JPH02296793A - Multi-growth chamber reaction tube - Google Patents

Multi-growth chamber reaction tube

Info

Publication number
JPH02296793A
JPH02296793A JP11823589A JP11823589A JPH02296793A JP H02296793 A JPH02296793 A JP H02296793A JP 11823589 A JP11823589 A JP 11823589A JP 11823589 A JP11823589 A JP 11823589A JP H02296793 A JPH02296793 A JP H02296793A
Authority
JP
Japan
Prior art keywords
growth
growth chamber
chambers
reaction tube
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11823589A
Other languages
Japanese (ja)
Inventor
Toshiyuki Misaki
三崎 敏幸
Yasunobu Nashimoto
梨本 泰信
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP11823589A priority Critical patent/JPH02296793A/en
Publication of JPH02296793A publication Critical patent/JPH02296793A/en
Pending legal-status Critical Current

Links

Landscapes

  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

PURPOSE:To easily prevent the interference of gases between respective growth chambers by providing mechanisms for blowing the gases out of the partition parts of the respective growth chambers and forming curtains by gaseous flow between the respective growth chambers. CONSTITUTION:Reaction tubes 6, 6... of a small diameter to constitute the growth chambers are integrated by a reaction tube 1 of a large diameter in a growth region. For example, a Ga metal 7 and an In metal 8 are set in the respective reaction tubes 6. While substrates 9 of a holder 10 are successively rotated to the apertures of the respective growth chambers 6 in the growth region, the substrates are disposed to the apertures and vapor growth is executed on the substrates 9. Gas introducing pipes 5 are provided in the partition parts of the respective growth chambers 6 of such multi-growth chamber reaction tube and gas supply openings 2 thereof are opened in the growth region. The air curtains to partition between the growth chambers 6 are formed by the gaseous flow from the supply openings 2. The infiltrating of the growth in the period to be superposed in order to fill the atmosphere of the other chamber with the next growth atmosphere during the growth in one chamber is easily prevented in this way.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はへテロ接合を有する化合物半導体の気相成長方
法に利用される多成長室反応管に関し。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a multi-growth chamber reaction tube used in a vapor phase growth method for compound semiconductors having heterojunctions.

特にハイドライドVPEにおいてへテロ接合の急峻性を
向上させる多成長室反応管に関する。
In particular, the present invention relates to a multi-growth chamber reaction tube that improves the steepness of heterojunctions in hydride VPE.

〔従来の技術〕[Conventional technology]

従来、ハイドライドVPE用の多成長室反応管としては
第2図(a)、(b)に示すように1個々の小径の反応
管(成長室)6,6・・・を成長領域近傍で一つの大径
の反応管1にまとめるのが一般的な構造であった。図中
、3は■族管、4は■族管、7はGaメタル、8はIn
メタルである。
Conventionally, as a multi-growth chamber reaction tube for hydride VPE, individual small-diameter reaction tubes (growth chambers) 6, 6, . The general structure was to combine the reaction tubes into one large-diameter reaction tube 1. In the figure, 3 is a group II tube, 4 is a group II tube, 7 is a Ga metal, and 8 is an In
It's metal.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来の多成長室反応・管を用いたハイドライド
VPEでは個々の反応管6が合流した部分の直後の領域
を成長領域として利用するので、ペテロ接合の界面では
個々の成長室間に流れている成分の干渉を受けやすいと
いう欠点があった。
In the above-mentioned conventional hydride VPE using multiple growth chamber reaction tubes, the region immediately after the confluence of the individual reaction tubes 6 is used as the growth region, so that at the interface of the Peter junction, there is no flow between the individual growth chambers. The disadvantage is that it is susceptible to interference from other components.

これら他室からの成分のまわり込みを防ぐために成長に
用いる成長室以外を施蓋したり、成長に関与しない室の
流量を減らし、成長室の流量を増やす等の手法が利用さ
れるが、充分な効果が得られていない。
In order to prevent components from entering the growth chamber, methods such as closing the growth chamber other than those used for growth, reducing the flow rate in chambers that are not involved in growth, and increasing the flow rate in the growth chamber are used. No effect has been obtained.

