JPH023233Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a flat switch device that is disposed within the main body of various electronic devices via an operation panel or the like.

[Conventional technology]

Conventionally, electronic circuits built into various electronic devices are
In order to increase the functionality of the electronic devices mentioned above and achieve miniaturization, electronic components with integrated circuits or loose
It is constructed using IC. Further, operations such as switching and selecting various operation modes of the electronic device are performed by pressing an operation switch provided on an operation panel provided on the front of the device body.

By the way, the above IC not only has the risk of easily malfunctioning due to the influence of static electricity, but also
It has the problem of being extremely vulnerable to static electricity, such as easily causing electrostatic damage due to static electricity discharge. In order to solve these problems,
In the case of electronic devices that use ICs in the electronic circuit configuration, a housing that constitutes the main body of the device is formed by molding a synthetic resin that is easily charged, and an operation panel, etc. is arranged on the front of the housing. It is necessary to prevent the static electricity generated in the casing from discharging into the electronic circuit disposed within the casing and affecting the IC.

[The problem that the idea attempts to solve]

Conventionally, therefore, in electronic circuits using ICs, for example, a Zener diode is placed on the signal input side of the IC, and this Zener diode applies high voltage to the IC due to electrostatic discharge. Static electricity countermeasures are taken in the configuration of electronic circuits to prevent this. However, many ICs
For electronic components composed of
It is necessary to arrange Zener diodes corresponding to each. As a result, a large area on the electronic circuit board is occupied by Zener diodes for static electricity countermeasures, making it impossible to avoid increasing the size of the circuit board. As a result, the purpose of miniaturizing the device itself becomes unachievable. Furthermore, a large number of electronic components are required to configure a predetermined electronic circuit, making it impossible to further reduce the number of electronic components used.

Therefore, the present invention makes it possible to take measures against static electricity without having to take measures against static electricity due to the electronic circuit structure described above, and eliminates static electricity from the operation panel or housing where the operation switch of electronic equipment is installed. This was proposed for the purpose of providing a flat switch device that can effectively protect electronic circuits inside equipment from the effects of electrical discharge.

[Means to accomplish the task]

In order to achieve the above-mentioned object, the present invention includes a substrate on which a switch electrode pattern and a ground electrode pattern are formed on one main surface, and a substrate that is laminated on one main surface of the above substrate and on which a switch electrode pattern and a ground electrode pattern are formed. an insulating sheet body in which a first opening corresponding to the switch electrode pattern and a second opening corresponding to the ground electrode pattern are formed when laminated; a flexible sheet body formed with a switch electrode facing the switch electrode pattern through the first opening and a third opening corresponding to the second opening; a conductive sheet body laminated on a flexible sheet body and formed in a size sufficient to cover substantially the front surface of the flexible sheet body;
The operation is performed by laminating the conductive sheet body and forming a pressing operation part at a position corresponding to the switch electrode and a protruding part at a position corresponding to the ground electrode pattern when laminated on the conductive sheet body. The projecting portion presses and deforms the conductive sheet body toward the substrate side through the second and third openings to establish electrical contact between the conductive sheet body and the ground electrode pattern. In addition, the flexible sheet body is pressed and deformed through the conductive sheet body by a pressing operation of the pressing operation section, thereby establishing electrical contact between the switch electrode pattern and the switch electrode.

[Effect]

In the planar switch device according to the present invention, a conductive sheet covering a substrate surface is formed in a second opening formed in an insulating sheet and a flexible sheet by a projection provided on an operation panel. The conductive sheet body is pressed against the substrate side through the third opening to establish electrical contact between the conductive sheet body and the ground electrode pattern on the substrate. It is grounded via the ground electrode pattern on the substrate.

Further, by a pressing operation of a pressing operation part provided on the operation panel, the flexible sheet body is pressed and deformed via the conductive sheet body, and electrical contact is established between the switch electrode pattern and the switch electrode,
A switch operation is performed.

〔Example〕

Hereinafter, specific embodiments of the present invention will be described with reference to the drawings.

As shown in FIGS. 1 and 2, the planar switch device 1 according to the present invention has a predetermined circuit pattern such as a switch electrode pattern 11 and a ground electrode pattern 12 forming fixed contacts of the switch on one main surface.
A flexible circuit board 10 with printed wiring on the substrate 10A, an insulating sheet body 20 laminated on one main surface 10A of the substrate 10 and functioning as a spacer, and a switch electrode 31 forming a movable contact of the switch. It is constructed by sequentially laminating a sheet body 30, a conductive sheet body 40 that achieves the function of electrostatic shielding, and an operation panel 50 provided with an operation section 51 for switching operations. This planar switch device 1 is screwed and attached to an operation panel of an electronic device (not shown).

