JPH0233442U - - Google Patents
Info
- Publication number
- JPH0233442U JPH0233442U JP11266988U JP11266988U JPH0233442U JP H0233442 U JPH0233442 U JP H0233442U JP 11266988 U JP11266988 U JP 11266988U JP 11266988 U JP11266988 U JP 11266988U JP H0233442 U JPH0233442 U JP H0233442U
- Authority
- JP
- Japan
- Prior art keywords
- support plate
- metal support
- main surface
- resin
- lead terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000008188 pellet Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11266988U JPH0233442U (ko) | 1988-08-26 | 1988-08-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11266988U JPH0233442U (ko) | 1988-08-26 | 1988-08-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0233442U true JPH0233442U (ko) | 1990-03-02 |
Family
ID=31351817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11266988U Pending JPH0233442U (ko) | 1988-08-26 | 1988-08-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0233442U (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06244311A (ja) * | 1992-07-28 | 1994-09-02 | Nec Corp | 半導体装置の製造方法 |
WO2024095788A1 (ja) * | 2022-11-04 | 2024-05-10 | ローム株式会社 | 半導体装置 |
-
1988
- 1988-08-26 JP JP11266988U patent/JPH0233442U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06244311A (ja) * | 1992-07-28 | 1994-09-02 | Nec Corp | 半導体装置の製造方法 |
WO2024095788A1 (ja) * | 2022-11-04 | 2024-05-10 | ローム株式会社 | 半導体装置 |