JPH0231807Y2 - - Google Patents
Info
- Publication number
- JPH0231807Y2 JPH0231807Y2 JP1985065625U JP6562585U JPH0231807Y2 JP H0231807 Y2 JPH0231807 Y2 JP H0231807Y2 JP 1985065625 U JP1985065625 U JP 1985065625U JP 6562585 U JP6562585 U JP 6562585U JP H0231807 Y2 JPH0231807 Y2 JP H0231807Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- bag
- compound
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 150000001875 compounds Chemical class 0.000 claims description 15
- 229940126214 compound 3 Drugs 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- SZUVGFMDDVSKSI-WIFOCOSTSA-N (1s,2s,3s,5r)-1-(carboxymethyl)-3,5-bis[(4-phenoxyphenyl)methyl-propylcarbamoyl]cyclopentane-1,2-dicarboxylic acid Chemical compound O=C([C@@H]1[C@@H]([C@](CC(O)=O)([C@H](C(=O)N(CCC)CC=2C=CC(OC=3C=CC=CC=3)=CC=2)C1)C(O)=O)C(O)=O)N(CCC)CC(C=C1)=CC=C1OC1=CC=CC=C1 SZUVGFMDDVSKSI-WIFOCOSTSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229940126543 compound 14 Drugs 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985065625U JPH0231807Y2 (US08197722-20120612-C00042.png) | 1985-04-30 | 1985-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985065625U JPH0231807Y2 (US08197722-20120612-C00042.png) | 1985-04-30 | 1985-04-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61182077U JPS61182077U (US08197722-20120612-C00042.png) | 1986-11-13 |
| JPH0231807Y2 true JPH0231807Y2 (US08197722-20120612-C00042.png) | 1990-08-28 |
Family
ID=30597791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985065625U Expired JPH0231807Y2 (US08197722-20120612-C00042.png) | 1985-04-30 | 1985-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231807Y2 (US08197722-20120612-C00042.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2573524Y2 (ja) * | 1992-08-10 | 1998-06-04 | 株式会社小糸製作所 | 自動車用電装品の回路基板 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5372164A (en) * | 1976-12-10 | 1978-06-27 | Hitachi Ltd | Method of manufacturing electronic parts |
-
1985
- 1985-04-30 JP JP1985065625U patent/JPH0231807Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5372164A (en) * | 1976-12-10 | 1978-06-27 | Hitachi Ltd | Method of manufacturing electronic parts |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61182077U (US08197722-20120612-C00042.png) | 1986-11-13 |
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