JPH02311805A - Wire bonding method - Google Patents

Abstract

PURPOSE:To eliminate the need to heat the whole object, to reduce thermal damage, and to eliminate mechanical damage by heating the contact parts of an object and a metal-coated fiber locally with high energy density and splicing them mutually by fusion. CONSTITUTION:The 1st part 1-3 of the wire 1 formed by coating an optical fiber 1-1 with metal 1-2 is pressed against objects 20-1 and 20 to bend the objects 20-1 and 20 to specific curvature in a plane almost perpendicular to their surfaces. Then laser light is made incident on the end part of the wire 1, which is spliced by fusion to the objects 20-1 and 20 with laser light 11 leaking from the bent part of the wire 1. Namely, when the curvature of the bent part of the optical fiber exceeds a certain value, the light which is guided increases in leakage suddenly and a small range nearby the bent part is heated locally. Consequently, thermal or mechanical damage to the objects is reduced and high-reliability wire bonding is enabled.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a wire bonding method for bonding a wire having a metal surface to an object having a metal surface, and in particular for mounting an LSI chip on which a circuit pattern is formed. This invention relates to a wire bonding method for electrically connecting the electrode portions of both the LSI chip and the package substrate with wires of Au, ^1, etc. after mounting the LSI chip on a package substrate.

[Prior Art] Conventionally, this type of wire bonding method includes a thermocompression bonding method, an ultrasonic wedge method, and the like.

FIGS. 5(a) and 5(b) are explanatory diagrams of wire bonding methods using a thermocompression method and an ultrasonic wedge method, respectively.

In the thermocompression wire bonding method, a wire with a diameter of 2
A ball 51 with a diameter of several tens of μm to 100 μm formed at the tip of a wire 50 with a diameter of 0 to 30 μm is pressed by a capillary 52, and the ball 51 is joined to the electrode portion 20-1. Further, when bonding the wire 50 to the electrode portion 20 on the lead frame 23, the wire is crimped as is without forming the ball 51.

In the ultrasonic wedge wire bonding method, the temperature of the LSI chip 21 is kept below 200°C, and a wedge-shaped vibrator 53 (wedge-shaped in the direction perpendicular to the plane of the paper in FIG. 5(b)) is used. ), ultrasonic vibration is applied to the wire 50 and the electrode portion 20 or 20-1 to join them.

[Problems to be Solved by the Invention] The conventional wire bonding method described above has the following problems.

1. In the thermocompression wire bonding method,
By heating the LSI chip 21, the LSI formed in the die bonding process before the wire bonding process
There is a risk that the bonding portion 22 between the chip 21 and the lead frame 23 will be thermally degraded, and therefore there are restrictions on the materials that can be used to bond the LSI chip 21 and the lead frame in the bonding process.

2. In the ultrasonic wedge wire bonding method, although the temperature of the LSI chip 21 can be lowered to below 200°C, since ultrasonic vibrations are applied to the wire during bonding, as the number of electrodes increases, the temperature of the LSI chip 21 is The number of times the ultrasonic vibrations are applied also increases, causing repeated mechanical damage to the LSI chip 21, and there is a risk that flags will occur and grow within the LSI chip. In addition, the ultrasonic application time is also LS
As the number of electrodes on the I-chip increases, it cannot be ignored and it becomes difficult to shorten the bonding time.

3. Furthermore, the wire 50 is attached to the LSI chip 2 using a wire bonding method such as a thermocompression bonding method or an ultrasonic wedge method.
When bonding to the electrode portion 20-1 of the lead frame 20 or the electrode portion 20 of the lead frame 23, a wire made of Au or A1 having a small diameter and a solid structure is used. When such wires are used in high-frequency LSI chips, etc. that input and output high-frequency signals, the characteristic impedance increases due to the small diameter of the wire, and impedance mismatch occurs due to stray capacitance due to the solid structure. .

The purpose of the present invention is to reduce the increase in impedance, mismatch, and thermal
It is an object of the present invention to provide a wire bonding method capable of overcoming the problem of deterioration of LSI reliability due to mechanical damage and further shortening the bonding time including the time for preheating the LSI chip and the time for applying ultrasonic waves.

