JPH02297998A - Bonding of substrate and case in automobile controller - Google Patents
Bonding of substrate and case in automobile controllerInfo
- Publication number
- JPH02297998A JPH02297998A JP11739389A JP11739389A JPH02297998A JP H02297998 A JPH02297998 A JP H02297998A JP 11739389 A JP11739389 A JP 11739389A JP 11739389 A JP11739389 A JP 11739389A JP H02297998 A JPH02297998 A JP H02297998A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- connector
- substrate
- circuit board
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title abstract 8
- 239000000853 adhesive Substances 0.000 claims abstract description 32
- 230000001070 adhesive effect Effects 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 5
- 238000006073 displacement reaction Methods 0.000 abstract description 7
- 238000002347 injection Methods 0.000 abstract description 7
- 239000007924 injection Substances 0.000 abstract description 7
- 238000012856 packing Methods 0.000 abstract description 3
- 230000002265 prevention Effects 0.000 abstract description 2
- 238000003466 welding Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 2
- 239000013464 silicone adhesive Substances 0.000 description 2
- 241000272814 Anser sp. Species 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、自動車制御装置に係り、特にエンジン室実装
に好適な耐振性、基板の反り１位置ずれ等に優れた回路
基板の接着方法に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an automobile control device, and particularly to a method for bonding a circuit board that is suitable for mounting in an engine compartment and has excellent vibration resistance and is excellent in preventing board warping and misalignment. .
実開昭５７−１１０９７２号で紹介している従来の防水
型収納ケースにおいて回路基板の取付けは、樹脂系の回
路基板を使用している為カバーにネジどめとなってしっ
かりと固定されている。In the conventional waterproof storage case introduced in Utility Model Application Publication No. 57-110972, the circuit board is mounted using a resin circuit board, so it is securely fixed with screws to the cover. .
上記従来技術は、回路基板をケースにしっかりとネジと
めする方法の為、振動や熱等で基板に加重がかかる時、
基板が反ったり変形する可能性がある。これによりコネ
クタ接続部の信頼性、耐振性に欠ける問題がある。圧接
コネクタを使用する場合でも、従来の技術力で取付ける
と、基板が反ったり変形したりする可能性がある。The above conventional technology is a method of firmly screwing the circuit board to the case, so when the board is subjected to load due to vibrations, heat, etc.
The board may warp or deform. As a result, there is a problem that the reliability and vibration resistance of the connector connection portion are lacking. Even when using a pressure welding connector, there is a possibility that the board will warp or deform if it is installed using conventional techniques.
本発明の目的は、回路基板をケースに取付ける場合、基
板の反り、変形２位置ずれを無くすコネクタ接続方法を
目的としたものである。SUMMARY OF THE INVENTION An object of the present invention is to provide a connector connection method that eliminates warpage, deformation, and displacement of the circuit board when the circuit board is attached to a case.
回路基板（セラミック基板）を、たとえば、アルミダイ
カストカバーに取り付ける場合は、熱膨張係数差がある
。特に、圧接コネクの接続部分にあたる基板の接着面は
、基板の位置ずれを無くす為に、ケース側の接着剤注入
用溝を浅くして（たとえばシリコン系接着剤）接着剤の
厚みを小さくし接着剤を変形しにくい様にする又圧接コ
ネクタ部分以外の基板接着面は、反り、変形２位置ずれ
等の逃げの為にケース側の接着剤注入溝を深くして（た
とえばシリコン系接着剤）接着剤の厚みを大きくし接着
剤を変形しやすい様にすることによって本発明の目的を
達成することができる。When attaching a circuit board (ceramic board) to an aluminum die-cast cover, for example, there is a difference in coefficient of thermal expansion. In particular, in order to prevent the board from shifting, the bonding surface of the board, which is the connection part of the pressure welding connector, is bonded by making the adhesive injection groove on the case side shallower (for example, using silicone adhesive) to reduce the thickness of the adhesive. To prevent the adhesive from deforming, and to prevent warping, deformation, and misalignment of the board bonding surface other than the pressure welding connector part, use a deep adhesive injection groove on the case side (for example, with silicone adhesive) to prevent warping, deformation, and misalignment. The object of the present invention can be achieved by increasing the thickness of the adhesive and making it easier to deform.
