JPH02298054A - Cooling apparatus - Google Patents

Abstract

PURPOSE:To cool a semiconductor element uniformly and with good efficiency by installing the following: a first nozzle which jets a coolant to nearly the central part of the semiconductor element; a second nozzle which jets a coolant to a part near a circumference of the semiconductor element. CONSTITUTION:A coolant flowing from a first entrance is passed through a first coolant-supply tube 41 and is jetted to nearly central parts of semiconductor elements 31 to 33 from first nozzles 4. A coolant flowing from a second entrance is passed through a second coolant-supply tube 51 and is jetted to parts near circumferences of the semiconductor elements 31 to 33 from second nozzles 5. When a double nozzle 6 provided with an inside nozzle 61 and an outside nozzle 62 is used, a cooling capacity can be enhanced. That is to say, a pressure of the coolant at the outside of its flow is lowered by a flow of the coolant which is jetted from the inside nozzle 61; the coolant flowing from the upper part between the inside nozzle 61 and the outside nozzle 62 surrounding the inside nozzle 61. When the coolant is jetted radially by using a grooved nozzle 7 provided with grooved 71 extended radially toward parts around the semiconductor elements, the semiconductor elements can be cooled efficiently not only at the central parts but also at the circumferences.

Description

DETAILED DESCRIPTION OF THE INVENTION [Summary] The present invention relates to a cooling device, and particularly to a cooling device for cooling semiconductor elements.

The purpose is a cooling device that cools semiconductor elements uniformly and efficiently.

A cooling device that cools a semiconductor element by immersing the semiconductor element in a refrigerant and circulating the refrigerant, [l] Disposed above the semiconductor element, and injecting the refrigerant approximately at the center of the semiconductor element. [2] A cooling device having a first nozzle and a second nozzle arranged close to the periphery of the semiconductor element and injecting a coolant near the periphery of the semiconductor element; [2] a cooling device arranged above the semiconductor element; , a double nozzle consisting of an inner nozzle that injects a refrigerant almost to the center of the semiconductor element, and an outer nozzle that is disposed outside the inner nozzle and has an inner diameter that gradually decreases downward and is open at the top. and [3] a cooling device disposed above the semiconductor element and having grooves inside thereof extending radially toward the periphery of the semiconductor element.

The cooling device includes a grooved nozzle that injects coolant to the semiconductor element.

[Industrial Application Field] The present invention relates to a cooling device, and particularly to a cooling device for cooling semiconductor elements.

BACKGROUND ART In electronic devices such as high-speed computers that use high-speed semiconductor elements, various measures have been taken to efficiently release heat generated from the semiconductor elements to the outside. In high-speed computers, the amount of heat generated per medium volume has increased dramatically due to the high integration and density of semiconductor devices, and the proportion of the volume occupied by cooling devices for cooling the semiconductor devices has increased. , more efficient and compact cooling equipment is needed.

(Prior Art) Conventionally, as a method for cooling a semiconductor device, there is a liquid cooling method in which the semiconductor device is immersed in a coolant and cooled by forcibly injecting the coolant.

FIG. 4 is a diagram for explaining a conventional example of the cooling device, in which 1 is a refrigerant container, 11 is a refrigerant, and 2 is a base.

31 to 33 are semiconductor elements, 4 is a nozzle, and 41 is a refrigerant supply pipe.

The semiconductor elements 31 to 33 are attached to the base 2 by solder bumps.
Fixed. The refrigerant 11 that has entered the refrigerant supply pipe 41 from the inlet of the refrigerant container 1 is injected from the nozzle 4 above the semiconductor elements 31 to 33 into the center of the semiconductor elements 31 to 33, and the refrigerant 11 flows from the center to the periphery. flows. The inside of the refrigerant container 1 is filled with refrigerant 11.

The refrigerant 11 enters from the inlet and circulates within the refrigerant container l.

Reflux to the outlet.