[Means for Solving the Problems] The wire bonding method of the present invention is a wire bonding method in which a wire having a metal surface is fixed to an object having a metal surface, and the wire bonding method includes the steps of: bonding a wire having a metal surface to an object having a metal surface; coating the wire, pressing an arbitrarily selected first portion of the wire into contact with the object, and applying a coating in the vicinity of the first portion of the wire substantially perpendicular to the surface of the object. The wire is bent at a predetermined curvature in a plane, and the laser beam is incident into the second portion from the end of the second portion connected to the bent portion of the wire, and the laser beam leaks from the bent portion of the wire. The wire is fused to the object.

[Function] In the wire bonding method of the present invention, a wire formed by coating the outer surface of an optical fiber with metal (hereinafter referred to as metal coated fiber) is used.As is well known, high frequency signals are affected by the skin effect. is transmitted near the surface of the conductor. Therefore, when the conducting wire has a solid structure, the conductor near the central axis of the conducting wire does not contribute to the transmission of high frequency signals and only increases the electric capacity. The optical fiber part of the metal-coated fiber is made of silica glass or multi-component glass material, so it has a low dielectric constant, so the capacitance is small, and the near surface is coated with metal, which increases the characteristic impedance for high-frequency signals. Inconsistency can be reduced. Therefore, one problem with conventional wires can be solved.

When bending an optical fiber, if the curvature of the bent portion exceeds a certain value, the leakage of guided light increases rapidly. Therefore, when the metal-coated fiber is bent at a predetermined curvature in a plane perpendicular to the surface of the object, the leaked light is
Irradiate the target. Since a laser can generate a light beam with high energy density, by leaking the laser light from the bent part of the metal coated fiber, it is possible to create leaked light with high energy density near the bent part of the object. can. This leaked light locally heats the object and a small area near the bent portion, and the metal coated fiber is fused to the object. Furthermore, since the first part is pressed, it will not shift or float due to the molten metal during fusion, and therefore the pressing ensures highly accurate bonding.

As mentioned above, in this method, the vicinity of the contact area between the object and the metal-coated fiber is locally heated with high energy density and fused together, so there is no need to preheat the entire object, and bonding Since the time is short and the temperature of the entire object does not rise, there is little thermal damage and, of course, there is no mechanical damage.

[Example] Next, an example of the present invention will be described with reference to the drawings.

FIG. 1(a) is a cross-sectional view of a metal coated fiber used in the wire bonding method of the present invention, and FIG. 1(b) is a block diagram of an embodiment of a wire bonding apparatus for performing the wire bonding method of the present invention. It is.

The wire used in the wire bonding method of the present invention is a metal-coated fiber 1 in which the outer surface of an optical fiber 1-1 made of quartz glass or multicomponent glass is coated with a metal layer 1-2 such as Au or AI. Optical fiber 1-
1 is an optical waveguide that transmits a laser pulse that provides bonding energy, and a metal layer 1- that guarantees the mechanical strength of the wire due to its large tensile strength.
2 transmits electrical signals.

The wire bonding apparatus of this embodiment includes a capillary 2,
It is composed of a bonding head 4 including a yield roller 3, a capillary drive mechanism 5, a YAG laser oscillation section 6, an optical coupling section 7, a laser driver 8, a host computer 9, and a control section 10.

The capillary 2 is a rod or pipe made of ruby, sapphire, or fused alumina with a diameter of about 1 to 2 ml 11. In the case of a rod, a hole is bored through which the metal coated fiber 1 is passed, and the metal coated fiber 1 is connected to the electrode section. and bend it at a predetermined curvature. FIG. 1 shows an electrode portion 20- formed on an LSI chip 21 as an electrode portion.
1 is shown. The feed roller 3 supplies the metal coated fiber 1 to the capillary 2 and applies tension to the metal coated fiber 1. The capillary drive mechanism 5 is a mechanism that drives the capillary 2 and the feed roller 3.

The optical coupling unit 7 connects the laser pulse outputted by the YAG laser oscillation unit 6 to the optical fiber 1-1 of the metal coated fiber l.
Inject it into the

A laser driver 8 drives a YAG laser oscillation section. The control unit 10 controls the operation of the capillary drive mechanism 5.

