JPH0231256Y2 - - Google Patents
Info
- Publication number
- JPH0231256Y2 JPH0231256Y2 JP1986055333U JP5533386U JPH0231256Y2 JP H0231256 Y2 JPH0231256 Y2 JP H0231256Y2 JP 1986055333 U JP1986055333 U JP 1986055333U JP 5533386 U JP5533386 U JP 5533386U JP H0231256 Y2 JPH0231256 Y2 JP H0231256Y2
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- laser
- point
- irradiation
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 claims description 90
- 229910000679 solder Inorganic materials 0.000 claims description 30
- 230000007246 mechanism Effects 0.000 claims description 13
- 238000005259 measurement Methods 0.000 claims description 6
- 238000005286 illumination Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000009529 body temperature measurement Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000003685 thermal hair damage Effects 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 235000000396 iron Nutrition 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986055333U JPH0231256Y2 (pm) | 1986-04-15 | 1986-04-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986055333U JPH0231256Y2 (pm) | 1986-04-15 | 1986-04-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62169769U JPS62169769U (pm) | 1987-10-28 |
| JPH0231256Y2 true JPH0231256Y2 (pm) | 1990-08-23 |
Family
ID=30883136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986055333U Expired JPH0231256Y2 (pm) | 1986-04-15 | 1986-04-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231256Y2 (pm) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5294916B2 (ja) * | 2009-02-17 | 2013-09-18 | パナソニック株式会社 | レーザはんだ付け装置 |
| KR20210062376A (ko) * | 2019-11-21 | 2021-05-31 | 레이저쎌 주식회사 | 레이저 리플로우 장치 및 레이저 리플로우 방법 |
| JP7447387B2 (ja) * | 2022-04-28 | 2024-03-12 | パック テック－パッケージング テクノロジーズ ゲーエムベーハー | 回路基板に電子部品をはんだ付けするための方法及び装置、コンピュータプログラム製品、並びにコンピュータ可読媒体 |
-
1986
- 1986-04-15 JP JP1986055333U patent/JPH0231256Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62169769U (pm) | 1987-10-28 |
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