本発明の目的は前記課題を解決した多成長室反応管を提
供することにある。
An object of the present invention is to provide a multi-growth chamber reaction tube that solves the above problems.

〔発明の従来技術に対する相違点〕[Differences between the invention and the prior art]

上述した従来の多成長室反応管に対し、本発明は成長室
相互間でのガスの干渉を防止するという相違点を有する
The present invention differs from the conventional multi-growth chamber reaction tube described above in that it prevents gas interference between the growth chambers.

〔課題を解決するための手段〕[Means to solve the problem]

前記目的を達成するため、本発明は化学気相成良法で利
用される多成長室反応管において、各成長室の仕切り部
分からガスを吹き出し、各成長室間に気流によるカーテ
ンを形成する機端を有するものである。
In order to achieve the above object, the present invention provides a multi-growth chamber reaction tube used in the chemical vapor deposition method, in which gas is blown out from the partitions of each growth chamber to form a curtain between each growth chamber by airflow. It has the following.

〔実施例〕〔Example〕

次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第1図(a)は本発明の一実施例を示す横断面図、第1
図(b)は同縦断面図である。
FIG. 1(a) is a cross-sectional view showing one embodiment of the present invention.
Figure (b) is a longitudinal sectional view of the same.

図において、成長室を構成する小径の反応管6゜6・・
・を成長領域で大径の反応管1にて集積し、各反応管6
内にGaメタル7、Inメタル8等をセットし、その成
長領域にてホルダーlOの基板9を各成長室6の開口部
に順に回転させつつ配設し、該基板9上に気相成長を行
う。図中、3はIII族管腰骨は■腰骨である。
In the figure, a small diameter reaction tube 6°6...
・is accumulated in the large-diameter reaction tube 1 in the growth region, and each reaction tube 6
Ga metal 7, In metal 8, etc. are set in the growth chamber, and in the growth region, the substrate 9 of the holder IO is sequentially placed in the opening of each growth chamber 6, and vapor phase growth is performed on the substrate 9. conduct. In the figure, 3 is a group III hip bone.

本発明は各成長室6の仕切部分にガス導入管5を設け、
そのガス吹出口2を成長領域に開口し、該ガス吹出口2
からのガス流により成長室相互間を仕切るエアーカーテ
ンを形成するようにしたものである。
The present invention provides a gas introduction pipe 5 in the partition part of each growth chamber 6,
The gas outlet 2 is opened to the growth region, and the gas outlet 2 is opened to the growth region.
The gas flow from the growth chamber forms an air curtain that separates the growth chambers from each other.

InGaAs系の叶結晶(ダブルへテロ結晶)の成長に
ついて説明すると、ホルダー10にn型InP基板9を
装着し、大径の反応管1の所定成長領域まで挿入する。
To explain the growth of an InGaAs-based leaf crystal (double heterocrystal), an n-type InP substrate 9 is mounted on a holder 10 and inserted into a large-diameter reaction tube 1 up to a predetermined growth region.

■原管3.V族管4.ガス導入管5からそれぞれ水素を
1127Ilinの流量で流し、成長室6内を水素に置
換する。このときのInP基板9の位置は下段、すなわ
ちHの成長室側とする。
■Original tube 3. V group tube 4. Hydrogen was supplied from each gas introduction pipe 5 at a flow rate of 1127 Ilin to replace the inside of the growth chamber 6 with hydrogen. At this time, the InP substrate 9 is positioned at the lower stage, that is, on the side of the H growth chamber.

次に反応管全体をヒータにより、■腰骨メタルソース部
り50℃、基板部650℃まで加熱する。ただし、基板
部の温度が4006C以上になったら、Hの成長室側の
■族管4からホスフィンを20cc/min炉内に流し
、基板9からのリンの解離を防ぐ。設定温度まで達した
ならば、Iの成長室側の■原管。
Next, the entire reaction tube is heated to 50° C. for the hip bone metal source portion and 650° C. for the substrate portion using a heater. However, when the temperature of the substrate section reaches 4006 C or more, phosphine is flowed into the furnace at 20 cc/min from the group II tube 4 on the side of the H growth chamber to prevent dissociation of phosphorus from the substrate 9. Once the set temperature has been reached, ■ the original tube on the growth chamber side of I.