The host computer 9 includes a laser driver 8 and a control unit 1.
In FIG. 1(b), the remaining length of the metal coated fiber l is wound on a reel.

Next, a first embodiment of the present invention will be described.

FIG. 2 is an explanatory diagram of the wire bonding method of the present invention, and FIG. 2(a) shows the electrode section 20 mounted on the lead frame 23 and the electrode 2 formed on the LSI chip 21.
A diagram showing each step of wire bonding the metal coated fiber l to 0-1, FIG. 2(b),
(c) is a diagram showing the arrangement of the metal coated fiber 1 and the capillary 2 when the metal coated fiber 1 is wire-bonded to each electrode 20-1.20;
Figure (d).

(e) is a sectional view and a plan view of a fused portion of the fused metal coated fiber l and the electrode portion 20 or 20-1.

To carry out the bonding method of the present invention, first, a predetermined amount of the metal-coated fiber 1 is sent out to the tip of the capillary 2 by the feed roller 3 and clamped. The capillary 2 moves to a position above the electrode 20-1 on the LSI chip 21, which has been taught in advance according to instructions from the host computer 9, and then descends to the first portion of the metal-coated fiber 1 (contact portion 1-1). 3) is brought into contact with the electrode 20-1, and the bending regulating portion 2-1 provided on the capillary 2
The metal coated fiber is bent at a predetermined curvature and stopped. The bending is performed such that the portion adjacent to the contact portion 1-3 is bent within a plane perpendicular to the surface of the electrode portion 20-1. In this state, the host computer 9 issues a pulse oscillation instruction to the laser driver 8 at a predetermined pulse interval, and causes the optical coupling section 7 to insert the bent portion of the metal coated fiber 1 (to be more precise, the bent portion of the metal coated fiber L) into the metal coated fiber 1. A laser pulse is incident on the portion connected to the portion), that is, the second portion). The laser pulse guided in the optical fiber 1-1 of the metal coated fiber 1 passes through the bending regulating section 2-
1, it leaks to the electrode 20-1 side of the LSI chip 21 and is emitted as leakage light 11, and a part of the metal layer of the metal coated fiber 1 and the metal (AI, Au) of the electrode 20 are emitted.
) is melted (shown as molten portion 12 in FIGS. 2(e) and 2(f)) and fused together.

After that, the clamp of the feed roller 3 is released, the metal coated fiber 1 is sent out by the feed roller, the capillary 2 is raised, and the electrode 2 on the lead frame 23 side
Proceed through a pre-taught trajectory in the direction of 0,
It comes into contact with the electrode 20 and stops. In this state, L
A laser pulse is input into the metal coated fiber 1 in the same manner as the bonding of the electrode 20-1 on the SI chip 21, and leakage light 1 from the bent part of the metal coat fiber 1 is generated.
1, the metal coated fiber 1 and the electrode 20 are bonded. After bonding, in order to cut the metal coated fiber 1, tension is applied to the metal coated fiber 1 by the feed roller 3 to break it, and as a result,
The metal-coated fiber 1 is cut near the bending restriction portion 2-1 of the capillary 2. Then, the capillary 2 rises again and the next bonding operation begins. At this time, the timing of applying the cutting tension to the metal-coated fiber 1 is not limited to after laser emission, and may be during laser emission.

The control of the capillary 2 and the feed roller 3, the emission timing of laser pulses, etc. are all stored in advance as a control sequence in the host computer 9 based on teaching data, and the above bonding operation is automated.

In addition, when applying the metal coated fiber l to the bonding wire, the pitch interval of the electrode pads of the LSI chip 21 is 100 to 150 μm, and the butt size is approximately 100×
Since the wire diameter is about 100 μm, a wire diameter of 100 μm or less is required, which is achieved by reducing the diameter of the currently most popular communication optical fiber (wire diameter 125 μm, core diameter 50 μm) using means such as etching. This can be realized by coating this with a metal layer using vacuum evaporation or the like. In addition, in the bonding method of the present invention, unlike conventional thermocompression bonding and ultrasonic wedge methods, there is no need to pressurize and deform the wire tip on the electrode pad of the LSI chip. The diameter of the conventional bonding capillary 5 is sufficient, and there is no need to reduce the diameter to the conventional wire diameter (20 to 30 μm).
2 (FIG. 5) can be used in the present embodiment with almost no changes, and therefore the present embodiment can be implemented relatively easily even when using conventional technology.

