JPH0231129U - - Google Patents
Info
- Publication number
- JPH0231129U JPH0231129U JP1988110291U JP11029188U JPH0231129U JP H0231129 U JPH0231129 U JP H0231129U JP 1988110291 U JP1988110291 U JP 1988110291U JP 11029188 U JP11029188 U JP 11029188U JP H0231129 U JPH0231129 U JP H0231129U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin material
- molten resin
- lead frame
- passage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims 2
- 238000005538 encapsulation Methods 0.000 claims 1
- 238000003466 welding Methods 0.000 claims 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Reinforced Plastic Materials (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988110291U JPH0510361Y2 (US07345094-20080318-C00003.png) | 1988-08-22 | 1988-08-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988110291U JPH0510361Y2 (US07345094-20080318-C00003.png) | 1988-08-22 | 1988-08-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0231129U true JPH0231129U (US07345094-20080318-C00003.png) | 1990-02-27 |
| JPH0510361Y2 JPH0510361Y2 (US07345094-20080318-C00003.png) | 1993-03-15 |
Family
ID=31347317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988110291U Expired - Lifetime JPH0510361Y2 (US07345094-20080318-C00003.png) | 1988-08-22 | 1988-08-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0510361Y2 (US07345094-20080318-C00003.png) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0470112U (US07345094-20080318-C00003.png) * | 1990-10-23 | 1992-06-22 | ||
| JPH07156207A (ja) * | 1993-12-10 | 1995-06-20 | Nec Corp | 樹脂封止用金型 |
| JP2008149677A (ja) * | 2006-12-20 | 2008-07-03 | Sumitomo Heavy Ind Ltd | 樹脂封止金型 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS501662A (US07345094-20080318-C00003.png) * | 1973-05-07 | 1975-01-09 | ||
| JPS61146517A (ja) * | 1984-12-20 | 1986-07-04 | Sanyo Electric Co Ltd | 半導体装置の樹脂封止用金型 |
-
1988
- 1988-08-22 JP JP1988110291U patent/JPH0510361Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS501662A (US07345094-20080318-C00003.png) * | 1973-05-07 | 1975-01-09 | ||
| JPS61146517A (ja) * | 1984-12-20 | 1986-07-04 | Sanyo Electric Co Ltd | 半導体装置の樹脂封止用金型 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0470112U (US07345094-20080318-C00003.png) * | 1990-10-23 | 1992-06-22 | ||
| JPH07156207A (ja) * | 1993-12-10 | 1995-06-20 | Nec Corp | 樹脂封止用金型 |
| JP2008149677A (ja) * | 2006-12-20 | 2008-07-03 | Sumitomo Heavy Ind Ltd | 樹脂封止金型 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0510361Y2 (US07345094-20080318-C00003.png) | 1993-03-15 |