By the way, as shown in FIG. 3, the substrate 10 constituting the planar switch device 1 has a notch formed in a predetermined shape so that it can be placed inside a casing constituting the main body of an electronic device. . Further, a switch 13 having a mechanical structure such as a slide switch is disposed at a predetermined position on the substrate 10. Further, the board 10 is provided with a screw hole 14 through which a screw for fixing the switch device 1 to a chassis board or the like in the main body of the device is inserted when the switch device 1 is configured as a flat switch device 1.

The insulating sheet body 20 is made of an electrically insulating material such as a polyester film, and is laminated on one main surface 10A of the substrate 10. When the insulating sheet body 20 is laminated on one main surface 10A of the substrate 10,
A first opening 21 is formed corresponding to the switch electrode pattern 11 formed on the substrate 10, and a second opening 2 is formed corresponding to the ground electrode pattern 12.
2 is formed. These first and second openings 21 and 22 form the switch electrode pattern 11.
and is formed in a circular shape approximately equal to the ground electrode pattern 12. Then, this insulating sheet body 20
serves as a spacer to ensure a certain clearance between the switch electrode panel 11 on the substrate 10 and the switch electrode 31 provided on a flexible sheet body 30, which will be described later.

Next, the flexible sheet body 30 is formed of a polyester film or the like, which is an electrically insulating material, as shown in FIG. 5, like the insulating sheet body 20. The substrate is laminated so as to cover the entire surface of one main surface 10A of the substrate. This flexible sheet body 30 has a switch at a position corresponding to the switch electrode pattern 11 on the substrate 10 on the side facing the one main surface 10A of the substrate 10 when stacked on the substrate 10. Electrode 31
is formed. This switch electrode 31 is formed by printing conductive carbon or the like on the flexible sheet body 30, for example. When the flexible sheet body 30 on which the switch electrodes 31 are formed in this manner is laminated on the substrate 10 via the insulating sheet body 20, the switch electrode pattern 11 on the substrate 10 and the switch on the flexible sheet body 30 are stacked. The electrode 31 is
As shown in FIG. 10, they are disposed facing each other with a clearance equal to the thickness of the insulating sheet 20 through a first opening 21 formed in the insulating sheet 20. Furthermore, a third opening 32 is formed in the flexible sheet body 30 in correspondence with the ground electrode pattern 12 on the substrate 10 and the second opening 22 formed in the insulating sheet body 20. . This third opening 32 is formed in the same circular shape as the second opening 22.

Further, as shown in FIG. 6, the conductive sheet body 40 is a sheet body 4 formed of an insulating material.
The conductive layer 41 is formed by depositing a conductive material such as aluminum on one main surface 42A of the semiconductor device 2. This conductive sheet body 40 is formed in the same shape as the flexible sheet body 30, as shown in FIG. 2, and is laminated on the flexible sheet body 30 with the conductive layer 41 facing the substrate 10. Ru.

Incidentally, the conductive layer 41 is grounded and functions as an electrostatic shield layer, as will be described later.

Further, since the conductive sheet body 40 is formed in the same shape as the flexible sheet body 30, by laminating it on the flexible sheet body 30, the conductive layer 41 is electrically connected to the substrate 10. insulated.

Note that the flexible sheet body 30 and the conductive sheet body 40, which are formed in the same shape as each other, have cutouts that escape the switches 13 disposed on the substrate 10 when they are laminated on the substrate 10. has been done.

Furthermore, the operation panel 50 is made of a flexible material such as rubber, as shown in FIGS. 7 and 8. That is, the operation panel 50 is integrally formed with a pressing operation section 51 at a portion corresponding to each switch electrode pattern 11 on the substrate 10 when the operation panel 50 is stacked on the substrate 10. This pressing operation section 51 is formed so as to bulge out from the outer surface of the operation panel 1 that does not face the substrate 10 when the operation panel 50 is stacked on the substrate 10, and has a thin wall formed at the peripheral edge. It is integrally connected to the operation panel 50 via the elastic displacement section 51A. Then, the pressing operation section 51
is the elastic displacement portion 5 when pressed.
1A is elastically displaced and displaced in a direction perpendicular to the plane of the operation panel 50. In addition, on the inner surface side facing the pressing operation surface of the pressing operation section 51,
A protruding portion 52 is provided in a protruding manner.

Further, the operation panel 50 has a projecting portion 53 formed in a portion corresponding to the ground electrode pattern 12 on the substrate 10 when the operation panel 50 is stacked on the substrate 10. This protruding portion 53 is formed to protrude from the inner surface 50A side of the operation panel 50, which faces the bulging side of the pressing operation portion 51.

The substrate 10, insulating sheet body 20, flexible sheet body 30, conductive sheet body 40, and operation panel 10 formed as described above are sequentially laminated on one main surface 10A of the substrate 10. Thus, a flat switch device 1 as shown in FIG. 1 is constructed. Note that the members stacked on the substrate 10 are bonded to each other using an adhesive or the like.