FIG. 3 is a perspective view showing a second embodiment of the present invention, and FIG. 3(a) shows a fiber guide 35 mounted on a substrate 36.
A perspective view showing the step of attaching the light transmitting/receiving optical fiber 30 to the groove 35-1 (see FIG. 3(b)), and FIGS. 3(b) and 3(c) are cross sections of the groove of the fiber guide 35, respectively. When is rectangular or ■-shaped, the light transmitting and receiving optical fiber 30 and the bonding metal coated fiber I
It is a figure showing arrangement of B.

This embodiment is an example of application to an optical device such as a light transmitting/receiving module, which is formed by coupling a light emitting element or a light receiving element (hereinafter referred to as a light transmitting/receiving element) 31 and a light transmitting/receiving optical fiber 30. Optical fiber for transmitting and receiving light (hereinafter referred to as optical fiber) 3
0 is set in the fiber guide 35, and a metal coat 30-1 made of the same metal as the metal coat 33 of the fiber guide 35 is applied to the portion that contacts the fiber guide 35. The contact portion IB-3 at the tip of the metal-coated fiber IB for bonding is formed by the wire bonding method of the first embodiment, so that the contact portion IB-3 is capable of transmitting light within approximately 35-1° and 35-2 of the rectangular or V-shaped cross section of the fiber guide 35. As a fixing member for fixing the fiber 30, the optical fiber 30 and the metal coat layer 33 of the fiber guide 35 are fusion-bonded by one movement.

After removing the coating of the core wire 34 in advance, the optical fiber 30 is
After processing the tip and forming a metal coat 30-1 on the portion that contacts the fiber guide 35, the fiber guide 35 is set so that the entire metal coat 30-1 is accommodated in the groove 35-1. In this state, the tip of the bonding metal coated fiber IB (hereinafter referred to as metal coated fiber IB) is connected to the optical fiber 30 in the groove 35-1 or 35-2 by the capillary 2.
and the metal coat layer 33 of the fiber guide 35 from above and are bent. Further, this tip, that is, the contact part IB-3 is pressed by the capillary 2, and as a result, the optical fiber 30 is fully 35-1 or 35
- Closely adheres to the inner wall of 2. In this state, a laser pulse is input into the metal coated fiber IB, and the optical fiber 30, the fiber guide 35, and the contact part IB-3 are fused together via the respective metal coat layers by the leakage light 11 from the bent part. to join. Thereafter, when the metal coated fiber IB is cut at the cutting line 37 using the same means as in the first embodiment, the optical fiber 30 is inserted into the fiber guide 35.
Fixed. The fiber guide 35 to which the optical fiber 30 is fixed is aligned with the light transmitting/receiving element 31 (z).

y- and z-axis directions (arrows in the figure), the fiber guide 35 is fixed to the substrate 36. Further, in the same manner as in the first embodiment, the electrode 32 of the light transmitting/receiving element 31 is connected to an external lead (
Wire bonding is performed to the electrode portion 20) for electrical wiring (metal coated fiber IE for electrical wiring), and assembly of the light transmitting/receiving element is completed. In addition, when the shape of the groove 35-1 of the fiber guide 35 is a V-groove, as shown in FIG. -3 may be juxtaposed using the method of this embodiment.

For reference, the optical fiber 30 is connected to the fiber guide 3.
A conventional example of the method of fixing the optical fiber 30 in the groove 35-1 is shown in FIG.
and the fiber guide is the metal coat 3 of the optical fiber 30.
0-1 and the metal coat layer 33 of the fiber guide 35
soldered through.

This embodiment has the following advantages when compared with the method shown in FIG.

(1) During fixation, the fiber can be directly pressed into the groove of the fiber guide and tightly fixed from beginning to end, so unlike the method shown in Figure 6, there is less positional deviation due to the optical fiber floating in the groove, and the positioning accuracy is improved. improves.

