JPH02304809A - Insulated wire - Google Patents
Insulated wireInfo
- Publication number
- JPH02304809A JPH02304809A JP12539889A JP12539889A JPH02304809A JP H02304809 A JPH02304809 A JP H02304809A JP 12539889 A JP12539889 A JP 12539889A JP 12539889 A JP12539889 A JP 12539889A JP H02304809 A JPH02304809 A JP H02304809A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- pts
- heat resistance
- insulated wire
- diphenylmethane diisocyanate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001228 polyisocyanate Polymers 0.000 claims abstract description 23
- 239000005056 polyisocyanate Substances 0.000 claims abstract description 23
- 239000002253 acid Substances 0.000 claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 17
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000003973 paint Substances 0.000 claims abstract description 12
- 150000001875 compounds Chemical class 0.000 claims abstract description 10
- 239000004020 conductor Substances 0.000 claims abstract description 6
- 230000000087 stabilizing effect Effects 0.000 claims abstract description 5
- 229920005862 polyol Polymers 0.000 claims description 6
- 150000003077 polyols Chemical class 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 2
- 239000002981 blocking agent Substances 0.000 claims 2
- 229920002635 polyurethane Polymers 0.000 abstract description 11
- 239000004814 polyurethane Substances 0.000 abstract description 8
- 230000009477 glass transition Effects 0.000 abstract description 3
- 238000013329 compounding Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- ZFLIKDUSUDBGCD-UHFFFAOYSA-N parabanic acid Chemical compound O=C1NC(=O)C(=O)N1 ZFLIKDUSUDBGCD-UHFFFAOYSA-N 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 10
- 238000009413 insulation Methods 0.000 description 4
- 150000002989 phenols Chemical class 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- HNNQYHFROJDYHQ-UHFFFAOYSA-N 3-(4-ethylcyclohexyl)propanoic acid 3-(3-ethylcyclopentyl)propanoic acid Chemical compound CCC1CCC(CCC(O)=O)C1.CCC1CCC(CCC(O)=O)CC1 HNNQYHFROJDYHQ-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
- Organic Insulating Materials (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は半田付性に優れかつ耐熱性の良好な絶縁電線に
関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an insulated wire with excellent solderability and good heat resistance.
(従来の技術とその問題点)
ポリウレタン絶縁電線は絶縁皮膜をはくすする事なく、
そのまま半田付けが出来るため、電子機器用巻線として
広く使用されている。(Conventional technology and its problems) Polyurethane insulated wire can be used without removing the insulation film.
Since it can be soldered as is, it is widely used as winding wire for electronic devices.
最近、機器の小型化高性能化が進み、機器の使用雰囲気
温度が上昇し、使用部品の耐熱性向上が要求されはじめ
ている。Recently, equipment has become smaller and more sophisticated, the ambient temperature in which the equipment is used has increased, and there has been a demand for improved heat resistance of the parts used.
従って従来のポリウレタン絶縁電線では耐熱性の要求を
満足出来なくなる用途も現われ、一部ポリエステル絶縁
電線やエステルイミド絶縁電線が使用されはじめている
。Therefore, there are some applications in which conventional polyurethane insulated wires cannot satisfy the heat resistance requirements, and polyester insulated wires and esterimide insulated wires have begun to be used in some cases.
上記のポリエステル、エステルイミド絶縁電線を使用す
ると耐熱性は満足するものの、半田付けが出来ないとい
う問題点があり、ユーザーにおいては耐熱性を優先する
か、端末処理の容易さを優先するか選択に悩んでおり、
耐熱性、半田付性の両方を合せもつ絶縁電線が強く要求
されている。When using the above polyester or esterimide insulated wire, the heat resistance is satisfactory, but there is a problem that it cannot be soldered, and the user has to choose whether to prioritize heat resistance or ease of terminal processing. I'm worried,
There is a strong demand for insulated wires that have both heat resistance and solderability.