By the way, when the planar switch device 1 is constructed by laminating each member as described above, the operation panel 50
As shown in FIG. 9, the protruding portion 53 provided in The conductive sheet body 40 that protrudes toward the substrate 10 side through the conductive sheet body 40 and covers one main surface 10A of the substrate 10 with the distal end surface 53A of the protruding portion 53 is pressed and deformed. Then, electrical contact is made between the conductive sheet body 40 and the earth electrode pattern 12 on the substrate 10, and the conductive sheet body 40 is grounded via the earth electrode pattern 12 on the substrate 10.

Further, as shown in FIG.
0. The switch electrode pattern 11 formed on At this time, since the insulating sheet body 20 interposed between the substrate 10 and the flexible sheet body 30 functions as a spacer, the thickness of the insulating sheet body 20 is A gap is provided. Then, the switch electrode 31 and the switch electrode pattern 11
As shown in FIG. 11, the conductive sheet body 40 is pressed by pressing the pressing operation section 51 provided on the operation panel 50 corresponding to the switch electrode 31 and the switch electrode pattern 11 toward the substrate 10 as shown in FIG. By pressing and deforming the flexible sheet body 30 on which the switch electrode 31 is provided, electrical contact is established and a switch operation is performed.

By the way, the planar switch device 1 according to the present invention
is attached by screwing to the inner side of the front panel 60 of the casing that constitutes the main body of the electronic device, and when attached to the front panel 60, the press operation section 51 is as shown in As shown in FIG. 3, it is fitted into an opening 61 formed in the front panel 60 and is exposed to the outer surface of the front panel 60.

[Effect of idea]

As mentioned above, the planar switch device according to the present invention has a protrusion provided on the operation panel.
A conductive sheet covering the substrate surface is pressed and deformed toward the substrate through a second opening formed in the insulating sheet and a third opening formed in the flexible sheet, and the conductive Since electrical contact is made between the sheet body and the ground electrode pattern on the substrate, the conductive sheet body is always grounded via the ground electrode pattern on the substrate. Since the conductive sheet is grounded in this way, static electricity may build up on the casing, etc. that makes up the main body of the electronic device, and the charged static electricity may be discharged when a finger or finger touches the electronic device. However, the discharge can be made through the grounded conductive sheet. Therefore, the IC constituting the electronic circuit disposed within the device main body can be protected from the influence of static electricity, and can be reliably protected from electrostatic damage. Further, unlike conventional devices, there is no need for electronic components such as Zener diodes to prevent electrostatic damage, so the circuit board can be made smaller, and the equipment itself incorporating this board can be made smaller.

Further, since the above-mentioned planar switch device is constructed by laminating sheet bodies, it can be made extremely thin.

[Brief explanation of the drawing]

FIG. 1 is an overall perspective view showing a planar switch device according to the present invention, FIG. 2 is an exploded perspective view thereof, and FIG. 3 is a plan view of a substrate constituting the planar switch device, Fig. 4 is a plan view of the insulating sheet body, Fig. 5 is a plan view of the flexible sheet body, Fig. 6 is a partial cross-sectional view of the conductive sheet body, and Fig. 7 is a plan view of the flexible sheet body. FIG. 8 is a bottom view of the panel, and FIG. 8 is a sectional view taken along the line A-A in FIG. 7. FIG. 9 is a cross-sectional view of a protruding portion provided on the operation panel, FIG. 10 is a cross-sectional view of a pressing operation portion provided on the operation panel, and FIG. 11 is a cross-sectional view of the pressing operation portion provided on the operation panel. It is a sectional view of a state. DESCRIPTION OF SYMBOLS 10... Substrate, 11... Switch electrode pattern, 12... Earth electrode pattern, 20... Insulating sheet body, 21... First opening, 22... Second opening, 30... Flexible Sex sheet body, 31...
Switch electrode, 32...Third opening, 40...
Conductive sheet body, 51...Press operation section, 53...
Projection.

Claims (1)

[Claims for Utility Model Registration] A substrate on which a switch electrode pattern and a ground electrode pattern are formed on one main surface; an insulating sheet body in which a first opening corresponding to an electrode pattern and a second opening corresponding to a ground electrode pattern are formed; a flexible sheet body in which a switch electrode facing the switch electrode pattern via a first opening and a third opening corresponding to the second opening are formed; a conductive sheet body formed in a size large enough to cover substantially the front surface of the flexible sheet body; It consists of an operation panel having a pressing operation part at a position corresponding to the switch electrode and a protruding part formed at a position corresponding to the ground electrode pattern, and the conductive sheet body is moved by the above-mentioned protruding part to the second and third parts. The electrical contact between the conductive sheet and the ground electrode pattern is achieved by pressing the conductive sheet toward the substrate through the opening, and the flexible A planar switch device that makes electrical contact between a switch electrode pattern and a switch electrode by pressing and deforming a flexible sheet.