(2) Fixation time is short.

(3) In order to bond the fiber guide, metal coated fiber, and fixing member through a thin metal coat layer, fill the space between the groove and the optical fiber with solder and fix as shown in the method shown in Figure 6. The amount of positional shift and thermal stress due to temperature fluctuations can be reduced compared to the case where the

FIG. 4 is a perspective view showing a third embodiment of the present invention, and FIG. 4(a) is a perspective view showing a third embodiment of the present invention.
E I C) Optical wiring path IL of metal coated fiber between
A perspective view showing the step of connecting -1, FIG. 4(b) O
Input fiber set groove 45-1 formed in EIC41
Diagram showing the steps of fusing metal-coated fiber to
FIG. 4(c) is a diagram showing the step of cutting the metal-coated fiber IL, one end of which was fused in the step of FIG. 4(b), in the output fiber setting groove 45-2, and FIG.
) is a diagram showing the step of fusing the metal coated fiber IL cut in the step of FIG. 4(c) to the output fiber set groove 45-2.

In the first embodiment described above, a metal coated fiber is used as the electrical wiring path, and in the second embodiment,
We have shown a case where a metal coated fiber is used as a fixing member to fuse the optical fiber to the groove of the fiber guide.
In this embodiment, a metal coated fiber is used as the optical wiring path.

Opto-electrical integrated circuits (OEICs) 41 and 42 are LSIs that are mounted on the substrate 36 and convert an input optical signal into an electrical signal, perform signal processing, and convert it back into an optical signal for output. The light receiving element 31R1 and the light transmitting element 31E are included in the 0EIC, and the light receiving element 31R converts an input optical signal into an electrical signal, and the light transmitting element 31E converts the input electrical signal into an optical signal.

Slab type optical waveguide 48-1.48-2 (Fig. 4(b)
)-(d)) are formed on the OEIC, and include optical fibers and light transmitting/receiving elements 31E, 31. Connect R. The optical passive component 43 performs branching, combining, attenuation, etc. of light. In the optical wiring path LL, IL- drawn with a dotted line in the center of FIG. 4(a)
1 is an optical wiring path to be connected from now on. The input optical cord (input optical fiber core wire) 44-1 is connected to the board 36
By manually inputting optical signals from the outside to the 0EIC42 mounted on the
The output optical cord (output optical fiber core wire) 44-2 outputs an optical signal from the 0EIC 41 mounted on the board 36 to the outside.

In the optical device shown in FIG. 4(a), an optical signal input from an input optical cord 44-1 is converted into an electrical signal by a light receiving element of 0EIC42, and after signal processing is performed, it is converted into an optical signal again by a light transmitting element. Converted and drawn with dotted lines (to be connected)
0 through the optical wiring path IL-1 (metal coated fiber)
After being converted into an electrical signal by the light receiving element of the EIC41 and subjected to signal processing, it is again converted to an optical signal by the light transmitting element.
The optical wiring path for the optical signal outputted via the optical fiber 30 and the output optical cord 44-2, and the optical signal input from the input optical cord 44-1 to the 0EIC 42 are converted into electrical signals and subjected to signal processing. After that, the optical signal is converted to an optical signal again, passes through the optical wiring line LL-2 (metal coated fiber), is branched by the optical passive component 43, and is output from the output optical cord 44-2. It has become.

The optical wiring path LL-1 between the 0EICs 41 and 42 is formed as follows.

