JPH0233470U - - Google Patents
Info
- Publication number
- JPH0233470U JPH0233470U JP11136188U JP11136188U JPH0233470U JP H0233470 U JPH0233470 U JP H0233470U JP 11136188 U JP11136188 U JP 11136188U JP 11136188 U JP11136188 U JP 11136188U JP H0233470 U JPH0233470 U JP H0233470U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- film
- printed wiring
- silk
- solder resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000011889 copper foil Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000007639 printing Methods 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010019 resist printing Methods 0.000 description 2
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11136188U JPH0233470U (enExample) | 1988-08-24 | 1988-08-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11136188U JPH0233470U (enExample) | 1988-08-24 | 1988-08-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0233470U true JPH0233470U (enExample) | 1990-03-02 |
Family
ID=31349336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11136188U Pending JPH0233470U (enExample) | 1988-08-24 | 1988-08-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0233470U (enExample) |
-
1988
- 1988-08-24 JP JP11136188U patent/JPH0233470U/ja active Pending