JPH0233430U - - Google Patents
Info
- Publication number
- JPH0233430U JPH0233430U JP11260088U JP11260088U JPH0233430U JP H0233430 U JPH0233430 U JP H0233430U JP 11260088 U JP11260088 U JP 11260088U JP 11260088 U JP11260088 U JP 11260088U JP H0233430 U JPH0233430 U JP H0233430U
- Authority
- JP
- Japan
- Prior art keywords
- sensitive adhesive
- semiconductor wafer
- adhesive layer
- pressure
- circuit pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims description 5
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 238000005498 polishing Methods 0.000 claims 1
- 230000001681 protective effect Effects 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 1
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11260088U JPH0233430U (enExample) | 1988-08-26 | 1988-08-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11260088U JPH0233430U (enExample) | 1988-08-26 | 1988-08-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0233430U true JPH0233430U (enExample) | 1990-03-02 |
Family
ID=31351684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11260088U Pending JPH0233430U (enExample) | 1988-08-26 | 1988-08-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0233430U (enExample) |
-
1988
- 1988-08-26 JP JP11260088U patent/JPH0233430U/ja active Pending