0EIC chips 41, 42 and passive components 43 on the board 36
etc. is mounted and fixed, a metal-coated fiber IL for optical wiring (hereinafter referred to as metal-coated fiber IL) whose end face is cut at 90° is protruded from the capillary 2 by a predetermined amount, and its tip (contact part) 1 -3 is brought into contact with the end surface of the optical waveguide 48, and is pressed and set by the capillary 2 into the input fiber setting groove 45-1 formed in the 0EIC 41, and the curvature regulating part 2-1 of the capillary 2 is set. A zero-order YAG laser pulse is applied to bend the metal coated fiber IL along the bending portion, and the laser beam is leaked from the bent portion to melt the metal coat 30-1 and the metal coat layer 33 (see FIG. 3(b)). The contact portion 1-3 is fixed by bonding. (FIG. 4(b)) Then, by the method described in the first embodiment, the output fiber of 0EIC:42 is wired with a slight slack toward the output fiber setting groove 45-2 of the other 0EIC42. Set groove 45-
With the metal coated fiber IL set in the fiber 2, the metal coated fiber IL is cut along the cutting line 37 at an angle of 90' with respect to the fiber axis. (FIG. 4(C)) After that, the capillary 2 is raised one step to reduce the pressing force applied to the optical wiring path IL-1, and the end face 1-4 of the optical wiring path IL-1 is adjusted to 0EIC'42. The tip of the wiring IL-1 is pressed again with the capillary 2, and the YAG laser is applied to the end of the wiring IL-1 from the cut end of the metal coated fiber IL-1. 0E after irradiation
The optical wiring path IL-1 is fixed on the IC42 side. (Figure 4 (
d)) Also, as a method for cutting the metal coated fiber IL in FIG. 4(C), for example, the length of the metal coated fiber LL is taken into consideration in advance and the metal coated fiber 1 is cut at a predetermined position. Then, use a super steel blade, a diamond blade, etc. to pierce the metal coat 30-1 and connect it to the optical fiber 30.
Cutting scratches 37 of a predetermined depth are made perpendicular to the axis, and when the scratches reach the bending part of the capillary 2, bending (bending) and applying tension to the metal coated fiber IL causes the scratches to grow. It may be propagated and then cut.

In addition, if a slight extra length is added to the wiring length between 0EICs, when connecting on the 0EIC42 side, the elastic restoring force of the metal coated fiber LL will cause the end face to -4 can be easily brought into contact with the end face of the optical waveguide 48-2 of the 0EIC42. The optical wiring path IL-2 between the 0EIC 42 and the passive component 43 can also be wired in the same manner as the optical wiring path IL-1. In addition, the light transmitting/receiving element 31 (
31E, 31R) and the electrode 20-1 of the substrate 36
The electrical wiring between them is wire-bonded at the same time using the method described in the first embodiment. It goes without saying that in the optical wiring of this embodiment, the metal coat layer can be used as an electrical signal path if necessary.

In this way, the wire bonding method of the present invention is 0EIC.
The present invention can also be applied to optical wiring between each other or between 0EICs and optical passive components, and as in the case of the second embodiment, highly reliable optical wiring can be achieved with high accuracy and short bonding time. Additionally, compared to wiring using conventional optical fiber core wires (φ0.8 mm1) or optical cords (φ2-3 mm), optical wiring using metal-coated fibers (100-150 μm) can significantly reduce the wiring space. ,0
Electricity of optical hybrid IC (optical device C) using EIC,
The method of the present invention can also be applied to optical wire bonding.

[Effect of the invention] As explained above, the present invention has the following effects.

1. When fusing a metal-coated fiber to an object, there is no need to heat the entire object or apply mechanical vibrations, so the object is less likely to suffer thermal or mechanical damage, making it reliable. It is possible to achieve high quality wire bonding.

2. Laser light is used as a means of fusing the metal-coated fiber and the object, and the laser light with high energy density is irradiated only to the area to be fused, making it possible to speed up wire bonding. .

3. Since the first portion of the metal-coated fiber is fused to the object while being pressed, the position of the first portion does not shift during bonding, and therefore highly accurate bonding can be achieved.

4. By partially changing the capillary and wire control method of a conventional wire bonding device, the conventional device can be easily applied to the present invention.

5. When the method of the present invention is applied to the connection of electrical wiring between high-frequency LSIs, stray capacitance is small and impedance mismatch is reduced.

6. When the method of the present invention is applied to fixing optical components such as transceiver modules and optical fibers, or to optical hybrid ICs using 0EIC, it is possible to fix optical fibers with high precision, short bonding time, and high reliability. and optical wiring can be realized.