V腰骨からIn、P成長のためのガス、すなわち塩酸2
 cc/win 、オスフィン8 cc/winを流し
数分間経過後、ホルダーlOを回転させてInP基板9
を■の成長室に移動し、Hの成長室側のホスフィンを切
って成長を開始する。所望のInP層が成長できる数分
前からHの成長室側のガス成分、塩酸、ホスフィンをI
nGaAs層成長のための条件にして雰囲気の切換を開
始する。所望のInP層が成長できたならば、ホルダー
IOを回転し、基板9を■の成長室側にすると同時に■
の成長室6側の塩酸、ホスフィンの供給を停止する。 
InGaAs層の成長を終える数分前に再びIの成長室
側に塩酸、ホスフィンを供給し、InP成長の雰囲気に
切換える。 InGaAs系長を終えたなら再びホルダ
ー10を回転させ、基板9をIの成長室側にして■の成
長室の塩酸、ホスフィンの供給を停止する。
Gas for In, P growth from V hip bone, i.e. hydrochloric acid 2
cc/win, Osphine 8 After a few minutes of flowing cc/win, rotate the holder lO and insert the InP substrate 9.
Move it to the growth chamber (■), turn off the phosphine on the side of the growth chamber (H), and start growth. Several minutes before the desired InP layer is grown, gas components on the side of the H growth chamber, hydrochloric acid, and phosphine are added to I.
The atmosphere is started to be changed to the conditions for growing the nGaAs layer. Once the desired InP layer has been grown, rotate the holder IO so that the substrate 9 faces the growth chamber (■) and at the same time
The supply of hydrochloric acid and phosphine to the growth chamber 6 side is stopped.
Several minutes before the growth of the InGaAs layer is finished, hydrochloric acid and phosphine are again supplied to the I growth chamber side to change the atmosphere to InP growth. After the InGaAs system is grown, the holder 10 is rotated again, the substrate 9 is placed on the side of the growth chamber (I), and the supply of hydrochloric acid and phosphine to the growth chamber (2) is stopped.

InP成長終了前に■の成長室にリンの解離を防ぐため
のホスフィンを流し雰囲気を整えておく。
Before the InP growth is completed, phosphine is poured into the growth chamber (2) to prevent dissociation of phosphorus to prepare the atmosphere.

InPの成長が完了したならば、基板9を■の成長室側
にして■の成長室側にして反応管からヒータを外して降
温する。この間ガス吹出口2からは常時112/win
の水素を流し、■と■の成長室の間に気流のカーテンを
形成させる。
When the growth of InP is completed, the substrate 9 is placed on the side of the growth chamber (2) and placed on the side of the growth chamber (2), and the heater is removed from the reaction tube to lower the temperature. During this time, 112/win is always output from gas outlet 2.
Flow hydrogen to form an airflow curtain between the growth chambers ■ and ■.

以上の手順により作成したInP/InGaAs/In
PのDB結晶は他室からの成分回り込みによる組成のゆ
らぎが少なくウェハー周辺部までクロスハツチの発生が
ない良質な結晶であった。
InP/InGaAs/In created by the above procedure
The DB crystal of P was a high-quality crystal with little fluctuation in composition due to components coming around from other chambers, and no cross hatching occurred up to the periphery of the wafer.

本実施例では成長室を2室のみとして説明したが、3室
以上でも同様である。
Although the present embodiment has been described using only two growth chambers, the same applies to three or more growth chambers.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は成長室の仕切り部分からガ
スを吹き出し気流によるカーテンを形成することにより
、−室で成長中に他室の雰囲気を次の成長雰囲気で満た
すために重畳する期間の成分のまわり込みを簡便に防止
することができる効果を有する。
As explained above, the present invention blows out gas from the partition part of the growth chamber and forms a curtain with the airflow. This has the effect of easily preventing wraparound.

