JPH0233443U - - Google Patents
Info
- Publication number
- JPH0233443U JPH0233443U JP1988110661U JP11066188U JPH0233443U JP H0233443 U JPH0233443 U JP H0233443U JP 1988110661 U JP1988110661 U JP 1988110661U JP 11066188 U JP11066188 U JP 11066188U JP H0233443 U JPH0233443 U JP H0233443U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- board
- frame
- notch
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988110661U JPH0233443U (pt-PT) | 1988-08-25 | 1988-08-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988110661U JPH0233443U (pt-PT) | 1988-08-25 | 1988-08-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0233443U true JPH0233443U (pt-PT) | 1990-03-02 |
Family
ID=31348022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988110661U Pending JPH0233443U (pt-PT) | 1988-08-25 | 1988-08-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0233443U (pt-PT) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007149926A (ja) * | 2005-11-28 | 2007-06-14 | Matsushita Electric Ind Co Ltd | 筐体構造とこれを用いた情報機器 |
-
1988
- 1988-08-25 JP JP1988110661U patent/JPH0233443U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007149926A (ja) * | 2005-11-28 | 2007-06-14 | Matsushita Electric Ind Co Ltd | 筐体構造とこれを用いた情報機器 |
| JP4654893B2 (ja) * | 2005-11-28 | 2011-03-23 | パナソニック株式会社 | 情報機器の筐体構造 |