本発明者は、上記問題点について鋭意検討した結果、ポ
リパラパン酸樹脂に特定の安定化ポリイソシアネートを
適量配合した絶縁塗料を導体上に塗布・焼付する事によ
りポリパラパン酸樹脂の優れた耐熱性を保持しながら、
半田付の可能な絶縁電線を得る事に成功したものである
。As a result of intensive study on the above-mentioned problems, the present inventor maintained the excellent heat resistance of polyparapanoic acid resin by applying and baking an insulating paint containing polyparapanoic acid resin and an appropriate amount of a specific stabilized polyisocyanate onto the conductor. while doing,
We succeeded in obtaining an insulated wire that can be soldered.
従来、ポリパラパン酸樹脂は優れた耐熱性をもつ事及び
安定化ポリイソシアネートと反応し、半田付性をもたら
すウレタン結合を形成出来るヒドロキシル基を分子中に
もたない事により、安定化ポリイソシアネートを配合し
ても、耐熱性を下げる事なく半田付性を有する事は出来
ないと考えられていた。Conventionally, polyparapanic acid resin has excellent heat resistance and does not have a hydroxyl group in its molecule that can react with the stabilized polyisocyanate to form urethane bonds that provide solderability, so it has been formulated with stabilized polyisocyanate. However, it was thought that it was not possible to achieve solderability without reducing heat resistance.
しかし、本発明者はポリパラパン酸樹脂に配合する安定
化ポリイソシアネートの種類、配合量を限定する事によ
り、ポリパラパン酸樹脂の耐熱性を生かし、半田付性を
もたせる事に成功する事が出来たものである。However, by limiting the type and amount of stabilizing polyisocyanate blended into the polyparapanoic acid resin, the present inventors were able to take advantage of the heat resistance of the polyparapanoic acid resin and successfully impart solderability to the polyparapanoic acid resin. It is.
(発明の構成〕
本発明はポリパラパン酸樹脂100重量部に対しジフェ
ニルメタンジイソシアネートより得られた安定化ポリイ
ソシアネート化合物を75重量部〜400重量部加えた
絶縁塗料を導体上に塗布・焼付した事を特徴とする絶縁
電線である。(Structure of the Invention) The present invention is characterized in that an insulating paint in which 75 to 400 parts by weight of a stabilized polyisocyanate compound obtained from diphenylmethane diisocyanate is added to 100 parts by weight of polyparapanic acid resin is applied and baked on a conductor. This is an insulated wire.
本発明において、ポリパラパン酸樹脂とは以下に示す一
般式をもつものを言う。In the present invention, polyparapanic acid resin refers to one having the general formula shown below.
上記一般式中、Rは脂肪族残基又は芳香族残基を示し、
本発明においては芳香族残基の方が好ましい。In the above general formula, R represents an aliphatic residue or an aromatic residue,
In the present invention, aromatic residues are preferred.
芳香族残基の具体的な例としては以下のものがある。Specific examples of aromatic residues include the following.
CHa
尚、上記芳香族の水素原子は、CHa 、 CH3C
H2、等のアルキル基、CH2=CH−、CH2=CH
−(:Hz−1等のアルケニル基、Br、 C(1、
等のハロゲン等で置換されたものであってもよい。CHa Furthermore, the above aromatic hydrogen atom is CHa, CH3C
Alkyl groups such as H2, CH2=CH-, CH2=CH
-(: Alkenyl group such as Hz-1, Br, C(1,
It may be substituted with a halogen such as.
上記のポリパラパン酸の商品化された例としては以下の
化学構造式で示される東燃石油化学社製のツルラック等
がある。Commercialized examples of the above polyparapanic acid include Trulac, manufactured by Tonen Petrochemical Co., Ltd., which is represented by the following chemical structural formula.