【図面の簡単な説明】[Brief explanation of drawings]

第1図(a)は本発明の一実施例の横断面図、第1図(
b)は第1図(a)のA−A’線断面図、第2図(a)
は従来型の2成長室反応管を示す横断面図、第2図(b
)は第2図(a)のA−A’ lil断面図である。 1・・・大径の反応管    2・・・ガス吹出口3・
・・■I族腰骨      4・・・■族管5・・・ガ
ス導入口     6・・・小径の反応管7・・・Ga
メタル       8−4nメタル9・・・InP基
板       10・・・ホルダー第1図 A′ 第2図 (b) 第1図 第2図
FIG. 1(a) is a cross-sectional view of one embodiment of the present invention;
b) is a sectional view taken along line A-A' in Fig. 1(a), Fig. 2(a)
Figure 2(b) is a cross-sectional view showing a conventional two-growth chamber reaction tube.
) is a sectional view taken along line AA'lil in FIG. 2(a). 1...Large diameter reaction tube 2...Gas outlet 3.
...■Group I hip bone 4...Group tube 5...Gas inlet 6...Small diameter reaction tube 7...Ga
Metal 8-4n Metal 9... InP substrate 10... Holder Fig. 1 A' Fig. 2 (b) Fig. 1 Fig. 2

Claims (1)

【特許請求の範囲】[Claims] (1)化学気相成長法で利用される多成長室反応管にお
いて、各成長室の仕切り部分からガスを吹き出し、各成
長室間に気流によるカーテンを形成する機構を有するこ
とを特徴とする多成長室反応管。
(1) A multi-growth chamber reaction tube used in chemical vapor deposition is characterized by having a mechanism for blowing out gas from the partitions of each growth chamber to form a curtain between each growth chamber by airflow. Growth chamber reaction tube.
JP11823589A 1989-05-11 1989-05-11 Multi-growth chamber reaction tube Pending JPH02296793A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11823589A JPH02296793A (en) 1989-05-11 1989-05-11 Multi-growth chamber reaction tube

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11823589A JPH02296793A (en) 1989-05-11 1989-05-11 Multi-growth chamber reaction tube

Publications (1)

Publication Number Publication Date
JPH02296793A true JPH02296793A (en) 1990-12-07

Family

ID=14731576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11823589A Pending JPH02296793A (en) 1989-05-11 1989-05-11 Multi-growth chamber reaction tube

Country Status (1)

Country Link
JP (1) JPH02296793A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6416584B1 (en) * 1998-07-09 2002-07-09 Samsung Electronics Co., Ltd. Apparatus for forming a film on a substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6416584B1 (en) * 1998-07-09 2002-07-09 Samsung Electronics Co., Ltd. Apparatus for forming a film on a substrate
US7481882B2 (en) 1998-07-09 2009-01-27 Samsung Electronics Co., Ltd. Method for forming a thin film

Similar Documents

Publication Publication Date Title
US4840921A (en) Process for the growth of III-V group compound semiconductor crystal on a Si substrate
JPH0429313A (en) Device for producing semiconductor crystal
JP2752235B2 (en) Semiconductor substrate manufacturing method
JPH02296793A (en) Multi-growth chamber reaction tube
JPH0758030A (en) Apparatus for manufacturing semiconductor
JPS62128518A (en) Vapor growth equipment
JP2581093Y2 (en) Semiconductor heat treatment equipment
JPS6010621A (en) Depressurized epitaxial growing equipment
JPS6122619A (en) Vapor-phase epitaxial growing device
JPH03195016A (en) Thermal cleaning method of si substrate; epitaxial growth and heat treatment apparatus
JPS62269312A (en) Hot wall furnace
JPS6217098A (en) Vapor growth device for semiconductor thin film
JPH05347257A (en) Vacuum vapor growth device
JPS61198717A (en) Chemical vapor phase growth device
JPH0824108B2 (en) Tube equipment for semiconductor manufacturing
JPS61156725A (en) Vapor growth apparatus
JPH04308087A (en) Reduced-pressure vapor growth device
JPH045819A (en) Method and apparatus for molecular-beam epitaxy
JPS63159296A (en) Vapor phase epitaxy
JPH03236220A (en) Vapor growth method for semiconductor
JPS63137417A (en) Vapor phase epitaxial growing apparatus
JPS63118068A (en) Method for selectively growing metallic thin film
JPS6057612A (en) Method for growing compound semiconductor
JPS61245539A (en) Chemical vapor deposition apparatus
JPH04268720A (en) Manufacture of semiconductor device