に設けられた第2の複数のスリ
ツトとにより構成し、第1、第2のスリツトを介
して原反を巾全体に対し吸引保持するようにした
ことを特徴とするものである。 In order to achieve the above object, the present invention has two slits formed in a light receiving table, a first slit extending forward and backward in the running direction of the original fabric, and a first slit provided in a direction perpendicular to the running direction of the original fabric. A second plurality of slits are formed, and the original fabric is sucked and held over its entire width through the first and second slits.
以下、この発明の一実施例を図について説明す
る。第3図は本発明によるレーザ開孔装置の一実
施例を示す平面図、第4図は第3図の立体斜視図
で、図において、10bは原反7の走行方向の前
方及び後方に伸び且つ走行方向に平行なスリツト
であり、集光レンズ3の原反7へのレーザビーム
集光照射位置の近傍の受光台9に設けられてい
る。また、10aは原反7の走行方向に直角な方
向のスリツトであり、非レーザ開孔部の随所に設
けられている。このスリツト10aは、特に原反
材料が薄いものや走行方向に直角な方向にちぢみ
易い材料に対して有用であり、材料にシワ等が生
ぜず安定に走行させることができるように設けら
れている。なお、第3図及び第4図において、第
1図及び第2図の従来装置と同一符号は同一また
は相当部分を示すものである。 An embodiment of the present invention will be described below with reference to the drawings. FIG. 3 is a plan view showing an embodiment of the laser hole punching device according to the present invention, and FIG. 4 is a three-dimensional perspective view of FIG. Moreover, it is a slit parallel to the running direction, and is provided on the light receiving table 9 near the position where the laser beam is focused and irradiated onto the original fabric 7 by the focusing lens 3 . Furthermore, slits 10a extend perpendicularly to the running direction of the web 7, and are provided at various locations in the non-laser apertures. This slit 10a is particularly useful for thin raw materials or materials that tend to shrink in the direction perpendicular to the running direction, and is provided so that the material can run stably without wrinkles or the like. . In FIGS. 3 and 4, the same reference numerals as in the conventional apparatus shown in FIGS. 1 and 2 indicate the same or corresponding parts.
ここで、原反7としてタバコフイルター用巻紙
(チツプペーパー)を用い、原反7の走行速度を
150m/minとし、レーザビームによる開孔寸法
が0.2×0.4mmの穴を毎分105個の割合でレーザ開孔
したところ、第1図及び第2図に示した従来装置
では、15分程度の運転時間でスリツト10部分
(約10mm巾)は完全に燃えカスで閉塞され運転不
能となつた。また、スリツト巾を20mm程度に拡げ
ても、やはり燃えカスは下流側のエツジ部分を中
心に堆積を開始し、長時間の運転を行なうことが
できなかつた。 Here, cigarette filter wrapping paper (chip paper) is used as the raw material 7, and the running speed of the raw material 7 is determined.
When the laser beam was used to drill 10 5 holes per minute at a speed of 150 m/min and the opening size was 0.2 x 0.4 mm, it took about 15 minutes using the conventional equipment shown in Figures 1 and 2. After 10 hours of operation, 10 slits (approximately 10 mm wide) were completely clogged with cinders and became unoperable. Furthermore, even if the slit width was increased to about 20 mm, burnt residue still started to accumulate mainly on the downstream edge, making it impossible to operate for a long time.
しかしながら、第3図及び第4図に示した実施
例装置において、スリツト10bの形状をペーパ
ー走行方向に平行に長円形とし、寸法を巾10mm、
長さをレーザ照射位置上流側、即ち原反の走行方
向の前方に約15mm、下流側、即ち走行方向の後方
に65mmとし、従来装置と同一の開孔条件により、
開孔を行なつたところ、約2〜3時間の連続運転
後もスリツト10b部分は燃えカスで閉塞するこ
となく、良好な運転結果が得られた。 However, in the embodiment apparatus shown in FIGS. 3 and 4, the shape of the slit 10b is oval parallel to the paper running direction, and the dimensions are 10 mm in width and 10 mm in width.
The length is approximately 15 mm on the upstream side of the laser irradiation position, that is, in front of the running direction of the original fabric, and 65 mm on the downstream side, that is, behind the running direction, and under the same hole-opening conditions as the conventional device.
When the hole was opened, the slit 10b was not clogged with burnt residue even after about 2 to 3 hours of continuous operation, and good operation results were obtained.