[Brief explanation of drawings]

FIG. 1(a) is a cross-sectional view of a metal coated fiber used in the wire bonding method of the present invention, and FIG. 1(b) is a block diagram of an embodiment of a wire bonding apparatus for performing the wire bonding method of the present invention. , FIG. 2 is an explanatory diagram of the wire bonding method of the present invention, and FIG. 2(a)
2(b) and 2(c) are diagrams showing the respective steps of wire bonding the metal coated fiber 1 to the electrode part 20 mounted on the lead frame 23 and the electrode 20-1 formed on the LSI chip 21. ) is a diagram showing the arrangement of the metal coated fiber 1 and the capillary 2 when the metal coated fiber 1 is wire bonded to each electrode 20-1.20, FIG. 2(d),
(e) is a cross-sectional view and a plan view of the melt-bonded portion of the metal-coated fiber 1 and the electrode part 20 or 20-1, and FIG. 3 is a perspective view showing a second embodiment of the present invention. ,
FIG. 3(a) is a perspective view showing the step of attaching the light transmitting/receiving optical fiber 30 to the groove 35-1 of the fiber guide 35 attached on the substrate 36, and FIGS. 3(b) and (c)
4 is a diagram showing the arrangement of the transmission/reception charging optical fiber 30 and the bonding metal-coated fiber IB when the cross section of the groove of the fiber guide 35 is rectangular and V-shaped, respectively. FIG. 4 shows the third embodiment of the present invention. In a perspective view showing an example, the fourth
Figure (a) shows an opto-electrical integrated circuit (
FIG. 4(b) is a perspective view showing the step of connecting the metal-coated fiber optical wiring path IL between the 0EI
A fourth diagram showing the step of fusing the metal coated fiber to the input fiber setting groove 45-1 formed in C41.
Figure (C) shows how the metal coated fiber IL, one end of which was fused in the step of Figure 4 (b), is inserted into the output fiber setting groove 4.
FIG. 4(d) is a diagram showing the step of cutting in step 5-2, and shows the step of fusing the metal coated fiber IL cut in the step of FIG. 4(C) to the output fiber set groove 45-2. Figures 5(a) and 5(b) are explanatory diagrams of wire bonding methods using a thermocompression method and an ultrasonic wedge method, respectively, and FIG. 6 is a diagram showing a conventional example of a method for fixing an optical fiber to a fiber guide. It is. DESCRIPTION OF SYMBOLS 1...Metal coated fiber, 1-1...Optical fiber, 1-2...Metal layer, 1-3...Contact part, 1-4...Cut end surface, 1B...For bonding Metal coated fiber, IE
...Metal coated fiber for electrical wiring, IL...Metal coated fiber for optical wiring, 2...Capillary, 2-1...Curvature regulation part, 3...Feed roller, 4...Bonding head , 5... Capillary drive mechanism, 6... YAG laser oscillation unit, 7... Optical coupling unit, 8... Laser driver, 9... Host computer, 10... Control unit, 11...・Leakage light, 12... Melting part, 20.20-1.32... Electrode part, 21... LSI chip, 22... Joint part, 23... Lead frame, 30... Feeding Optical fiber for light reception, 30-1...Metal coat, 31...Light transmitting/receiving element, 31E...Light transmitting element, 31R...Light receiving element, 33...Metal coat number, 34... Core Line, 35...Fiber guide, 35-1.45-2-...Groove, 36...Substrate, 37...Cutting line, 41.42...0EIC. 43... Optical passive component, 44-1... Input optical cord, 44-2... Output optical cord, 45-1... Input fiber set groove, 45-2...
Output fiber set groove, 48-1.48-2... optical waveguide.

Claims (1)

[Claims] 1. A wire bonding method in which a wire having a metal surface is fixed to an object having a metal surface, the wire being manufactured by coating the outer surface of an optical fiber with metal, An arbitrarily selected first portion is brought into contact with and pressed against the object, and a portion of the wire adjacent to the first portion is bent at a predetermined curvature in a plane substantially perpendicular to the surface of the object. , a laser beam is incident into the second portion from the end of the second portion of the wire connected to the bent portion, and the laser beam leaking from the bent portion of the wire causes contact with the metal on the outside of the wire. A wire bonding method characterized by fixing the wire to the object by fusing metal on the surface of the object to each other.