By the way, in this structure, if the circulation amount of the refrigerant is small, the cooling effect will be small, and the temperature of the semiconductor elements 31 to 33 will rise compared to the temperature of the refrigerant injected from the nozzle 4.
It will rise by 5°C to 40°C. Furthermore, the cooling ability is lower in the peripheral area than in the central area, which is directly hit by the refrigerant injected from the nozzle 4, and the temperature of the semiconductor elements 31 to 33 is non-uniform, such that the peripheral area is higher than the central area. Increase cooling capacity.

In order to reduce temperature non-uniformity, the temperature of the refrigerant to be injected can be lowered and the amount of refrigerant to be injected can be increased.
It is necessary to increase the size of the cooling device, which is not desirable.

[Problems to be Solved by the Invention] Therefore, there is a need for a structure that can suppress the amount of refrigerant circulation as low as possible to increase cooling efficiency and uniformly cool semiconductor elements.

An object of the present invention is to provide a cooling device having such a structure.

[Means for Solving the Problems] Figures 1 to 3 show Examples I to ① of the present invention, and the means for solving the problems described above will be explained with reference to these figures and the reference numerals in the figures. Then.

[1] A cooling device that cools the semiconductor elements 31 to 33 by immersing the semiconductor elements 31 to 33 in a refrigerant and circulating the refrigerant, which is disposed above the semiconductor elements 31 to 33 and cools the semiconductor elements 31 to 33. a first nozzle 4 that injects a refrigerant into approximately the center of the semiconductor element 31 to 33;
to 33 are arranged close to each other.

A cooling bag L having a second nozzle 5 that injects a refrigerant near the periphery of the semiconductor elements 31 to 33 (2:) The semiconductor elements 31 are immersed in the refrigerant and the refrigerant is circulated. A cooling device for cooling the semiconductor elements 31 to 33, which includes an inner nozzle 61 disposed above the semiconductor elements 31 to 33 and injecting a refrigerant to approximately the center of the semiconductor elements 31 to 33, and an inner nozzle 61 disposed outside the inner nozzle. [3] A cooling device having a double nozzle 6 consisting of an outer nozzle 62 whose inner diameter gradually decreases toward the bottom and whose upper part is open; By circulating the semiconductor element 3
1 to 33, which is disposed above the semiconductor elements 31 to 33, and which cools the semiconductor elements 3 to 33.
It has a groove 71 that extends radially toward the periphery of numbers 1 to 33.

The above problem is solved by a cooling device having a grooved nozzle 7 that injects coolant onto the semiconductor elements 31 to 33.

[Function] [1] By simultaneously providing the first nozzle 4 that injects a refrigerant to the center of the semiconductor element and the second nozzle 5 that injects the refrigerant near the periphery of the semiconductor element, the good conductor element 3
1 to 33 can be uniformly cooled around the central portion 1. Moreover, the cooling capacity is improved.

[2] The cooling capacity can be improved by using the double nozzle 6 having the inner nozzle 61 and the outer nozzle 62. That is, the flow of refrigerant injected from the inner nozzle 61 lowers the pressure of the refrigerant outside the flow.

Refrigerant flows from above between the inner nozzle 61 and the outer nozzle 62 surrounding it. Moreover, since the inner diameter of the outer nozzle 62 gradually narrows downward, the flow velocity of the refrigerant gradually increases, and the amount of refrigerant flowing from above the outer nozzle 62 increases.

Therefore, even if the amount of refrigerant circulation is the same as in the conventional example.

It is possible to increase the volume of refrigerant injected into the center of the semiconductor element, and it becomes possible to improve the cooling capacity.

[3] Grooves 7 extending radially toward the periphery of the semiconductor element
By injecting the refrigerant radially onto the semiconductor element using the grooved nozzle 7 having the number 1, not only the central part but also the peripheral part of the semiconductor element can be efficiently cooled. Although the cooling capacity in the central part of the semiconductor element is lower than in the conventional example, the cooling capacity in one peripheral part is increased, so that the uniformity of cooling is improved. Moreover, the overall cooling capacity is improved.