なお、上記実施例では、原反7にチツプペーパ
ーを用いたものを示したが、熱分解しても残骸
(燃えカス)が残るような被加工物、例えば布、
複合材料等を対象としてレーザ開孔を行なつても
同様の効果が得られる。さらに、受光台9に設け
るスリツト10a,10bの形状、寸法は、原反
7の材料、開孔条件等によつて種々変形し最適な
ものとすればよい。 In the above embodiment, chip paper was used as the raw material 7, but it is also possible to use a workpiece that leaves residue (burnt residue) even after thermal decomposition, such as cloth, etc.
Similar effects can be obtained by performing laser hole drilling in composite materials and the like. Further, the shape and dimensions of the slits 10a and 10b provided in the light receiving table 9 may be varied and optimized depending on the material of the original fabric 7, hole opening conditions, etc.
以上のように、この発明装置では、レーザ開孔
装置における被加工物を保持する受光台の構成を
改良し、受光台に形成されるスリツトを、被加工
物の走行方向の前方及び後方に伸びる第1のスリ
ツトと、走行方向と直角方向に設けられた第2の
複数のスリツトとにより構成し、第1、第2のス
リツトを介して被加工物を巾全体に対し吸引保持
するようにしたので、長尺な帯状の被加工物の保
持を確実に行なうことができるとともに、燃えカ
スの付着を減少でき、作業性を向上できる効果が
ある。 As described above, in the device of the present invention, the configuration of the light receiving stand that holds the workpiece in the laser hole drilling apparatus is improved, and the slit formed in the light receiving stand is arranged so that the slit extends forward and backward in the traveling direction of the workpiece. It is composed of a first slit and a plurality of second slits provided in a direction perpendicular to the running direction, and the workpiece is sucked and held across its entire width through the first and second slits. Therefore, it is possible to reliably hold a long strip-shaped workpiece, and at the same time, it is possible to reduce the adhesion of burnt residue and improve workability.
第1図は従来のレーザ開孔装置を示す平面図、
第2図は第1図に示した従来のレーザ開孔装置の
正面断面図、第3図は本発明の一実施例によるレ
ーザ開孔装置を示す平面図、第4図は第3図に示
したレーザ開孔装置の立体斜視図である。図中、
同一符号は同一または相当部分を示す。
1……パルスレーザ発振器、2……反射鏡、3
……集光レンズ、4……保持筒、5……加工ガス
導入口、6……ノズル、7……長尺な帯状の被加
工物、8……テンシヨンローラ、9……受光台、
10……スリツト、10a……第2のスリツト、
10b……第1のスリツト、11……排気口、A
……被加工物の走行方向である。
Fig. 1 is a plan view showing a conventional laser hole drilling device;
FIG. 2 is a front sectional view of the conventional laser hole drilling device shown in FIG. 1, FIG. 3 is a plan view showing the laser hole drilling device according to an embodiment of the present invention, and FIG. FIG. 2 is a three-dimensional perspective view of a laser drilling device. In the figure,
The same reference numerals indicate the same or equivalent parts. 1...Pulse laser oscillator, 2...Reflector, 3
... Condensing lens, 4 ... Holding cylinder, 5 ... Processing gas inlet, 6 ... Nozzle, 7 ... Long strip-shaped workpiece, 8 ... Tension roller, 9 ... Light receiving stand,
10...Slit, 10a...Second slit,
10b...first slit, 11...exhaust port, A
...This is the traveling direction of the workpiece.