回路基板に、振動や熱等で加重がかかる時、動いて良い
部分は接着剤の厚みが厚くなる様なケース構造にして、
又動いて悪い部分は接着剤の厚みが薄くなる様なケース
構造にし、同じ接着材料で厚さを使い分けることにより
圧接コネクタと回路基板の導通接触部分及び基板全体の
反り１位置ずれを無くすことが出来る。When a load is applied to the circuit board due to vibration or heat, the case structure is such that the adhesive is thicker in areas that can move.
In addition, by creating a case structure in which the thickness of the adhesive is thinner in areas that are prone to movement, and by using different thicknesses of the same adhesive material, it is possible to eliminate the warpage of the conductive contact area between the pressure welding connector and the circuit board, and the entire board. I can do it.
本発明を防水型収納ケースに内蔵した自動車用制御装置
に適用した実施例として第１図、第２図に示す。第２図
は制御装置の外観図、第１図は。An embodiment in which the present invention is applied to an automobile control device built into a waterproof storage case is shown in FIGS. 1 and 2. Figure 2 is an external view of the control device, and Figure 1 is.
制御装置の中心からの断面図である。第２図に示す様に
防水コネクタ２はネジ８によりケース１に固定してあり
、ケース１には取付部１−ｂが一体に設けられている。FIG. 3 is a sectional view taken from the center of the control device. As shown in FIG. 2, the waterproof connector 2 is fixed to the case 1 with screws 8, and the case 1 is integrally provided with a mounting portion 1-b.
第１図においてケース１は、側面開口部１−ａを設けこ
こに防止コネクタ２をパツキン３を介して取付ける。カ
バー４に回路基板５を接着剤８，９で取り付はパツキン
６を介してネジ７によりケース１に組み付ける。防止コ
ネクタ２の端子部２−ａと回路基板５との導通を圧接方
式によりとる。以上の構成部品から成り、回路基板接着
方法において接着剤の厚さを変える方法は、接着剤８，
９（同材料）部分においてケース側の接着剤注入溝の深
さを変えて対応した。接着剤８この部分は、圧接コネク
タの接続部なので基板の位置ずれは給体に許されなく又
コネクタの荷重がかなりかかる為接着剤注入溝１ｏを浅
くし接着剤の厚みを小さくして変形しにくい様にする。In FIG. 1, a case 1 has a side opening 1-a to which a prevention connector 2 is attached via a packing 3. The circuit board 5 is attached to the cover 4 with adhesives 8 and 9, and is assembled to the case 1 with screws 7 through the gasket 6. The terminal portion 2-a of the preventive connector 2 and the circuit board 5 are electrically connected by pressure contact. Consisting of the above components, the method of changing the thickness of the adhesive in the circuit board bonding method is to use adhesive 8,
This was done by changing the depth of the adhesive injection groove on the case side for part 9 (same material). Adhesive 8 This part is the connection part of the pressure welding connector, so displacement of the board cannot be tolerated by the supply body, and the load of the connector is considerable, so the adhesive injection groove 1o is made shallow and the thickness of the adhesive is reduced to deform it. Make it difficult.