[Example] Figure 1 is an example! FIG. 1(a) is a sectional view to explain the entire cooling device, FIG. 1(b) is a perspective view to explain the action of the nozzle, and FIG. 1(c) is a diagram showing the cooling capacity. 1 is a refrigerant container, 11 is a refrigerant, 2 is a base, 31
33 is a semiconductor element, 4 is a first nozzle, 41 is a first refrigerant supply pipe, 5 is a second nozzle, 51 is a second refrigerant supply pipe, and the arrow represents the direction in which the refrigerant flows.

This will be explained below with reference to FIGS. 1(a) to 1(C).

Referring to FIG. 1(a), the semiconductor elements 31 to 33 are connected to the base 2 by solder bumps.
The entire structure is immersed in refrigerant.

The refrigerant flowing from the first population is transferred to the first refrigerant supply pipe 41
After that, the liquid is sprayed from the first nozzle 4 to approximately the center of the semiconductor elements 31 to 33.

The refrigerant flowing in from the second inlet is transferred to the second refrigerant supply pipe 51
After that, the liquid is sprayed from the second nozzle 5 to the vicinity of the semiconductor elements 31 to 33.

The refrigerant that has circulated in the refrigerant container 1 flows out from the outlet.

Referring to FIG. 1(b), the refrigerant injected from the first nozzle 4 hits the semiconductor element 31 substantially in the center perpendicular to the plane, changes direction there, and flows toward the periphery of the semiconductor element 31 substantially parallel to the plane.

On the other hand, the refrigerant injected from the second nozzle 5 is applied to the semiconductor element 3.
It flows parallel to the plane from near the periphery of semiconductor element 1 toward the center of semiconductor element 31.

Refer to FIG. 1(c). The upper surface of the semiconductor elements 31 to 33 is 13...I angle, the inner diameter of the first nozzle 4 is 3 am, the distance between the injection port and the semiconductor element surface is 4 mm, and the injection speed is 1.0 m. /s, the distance between semiconductor elements is lam, and the inner width of the second nozzle 5 is 0.5n.
m.

FIG. 1(c) shows the relationship between the refrigerant temperature and the cooling capacity when the distance between the injection port and the semiconductor element surface is 0.05 m/s and the injection speed is 0.05 m/s.

For comparison, there is only the first nozzle 4 as a nozzle that injects refrigerant, and the refrigerant injection amount is the same as that of the first nozzle 4 of Example I.
The relationship between the refrigerant temperature and the cooling capacity in the conventional example, where the total amount of the injection amount from the second nozzle 5 and the injection amount from the second nozzle 5, is also shown in FIG.
).

As seen in FIG. 1(C), in Example I, the cooling capacity is improved by 30 to 35% compared to the conventional example.

The injection speed of the refrigerant from the second nozzle 5 is preferably lower than the injection speed of the refrigerant from the first nozzle 4.

Note that the second nozzle 5 may be shaped to surround the semiconductor element so that the coolant flows from the four sides of the semiconductor element toward the center.

Figure 2 shows Example 2, Figure 2 (a) is a sectional view for explaining the entire cooling device, Figure 2 (b) is a perspective view for explaining the shape of the nozzle, and Figure 2 (c) is a cross-sectional view for explaining the entire cooling device. ) is a diagram showing the cooling capacity, and 51 is a refrigerant container.

11 is a refrigerant, 2 is a base, 31 to 33 are semiconductor elements,
41 is a refrigerant supply pipe, 61 is an inner nozzle, and 62 is an outer nozzle.

6 is a double nozzle, and the arrow represents the direction in which the refrigerant flows.

This will be explained below with reference to FIGS. 2<a> to (c).

Referring to FIG. 2(a), the semiconductor elements 31 to 33 are connected to the base 2 by solder bumps.
, and the whole is immersed in refrigerant 11.

The refrigerant flowing from the inlet passes through the refrigerant supply pipe 41 and is injected from the inner nozzle 61 to approximately the center of the semiconductor elements 31 to 33.

The coolant hits approximately the center of the semiconductor element and flows parallel to the surface from there toward the periphery. However, the coolant returns from the upper part of the outer nozzle 62, and the coolant flows approximately at the center of the semiconductor element per unit time. To increase.

The refrigerant that has circulated in the refrigerant container l flows out from the outlet.

