JPH0231167U - - Google Patents

Info

Publication number
JPH0231167U
JPH0231167U JP11050388U JP11050388U JPH0231167U JP H0231167 U JPH0231167 U JP H0231167U JP 11050388 U JP11050388 U JP 11050388U JP 11050388 U JP11050388 U JP 11050388U JP H0231167 U JPH0231167 U JP H0231167U
Authority
JP
Japan
Prior art keywords
submount
vertical movement
movement unit
chip carrier
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11050388U
Other languages
English (en)
Japanese (ja)
Other versions
JPH08773Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11050388U priority Critical patent/JPH08773Y2/ja
Publication of JPH0231167U publication Critical patent/JPH0231167U/ja
Application granted granted Critical
Publication of JPH08773Y2 publication Critical patent/JPH08773Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP11050388U 1988-08-22 1988-08-22 レーザダイオード用チップボンディング装置における位置決め機構 Expired - Lifetime JPH08773Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11050388U JPH08773Y2 (ja) 1988-08-22 1988-08-22 レーザダイオード用チップボンディング装置における位置決め機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11050388U JPH08773Y2 (ja) 1988-08-22 1988-08-22 レーザダイオード用チップボンディング装置における位置決め機構

Publications (2)

Publication Number Publication Date
JPH0231167U true JPH0231167U (enrdf_load_stackoverflow) 1990-02-27
JPH08773Y2 JPH08773Y2 (ja) 1996-01-10

Family

ID=31347725

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11050388U Expired - Lifetime JPH08773Y2 (ja) 1988-08-22 1988-08-22 レーザダイオード用チップボンディング装置における位置決め機構

Country Status (1)

Country Link
JP (1) JPH08773Y2 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH08773Y2 (ja) 1996-01-10

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