JPH0232534A - Barrel type susceptor - Google Patents

Abstract

PURPOSE:To improve retainability of a monitor chip by forming a monitor pocket in a specified shape. CONSTITUTION:A monitor pocket 109 provided along with a wafer pocket 108 on a surface A, etc., of a barrel type susceptor 106 is in a shape that a rectangle with its vertical angles being at the top, bottom, left and right sides lacks two sides including the lower vertical angle. This shape improves engaging retainability in the monitor pocket of the monitor chip as compared with a case using a simple rectangle, etc., and prevents the monitor chip while treating a semiconductor substrate from falling off.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a barrel-type susceptor, and particularly to a monitor pocket for fitting and holding a monitor chip.

[Conventional technology]

A conventional barrel-type susceptor of this type will be explained with reference to FIG. 6, which is a sectional view of the barrel-type epitaxial device, FIG. 7, which is a front view of the barrel-type susceptor, and FIG. 8, which is a plan view of the barrel-type susceptor.

That is, as shown in FIG. 6, a barrel-type epitaxial apparatus 200 for forming an epitaxial growth layer on a semiconductor substrate has an opening at the top and a 0-shaped cross section.
A Pelger 2 made of transparent quartz with a reaction chamber 201a inside.
01 and close the upper opening of this Pelger 201,
In the central part, a rotatable oat hanger 202 is inserted into the reaction chamber 201a, and a transparent quartz Pelger cover 204 is formed with a gas inlet 203 for the reaction gas, and a Pelger cover 204 is provided on the outer wall of the Pelger 201. and a quartz halogen lamp 205 that heats the inside of the reaction chamber 201a by radiation, and is in the atmosphere of the reaction chamber 201a,
A vertically hollow barrel-shaped susceptor 206 is suspended from the lower end of the quartz hanger 202, and a temperature sensor (not shown) is inserted into the quartz hanger 202 and the barrel-shaped susceptor 206. and a sensor sheath 207 that detects the temperature of 206.

Furthermore, as shown in FIGS. 7 and 8, the barrel-shaped susceptor 206 is made of a carbon base material whose surface is covered with a silicon carbide film, has a regular polygonal cross section, and has an outer surface with a lower end. It is composed of a plurality of planes A-H that widen as they approach . A plurality of circular recesses, that is, wafer pockets 208, for fitting and holding the semiconductor substrate are formed in the vertical direction on each of these surfaces A-H, and on surface A, an epitaxial film is formed during epitaxial growth of the semiconductor substrate. A plurality of square recesses, that is, monitor pockets 20, which fit and hold monitor chips for monitoring thickness and resistivity.
9 are arranged above and below the wafer pocket 208. The above-mentioned monitor chip is a semiconductor substrate cut into a rectangular shape, and usually has an area of 10×10n! ~20X2
A thickness of 0.3 to 0.7 days is suitable.

In this way, the epitaxial growth layer is formed on the semiconductor substrate fitted and held by the barrel-shaped susceptor 206 by rotating the susceptor 206 by the quartz hanger 202 and growing the epitaxial layer by the monitor chip fitted and held by the susceptor 206. It is known that this is carried out using a reaction gas injected from a gas inlet 203 and radiant heat from a quartz halogen lamp 205 while monitoring the thickness and specific resistance.

[Problem to be solved by the invention]

However, in the conventional barrel-type susceptor described above, the monitor chip is fitted and held in the monitor pocket 209 formed on the substantially vertical surface A, and rotational movement is performed while the reaction gas is flowing. If the monitor chip lifts up due to infiltration of reaction gas or rotational vibration, it will fall out of the monitor pocket 209, making it impossible to obtain epitaxial data of the semiconductor substrate, and it will be necessary to remove the dropped monitor chip from the device. There was a problem that quality and workability deteriorated.

SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a barrel-shaped susceptor that can improve the ability to hold a monitor chip.

[Means to solve the problem]

In order to achieve the above-mentioned object, the present invention includes a recess (wafer pocket) into which a semiconductor substrate is fitted and held, and a recess (monitor pocket) into which a monitor chip for monitoring the processing status of the semiconductor substrate is fitted and held, in a side wall. In the barrel-type susceptor, the monitor pocket has a rectangular shape with apex angles arranged vertically and horizontally, with two sides including the lower apex angles cut out.