ジフェニルメタンジイソシアネートより得られた安定化
ポリイソシアネートとはジフェニルメタンジイソシアネ
ート単独、又は、ジフェニルメタンジイソシアネートと
ポリオール、ポリアミン、ポリカルボン酸等と反応させ
る事により得られたポリイソシアネートのイソシアネー
ト基をフェノール類、アルコール類、カプロラクタム類
等の公知のブロンク剤でブロックした化合物であればい
かなるものでも使用出来る。Stabilized polyisocyanate obtained from diphenylmethane diisocyanate is diphenylmethane diisocyanate alone, or polyisocyanate obtained by reacting diphenylmethane diisocyanate with a polyol, polyamine, polycarboxylic acid, etc. The isocyanate group is combined with phenols, alcohols, caprolactam, etc. Any compound blocked with a known bronching agent such as the following can be used.
具体的な例としては、ジフェニルメタンジイソシアネー
トとポリオールより得られたポリイソシアネートをフェ
ノール類でブロックした日本ポリウレタン社製コロネー
ト2503 、ジフェニルメタンジイソシアネートをフ
ェノール類でブロックした日本ポリウレタン社製ミリオ
ネー) M S −50。Specific examples include Coronate 2503 (manufactured by Nippon Polyurethane Co., Ltd.), which is a polyisocyanate obtained from diphenylmethane diisocyanate and a polyol blocked with phenols, and Millionaire (M S-50, manufactured by Nippon Polyurethane Co., Ltd.), which is made by blocking diphenylmethane diisocyanate with phenols.
等がある。etc.
本発明では、ジフェニルメタンジイソシアネートより得
られる安定化ポリイソシアネート以外では効果を発揮し
ない。The present invention is not effective with stabilized polyisocyanates other than those obtained from diphenylmethane diisocyanate.
例えば、ポリオールとトリレンジイソシアネートより得
られた安定化ポリイソシアネートを用いると半田付性は
良好なものの、絶縁皮膜の可とう性が乏しいものしか得
られず、トリレンジイソシアネートの三量体より得られ
たインシアヌル環を含む安定化ポリイソシアネートを用
いると絶縁皮膜の可とう性は良好なものの半田付が出来
ない。For example, when using a stabilized polyisocyanate obtained from a polyol and tolylene diisocyanate, the solderability is good, but the flexibility of the insulating film is poor; When a stabilized polyisocyanate containing an incyanuric ring is used, the insulating film has good flexibility but cannot be soldered.
本発明においては、ポリアミドイミド樹脂100重量部
に対しジフェニルメタンジイソシアネートより得られた
安定化ポリイソシアネート化合物を75重量部〜400
重量部加える必要がある。In the present invention, 75 to 400 parts by weight of a stabilized polyisocyanate compound obtained from diphenylmethane diisocyanate is added to 100 parts by weight of the polyamide-imide resin.
It is necessary to add parts by weight.
75重量部以下であると得られた絶縁電線が半田付出来
なくなり、400重量部以上であると得られた絶縁電線
の耐熱性向上が小さく、絶縁皮膜の可とう性も低下する
。If it is less than 75 parts by weight, the obtained insulated wire will not be solderable, and if it is more than 400 parts by weight, the heat resistance of the obtained insulated wire will be little improved and the flexibility of the insulating film will also be reduced.
本発明の絶縁塗料に使用される溶剤としては、ポリパラ
パン酸樹脂の溶剤として使用される、NM2P、 DM
AC,DMF等とソルベントナフサ、トルエン、キシレ
ン等の稀釈剤の組み合せが好ましいが、通常の焼付塗料
において用いられるフェノール、クレゾール類も使用す
る事も出来る。Solvents used in the insulating paint of the present invention include NM2P and DM, which are used as solvents for polyparapanic acid resin.
A combination of AC, DMF, etc. and a diluent such as solvent naphtha, toluene, xylene, etc. is preferred, but phenols and cresols used in ordinary baking paints can also be used.
本発明の絶縁塗料には必要に応じて、ナフテン酸や、オ
クテン酸の金属塩や三級アミン等の°硬化触媒を使用す
る事も出来る。If necessary, a temperature curing catalyst such as naphthenic acid, a metal salt of octenoic acid, or a tertiary amine can be used in the insulating coating of the present invention.