又、圧接コネクタ部分以外の基板接着面、接着剤９この
部分は、基板全体の反り、変形２位置ずれ等の逃げの為
に、接着剤注入溝１１を深くして接着剤の厚みを大きく
して接着剤を変形しやすくしている。接着剤８及び９部
分において溝の深さが逆になった場合コネクタ部分の位
置ずれが予想される。又接着剤８及び９部分両方とも浅
い溝にした場合、回路基板とケースの熱膨張係数差によ
り基板の反り、変形が予想される。In addition, the adhesive surface of the board other than the pressure welding connector part, the adhesive 9, is made by deepening the adhesive injection groove 11 to increase the thickness of the adhesive in order to prevent warping of the entire board, deformation, and misalignment. This makes the adhesive easier to deform. If the depths of the grooves in the adhesives 8 and 9 are reversed, displacement of the connector part is expected. Furthermore, if both the adhesive parts 8 and 9 are formed into shallow grooves, it is expected that the board will warp or deform due to the difference in thermal expansion coefficient between the circuit board and the case.
本発明によれば、圧接式コネクタと回路基板の接続部の
変形２反り２位置ずれ等をなくすことができるので、コ
ネクタ接続部の信頼性及び耐振性を向上できる。According to the present invention, it is possible to eliminate deformation, curvature, positional displacement, etc. of the connection portion between the press-contact connector and the circuit board, so that the reliability and vibration resistance of the connector connection portion can be improved.
第１図は本発明の一実施例の断面図、第２図は防水型収
納ケースに内蔵した自動車用制御装置の外観図である。
４・・・カバー、５・・・回路基板、８・・・接着剤、
９・・・接＋ へＩ？１＋堵鵠FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is an external view of an automobile control device built into a waterproof storage case. 4...Cover, 5...Circuit board, 8...Adhesive,
9...Tang+ to I? 1+ goose
Claims (1)
タ端子で、圧接する方法を取つた収納ケースにおいて、
収納ケースに回路基板を接着するさいに、同じ接着材料
でコネクタ部分は、厚みを薄くその他の部分は厚みを厚
くして接着することを特徴とする自動車制御装置の基板
とケースの接着方法。1. In a storage case that uses pressure contact between the circuit board and the connector terminal to establish continuity between the circuit board and the connector,
A method for bonding a circuit board and a case of an automobile control device, which is characterized in that when bonding a circuit board to a storage case, the same adhesive material is used to make the connector part thinner and the other parts thicker.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11739389A JPH02297998A (en) | 1989-05-12 | 1989-05-12 | Bonding of substrate and case in automobile controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11739389A JPH02297998A (en) | 1989-05-12 | 1989-05-12 | Bonding of substrate and case in automobile controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02297998A true JPH02297998A (en) | 1990-12-10 |
Family
ID=14710542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11739389A Pending JPH02297998A (en) | 1989-05-12 | 1989-05-12 | Bonding of substrate and case in automobile controller |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02297998A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100396013B1 (en) * | 1994-12-27 | 2004-03-09 | 슬로안 밸브 캄파니 | Wiring protection box cover for installation in electrical control circuits |
| EP2099266A1 (en) * | 2008-03-06 | 2009-09-09 | Valeo Schalter und Sensoren GmbH | Electrical component or device with a flexible circuit board |
| JP2011031696A (en) * | 2009-07-31 | 2011-02-17 | Hitachi Automotive Systems Ltd | Control unit |
| JP2017041602A (en) * | 2015-08-21 | 2017-02-23 | 株式会社デンソー | On-vehicle electronic apparatus |
-
1989
- 1989-05-12 JP JP11739389A patent/JPH02297998A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100396013B1 (en) * | 1994-12-27 | 2004-03-09 | 슬로안 밸브 캄파니 | Wiring protection box cover for installation in electrical control circuits |
| EP2099266A1 (en) * | 2008-03-06 | 2009-09-09 | Valeo Schalter und Sensoren GmbH | Electrical component or device with a flexible circuit board |
| JP2011031696A (en) * | 2009-07-31 | 2011-02-17 | Hitachi Automotive Systems Ltd | Control unit |
| JP2017041602A (en) * | 2015-08-21 | 2017-02-23 | 株式会社デンソー | On-vehicle electronic apparatus |
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