FIG. 2(b) is a perspective view showing a double nozzle 6 consisting of an inner nozzle 61 and an outer nozzle 62.

The outer nozzle 62 is disposed on the outer side below the inner nozzle 61, has a horn shape whose inner diameter gradually decreases toward the bottom, and has an upper part open to the refrigerant. The inner nozzle 61 and the outer nozzle 62 are fixed by, for example, a support portion that spans both.

Refer to FIG. 2(C) The upper surface of the semiconductor elements 31 to 33 is 13+++m square, and above the center part there is an inner nozzle 61 with an inner diameter of 3 mm and a distance of 10w+m between the injection port and the semiconductor element surface, and an inner nozzle 61 at the lower end. The inner diameter is 311101 and the distance from the semiconductor element surface is 3 +u+
Figure 2 shows the relationship between refrigerant temperature and cooling capacity when the refrigerant injection speed from the inner nozzle 61 is 1.0 m/s using a double nozzle 6 consisting of an outer nozzle 62 with an inner diameter of 6 mm at the upper end. Shown in (C).

For comparison, outer nozzle 6 is used as a nozzle that injects refrigerant.
2(c) also shows the relationship between the refrigerant temperature and the cooling capacity.

As shown in FIG. 2(C), in Example 2, the cooling capacity is improved by 20 to 2.degree. 5% compared to the conventional example.

Figure 3 shows Example 2, Figure 3 (a) is a cross-sectional view for explaining the entire cooling device, Figure 3 (b) is a perspective view of a grooved nozzle, and Figure 3 (C) is a grooved nozzle. Bottom view of the nozzle, Figure 3 (
d) is a sectional view of the grooved nozzle, and FIG. 3(e) is a diagram showing the cooling capacity, where 1 is a refrigerant container, 11 is a refrigerant, 2 is a base, 31 to 33 are semiconductor elements, and 41 is a refrigerant supply. Tube, 7
is a grooved nozzle.

71 is a groove, 81 to 83 are cooling auxiliary blocks, and arrows indicate the direction in which the coolant flows.

This will be explained below with reference to FIGS. 3(a) to 3(e).

Referring to FIG. 31(a), the semiconductor elements 31 to 33 are fixed to the base 2 with two solder humps, and are entirely immersed in the coolant 11.

The refrigerant flowing from the inlet passes through the refrigerant supply pipe 41 and is injected from the grooved nozzle 7 onto the semiconductor elements 31 to 33.

The refrigerant is simultaneously supplied to the center and the periphery of the semiconductor element by the action of the grooves 71 of the grooved nozzle 7.

The refrigerant that has circulated in the refrigerant container 1 flows out from the outlet.

Refer to FIGS. 3(b) to 3(d). The grooved nozzle 7 is formed in a trumpet-like shape that opens toward the periphery of the semiconductor element, and further forms a hole 71 that supplies the coolant radially to the periphery of the semiconductor element. . FIG. 3(d) is a side sectional view taken along the AA cross section, and the walls on both sides of the groove 71 are also shown with dotted lines.

Furthermore, the semiconductor element 31 and the cooling auxiliary block 81 are also shown by dotted lines.

The cooling auxiliary block 81 is for smoothing the flow of the refrigerant to the peripheral area through the grooves 71, lowering the cooling capacity of the central area, and equalizing the cooling of the central area and the peripheral area, and is made of a block with good thermal conductivity. Material 2 is, for example, a conical or pyramidal block made of copper. The solder bump side of the semiconductor element is the element forming surface, and the cooling auxiliary block 81 can be bonded to the center of the opposite surface. Alternatively, the surface of the cooling auxiliary block 81 and the surface of the semiconductor element 31 may be brought into contact with each other by being fixed to the grooved nozzle 7 with a suitable support rod.

Refer to FIG. 3(e) The top surfaces of the semiconductor elements 31 to 33 are 13 mm square, and the inner diameter is 31III m above the center of the semiconductor elements 31 to 33. From a point 6n+m above the semiconductor element surface to a point 2 mm above the periphery of the semiconductor element surface. Using the grooved nozzle 7 in which 16 grooves 71 that spread radially are formed, the relationship between the refrigerant temperature and the cooling capacity when the refrigerant injection speed in the part where the grooves are not formed is 1.0 m/s is shown in the third example. Shown in Figure (e).