本発明の絶縁塗料には、本発明の特徴を損わない程度に
ポリビニルホルマール、ポリアミド等の熱可塑性樹脂、
エポキシ樹脂、メラミン樹脂、フェノール樹脂等の熱硬
化性樹脂、フィラー、顔料、染料、界面活性剤、潤滑剤
等を加える事も可能である。The insulating paint of the present invention includes thermoplastic resins such as polyvinyl formal and polyamide, to the extent that the characteristics of the present invention are not impaired.
It is also possible to add thermosetting resins such as epoxy resins, melamine resins, and phenolic resins, fillers, pigments, dyes, surfactants, lubricants, and the like.
以下の実施例において本発明の詳細な説明するが本発明
はこれら実施例に限定されるものではない。The present invention will be explained in detail in the following examples, but the present invention is not limited to these examples.
(比較例1)
汎用のポリウレタン塗料(束特塗料社製TPU−515
5)を0.3胴yの銅導体上に皮膜厚0.020印とな
るように塗布・焼付した。得られたポリウレタン絶縁電
線の一般特性(構造、可とう性、半田付性)絶縁皮膜の
ガラス転移温度を測定した結果を表1に示す。(Comparative Example 1) General-purpose polyurethane paint (TPU-515 manufactured by Tsukoku Toyo Co., Ltd.
5) was coated and baked on a 0.3 mm y copper conductor so that the film thickness was 0.020 mark. Table 1 shows the results of measuring the general characteristics (structure, flexibility, solderability) and glass transition temperature of the insulating film of the obtained polyurethane insulated wire.
(比較例2)
耐熱のポリウレタン塗料(オート化学社製ATH−60
5)を比較例1と同様にして、ポリウレタン絶縁電線の
作製、特性評価を行なった。(Comparative Example 2) Heat-resistant polyurethane paint (ATH-60 manufactured by Auto Kagaku Co., Ltd.)
5) in the same manner as Comparative Example 1, a polyurethane insulated wire was produced and its characteristics were evaluated.
結果を表1に示す。The results are shown in Table 1.
(実施例1)
ポリパラパン酸絶縁塗料(東燃石油化学社製ツルラック
XT−4)の樹脂分100重量部に対してポリオールと
ジフェニルメタンジイソシアネートより得られた安定化
ポリイソシアネートである日本ポリウレタン社製コロネ
ー) 2503 C以下コロネー) 2503と略す)
を200重量部加え、溶解混合した絶縁塗料を用い比較
例1と同様にして絶縁電線の作製・特性評価を行なった
。(Example 1) Coronet (manufactured by Nippon Polyurethane Co., Ltd.) 2503, which is a stabilized polyisocyanate obtained from a polyol and diphenylmethane diisocyanate, based on 100 parts by weight of the resin content of polyparapanic acid insulation paint (Tsurlac XT-4, manufactured by Tonen Petrochemical Co., Ltd.) (Corone (hereinafter referred to as C)) (abbreviated as 2503)
An insulated wire was prepared and its characteristics were evaluated in the same manner as in Comparative Example 1 using an insulating coating material in which 200 parts by weight of 200 parts by weight were added and dissolved.
結果を表1に示した。The results are shown in Table 1.
(*施例2,3)
ポリパラパン酸絶縁塗料の樹脂分100重量部に対する
コロネート2503の添加量を100重量部(実施例2
)、300重量部(実施例3)とした以外は実施例1と
同様にして絶縁電線の作製・特性評価を行なった。結果
を表1に示した。(*Example 2, 3) The amount of Coronate 2503 added to 100 parts by weight of the resin content of the polyparapanic acid insulation paint was 100 parts by weight (Example 2).
), 300 parts by weight (Example 3), an insulated wire was produced and its characteristics were evaluated in the same manner as in Example 1. The results are shown in Table 1.
(比較例3,4)
ポリパラパン酸絶縁塗料の樹脂分100重量部に対する
コロネート2503の添加量を50重量部(比較例3)
、500重量部(比較例4)とした以外は実施例1と同
様にして絶縁電線の作製・特性評価を行なった。結果を
表1に示した。(Comparative Examples 3 and 4) The amount of Coronate 2503 added was 50 parts by weight based on 100 parts by weight of the resin content of the polyparapanic acid insulation paint (Comparative Example 3)
, 500 parts by weight (Comparative Example 4), an insulated wire was produced and its characteristics were evaluated in the same manner as in Example 1. The results are shown in Table 1.
(実施例4.比較例5,6)
コロネート2503の代りにジフェニルメタンジイソシ
アネートより得られた安定化ポリイソシアネートである
ミリオネートMs−50(実施例4)ポリオールとトリ
レンジイソシアネートより得られた安定化イソシアネー
トであるデスモジュールApステーブル(比較例5)、
インシアヌル環を含む安定化イソシアネートであるデス
ーモジュールCTステーブル(比較例6)をそれぞれ用
いたほかは実施例1と同様にして絶縁電線の作製・特性
評価を行なった。(Example 4. Comparative Examples 5 and 6) Millionate Ms-50, a stabilized polyisocyanate obtained from diphenylmethane diisocyanate instead of Coronate 2503 (Example 4) A stabilized isocyanate obtained from polyol and tolylene diisocyanate. A certain desmodule Ap stable (comparative example 5),
Insulated wires were produced and their characteristics were evaluated in the same manner as in Example 1, except that Desumodur CT Stable (Comparative Example 6), which is a stabilized isocyanate containing an incyanuric ring, was used.
結果は表1に示した。The results are shown in Table 1.
(発明の効果)
以上説明したように本発明の絶縁電線は、従来のものよ
りガラス転移温度が上がり、耐熱性が向上する。(Effects of the Invention) As explained above, the insulated wire of the present invention has a higher glass transition temperature and improved heat resistance than conventional wires.
又、従来のポリウレタン絶縁電線と同様に半田付も出来
る。従って本発明の工業的価値は大きい。Additionally, it can be soldered in the same way as conventional polyurethane insulated wires. Therefore, the industrial value of the present invention is great.
Claims (3)
ニルメタンジイソシアネートより得られた安定化ポリイ
ソシアネート化合物を75重量部〜400重量部加えた
絶縁塗料を導体上に塗布・焼付した事を特徴とする絶縁
電線。(1) An insulated wire characterized by coating and baking on a conductor an insulating paint made by adding 75 to 400 parts by weight of a stabilized polyisocyanate compound obtained from diphenylmethane diisocyanate to 100 parts by weight of polyparapanic acid resin. .
安定化ポリイソシアネート化合物がジフェニルメタンジ
イソシアネートのイソシアネート基をブロック剤で安定
化したポリイソシアネート化合物である請求項1記載の
絶縁電線。(2) The insulated wire according to claim 1, wherein the stabilized polyisocyanate compound obtained from diphenylmethane diisocyanate is a polyisocyanate compound obtained by stabilizing the isocyanate groups of diphenylmethane diisocyanate with a blocking agent.
安定化ポリイソシアネート化合物がポリオールとジフェ
ニルメタンジイソシアネートより得られたポリイソシア
ネートをブロック剤で安定化した安定化ポリイソシアネ
ート化合物である請求項1記載の絶縁電線。(3) The insulated wire according to claim 1, wherein the stabilized polyisocyanate compound obtained from diphenylmethane diisocyanate is a stabilized polyisocyanate compound obtained by stabilizing the polyisocyanate obtained from a polyol and diphenylmethane diisocyanate with a blocking agent.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12539889A JPH02304809A (en) | 1989-05-17 | 1989-05-17 | Insulated wire |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12539889A JPH02304809A (en) | 1989-05-17 | 1989-05-17 | Insulated wire |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02304809A true JPH02304809A (en) | 1990-12-18 |
Family
ID=14909150
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12539889A Pending JPH02304809A (en) | 1989-05-17 | 1989-05-17 | Insulated wire |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02304809A (en) |
-
1989
- 1989-05-17 JP JP12539889A patent/JPH02304809A/en active Pending
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