[For production]

In the present invention, the monitor pocket has a shape in which two sides including the lower apex angles of a rectangle with apex angles arranged on the top, bottom, left and right sides are cut out. It is supported by the lower ends of each of these two sides, and the lower part of the monitor chip protrudes downward from the two sides.
Rotate and press the bottom of the monitor pocket.

C Embodiment] Hereinafter, one embodiment of the barrel-type susceptor of the present invention will be described as the first embodiment.
The following description will be given with reference to FIG. 2 showing a front view, FIG. 2 a plan view, FIG. 3 an enlarged view of main parts, FIG. 4 a front view of the monitor pocket, and FIG. 5 a sectional view of the monitor pocket.

That is, as shown in FIGS. 1 and 3, the barrel-type susceptor is formed into a vertically hollow shape from a carbon base material whose surface is covered with a silicon carbide film, and its cross section is a regular polygon, and the outside The side surface has multiple surfaces A-H that widen as it approaches the bottom end.
It is composed of polyhedrons. Also, each of these surfaces A-H
A plurality of circular recesses (wafer pockets) 108 for fitting and holding a semiconductor substrate are arranged in parallel in the vertical direction, and
Surface A has a plurality of recesses (monitor pockets) 10 that fit and hold monitor chips for monitoring epitaxial film thickness and resistivity during epitaxial growth of a semiconductor substrate.
9 are arranged in parallel above and below the wafer pocket 108.

As shown in FIGS. 4 and 5, the monitor pocket 109 has two sides 1. It has a shape with part m cut out. Therefore, the monitor chip is ignited at the lower side l of the monitor pocket 109, the lower end point on side m or side l, and the lower end point M on side m; .

Since it protrudes below the height 1m, even if the reactant gas infiltrates or the monitor chip lifts up due to vibration during rotation, the monitor chip will remain on the side l1m or point.

Since it rotates about M as a fulcrum and presses the bottom surface of the monitor pocket 109, the retention of the monitor chip in the monitor pocket 109 is improved and it is possible to prevent the chip from falling off.

〔Effect of the invention〕

As explained above, according to the present invention, the monitor pocket, which is a concave portion, is formed into a shape in which two sides including the lower apex angle of the i-gon are cut out, and the apex angles are arranged vertically and horizontally. This improves the fitting retention in the monitor pocket and prevents the monitor chip from falling off during semiconductor substrate processing, which prevents the loss of semiconductor substrate processing data and reduces equipment maintenance associated with recovering fallen monitor chips. The above-mentioned problems can be solved by the unique effects such as eliminating the need for this and improving quality and workability.

[Brief explanation of the drawing]

Figures 1 to 5 show an embodiment of the susceptor of the present invention, in which Figure 1 is a front view, Figure 2 is a plan view, Figure 3 is an enlarged view of the main parts, and Figure 4 is a monitor pocket. 5 is an X-Y sectional view of FIG. 4, FIGS. 6 to 8 show conventional examples, FIG. 6 is a sectional view of a barrel-type epitaxial device, and FIG. 7 is a barrel-type epitaxial device. FIG. 8 is a front view of the mold susceptor. 106... Barrel type susceptor, 10th... Wafer pocket, 109... Monitor pocket, A, B, C. D, E, F, G, H...face, K...vertex angle,! 4.
m...-side, L, M...point. Side E Kisukerou h-rel type Zani Ata's regular m ward Figure 1, iiρ Monthly 8th heel i1 and Seventh 0 evening's surface map Figure 2 A1g Monthly 's' Seventh digit f sound P11. Shaku Yari Diagram 3 Idokanno \ Lulu Type Princess Deta 0 Front View Figure 7 Diagram Slightly Glazed Balenom Type Suhiata's A5 Ri Diagram

Claims (1)

[Claims of Claims] A barrel-shaped barrel having a side wall formed with a recess (wafer pocket) for fitting and holding a semiconductor substrate and a recess (monitor pocket) for fitting and holding a monitor chip for monitoring the processing status of the semiconductor substrate. The barrel-type susceptor, wherein the monitor pocket has a shape in which two sides including the lower apex angles of a rectangle with apex angles arranged vertically and horizontally are cut out.