Claims (1)
ーザ発振器、上記パルスレーザ発振器より出力さ
れたレーザビームを集束させる集光レンズ、長尺
な帯状の被加工物を連続送り駆動させる送り装
置、上記集光レンズの上記被加工物へのレーザビ
ーム集光照射位置から上記被加工物の走行方向の
前方及び後方に伸びる第1のスリツトと、上記被
加工物の走行方向と直角方向に設けられた第2の
複数のスリツトとを有し、上記第1及び第2のス
リツトを介して上記被加工物を巾全体に対し吸引
保持する受光台を備えたことを特徴とするレーザ
開孔装置。 2 第1のスリツトを被加工物のレーザビーム集
光照射位置の走行方向の前方と後方で1:5乃至
1:4の長さとしたことを特徴とする特許請求の
範囲第1項記載のレーザ開孔装置。 3 第1のスリツトを被加工物のレーザビーム集
光照射位置の走行方向の前方に15mm、後方に65mm
の長さとしたことを特徴とする特許請求の範囲第
2項記載のレーザ開孔装置。 4 第2の複数のスリツトは受光台の全面に分散
させて設けられていることを特徴とする特許請求
の範囲第3項記載のレーザ開孔装置。 5 長尺な帯状の被加工物を紙としたことを特徴
とする特許請求の範囲第4項記載のレーザ開孔装
置。 6 長尺な帯状の被加工物を布としたことを特徴
とする特許請求の範囲第4項記載のレーザ開孔装
置。[Claims] 1. A pulsed laser oscillator that outputs a pulsed laser beam, a condensing lens that focuses the laser beam output from the pulsed laser oscillator, and a feed that continuously drives a long strip-shaped workpiece. The device includes a first slit extending forward and backward in the running direction of the workpiece from a position of condensing the laser beam on the workpiece of the condenser lens, and a first slit extending in a direction perpendicular to the running direction of the workpiece. a second plurality of slits provided therein, and a light receiving table that suctions and holds the workpiece over its entire width through the first and second slits. Device. 2. The laser according to claim 1, wherein the first slit has a length of 1:5 to 1:4 in the forward and backward directions of the laser beam condensed irradiation position of the workpiece. hole drilling device. 3 Place the first slit 15mm in front of the laser beam focused irradiation position of the workpiece and 65mm behind it in the traveling direction.
A laser hole drilling device according to claim 2, characterized in that the length is set to . 4. The laser aperture device according to claim 3, wherein the second plurality of slits are distributed over the entire surface of the light receiving table. 5. The laser hole drilling device according to claim 4, wherein the long strip-shaped workpiece is paper. 6. The laser hole drilling device according to claim 4, wherein the long strip-shaped workpiece is cloth.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59142817A JPS6120679A (en) | 1984-07-10 | 1984-07-10 | Laser drilling device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59142817A JPS6120679A (en) | 1984-07-10 | 1984-07-10 | Laser drilling device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6120679A JPS6120679A (en) | 1986-01-29 |
JPH0234277B2 true JPH0234277B2 (en) | 1990-08-02 |
Family
ID=15324314
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59142817A Granted JPS6120679A (en) | 1984-07-10 | 1984-07-10 | Laser drilling device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6120679A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05237681A (en) * | 1992-02-28 | 1993-09-17 | Mitsubishi Electric Corp | Laser boring device |
IT1316478B1 (en) * | 2000-04-14 | 2003-04-22 | Iron Spa | PROCEDURE FOR LASER CUTTING AND / OR PLASMA FROM TAPE, PARTICULARLY OF METAL IN COILS, AND RELATIVE LINE OF CUTTING IN |
JP2009154175A (en) * | 2007-12-26 | 2009-07-16 | Mitsubishi Materials Corp | Laser machining tool |
-
1984
- 1984-07-10 JP JP59142817A patent/JPS6120679A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6120679A (en) | 1986-01-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6647829B2 (en) | Laser processing equipment | |
JPH11254176A (en) | Dust-collecting equipment for laser beam machine | |
JPH01101145A (en) | Method and device for removing dust discharged when paper web is craped | |
JPH0234277B2 (en) | ||
US3742183A (en) | Optical element protection in laser apparatus | |
JPS6120680A (en) | Laser drilling device | |
JPH0634069Y2 (en) | Product removal device for laser processing machine | |
JP2002172483A (en) | Cutting chip removing device and cutting device using the same | |
JP3776525B2 (en) | Laser cutting machine | |
JPS5933079B2 (en) | Laser cutting method and device | |
JP2001259881A (en) | Laser beam machine equipped with smoke removing apparatus and method of laser beam machining | |
JPS62187591A (en) | Recovery device for vaporizing and scattering matter by laser beam machining | |
JPS5916692A (en) | Laser welding device | |
US20230286080A1 (en) | High velocity vacuum system for laser ablation | |
JPS6027486A (en) | Laser welding device | |
JPS62179888A (en) | Work nozzle for laser beam machine | |
JPH0299292A (en) | Laser machining nozzle | |
JP2000317670A (en) | Dust collecting device, dust collecting method, laser beam machining device and laser beam machining method | |
JPH0379116B2 (en) | ||
JPH1190667A (en) | Sheet holding device for laser beam machining | |
JP2539946B2 (en) | Laser cutting method | |
JPH03248791A (en) | Cutting method for synthetic resin material | |
HU224927B1 (en) | Method and device for cutting sheets comprised of a carrier film and a decorative layer located thereon, especially embossed sheets | |
JP7433565B1 (en) | Processing nozzle and laser processing machine | |
JPH02142696A (en) | Dust collector for laser beam machine |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |