JPH023173Y2 - - Google Patents
Info
- Publication number
- JPH023173Y2 JPH023173Y2 JP2584284U JP2584284U JPH023173Y2 JP H023173 Y2 JPH023173 Y2 JP H023173Y2 JP 2584284 U JP2584284 U JP 2584284U JP 2584284 U JP2584284 U JP 2584284U JP H023173 Y2 JPH023173 Y2 JP H023173Y2
- Authority
- JP
- Japan
- Prior art keywords
- impact sensor
- sensor element
- impact
- bumper
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011247 coating layer Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 description 6
- 230000035939 shock Effects 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 230000035945 sensitivity Effects 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 208000027418 Wounds and injury Diseases 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000013013 elastic material Substances 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 208000014674 injury Diseases 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000013464 silicone adhesive Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Force Measurement Appropriate To Specific Purposes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2584284U JPS60139274U (ja) | 1984-02-27 | 1984-02-27 | 衝撃センサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2584284U JPS60139274U (ja) | 1984-02-27 | 1984-02-27 | 衝撃センサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60139274U JPS60139274U (ja) | 1985-09-14 |
| JPH023173Y2 true JPH023173Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-01-25 |
Family
ID=30521291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2584284U Granted JPS60139274U (ja) | 1984-02-27 | 1984-02-27 | 衝撃センサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60139274U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2592440Y2 (ja) * | 1991-11-14 | 1999-03-24 | 株式会社東海理化電機製作所 | 衝撃検出装置 |
| JP4161270B2 (ja) * | 2003-10-29 | 2008-10-08 | 株式会社デンソー | 衝突荷重検出センサ |
| JP2007078629A (ja) * | 2005-09-16 | 2007-03-29 | Hitachi Cable Ltd | 衝突検知センサ |
-
1984
- 1984-02-27 JP JP2584284U patent/JPS60139274U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60139274U (ja) | 1985-09-14 |