For comparison, FIG. 3(e) also shows the relationship between the refrigerant temperature and the cooling capacity of a conventional example in which the hood portion in which the groove 71 is formed as a nozzle for injecting refrigerant is not provided.

As shown in FIG. 3(e), in Example 2, the cooling capacity is improved by 25 to 30% compared to the conventional example.

〔Effect of the invention〕

As explained above, according to one aspect of the present invention, it is possible to provide a cooling device that has a cooling capacity for cooling a semiconductor element higher than that of the conventional apparatus and that uniformly cools the semiconductor element.

According to the present invention, the cooling device can be made smaller and the degree of integration of semiconductor elements can be increased.

The present invention greatly contributes to speeding up computers.

[Brief explanation of drawings]

Figure 1 shows Example 2, Figure 1 (a) is a sectional view for explaining the entire device, Figure 1 (b) is a perspective view for explaining the action of the nozzle, and Figure 1 (C ) is a diagram showing cooling capacity. Figure 2 shows Example 2, Figure 2 (a) is a sectional view for explaining the entire device, Figure 2 (b) is a perspective view of the double nozzle, Figure 2 (c) is the cooling capacity. Diagram showing. FIG. 3 shows Example 2, FIG. 3(a) is a cross-sectional view for explaining the entire device, and FIG. 3(d) is a perspective view of a grooved nozzle. bottom view,
The sectional view and FIG. 3(e) are diagrams showing cooling capacity. FIG. 4 is a diagram for explaining a conventional example. In fig. 1 is a refrigerant container. 11 is a refrigerant. 2 is the base. 31 to 33 are semiconductor elements. 4 is a nozzle, and a first nozzle 5. 41 is a refrigerant supply pipe, which is a first refrigerant supply pipe. 5 is a nozzle, which is a second nozzle. 51 is a refrigerant supply pipe, which is a second refrigerant supply pipe. 6 is a double nozzle. 61 is the inner nozzle. 62 is the outer nozzle. 7 is a grooved nozzle. 71 is a groove. 81 to 83 are cooling auxiliary blocks (b) *1 construction'! Figure 51 ([No. 2) Offshore naked theft degree ('c) (C) Tora Bon Example 1 %10 (No. 3) Be offense 6. Double Nozu J Shikushi) Tani color display, Shiori] [2 in 322) Atsushi Tamata (1) (CI officer) Tomoe Mamoru X No. 20 (Part 3) 23' / Shadow: jJ-('CI (e) Tora Mawari flJ M 3rd '23 (No. 3)

Claims (1)

[Scope of Claims] [1] The semiconductor elements (31 to 33) are immersed in a refrigerant and the refrigerant is circulated.
), the first nozzle (4) is disposed above the semiconductor element (31 to 33) and injects a refrigerant approximately to the center of the semiconductor element (31 to 33); A cooling device characterized by having a second nozzle (5) that is arranged close to the periphery of the semiconductor element (31 to 33) and injects a refrigerant near the periphery of the semiconductor element (31 to 33). . [2] The semiconductor elements (31 to 33) are immersed in a refrigerant and the refrigerant is circulated.
), which comprises: an inner nozzle (61) disposed above the semiconductor element (31 to 33) and injecting a refrigerant to a substantially central portion of the semiconductor element (31 to 33); A cooling device characterized by having a double nozzle (6) consisting of a nozzle (61) and an outer nozzle (62) whose inner diameter gradually decreases downward and whose top is open. [3] The semiconductor elements (31 to 33) are immersed in a refrigerant and the refrigerant is circulated.
), which is disposed above the semiconductor elements (31 to 33) and has grooves (71) inside thereof that extend radially toward the periphery of the semiconductor elements (31 to 33). A cooling device characterized by having a grooved nozzle (7) for injecting a refrigerant to semiconductor elements (31 to 33).