JPH02295732A - Antistatic plastic sheet - Google Patents
Antistatic plastic sheetInfo
- Publication number
- JPH02295732A JPH02295732A JP1115696A JP11569689A JPH02295732A JP H02295732 A JPH02295732 A JP H02295732A JP 1115696 A JP1115696 A JP 1115696A JP 11569689 A JP11569689 A JP 11569689A JP H02295732 A JPH02295732 A JP H02295732A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- base film
- antistatic
- metal
- coating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002985 plastic film Substances 0.000 title claims description 14
- 239000010410 layer Substances 0.000 claims abstract description 73
- 239000012790 adhesive layer Substances 0.000 claims abstract description 20
- 239000011253 protective coating Substances 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 11
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 10
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 10
- 239000000126 substance Substances 0.000 claims abstract description 10
- 239000011247 coating layer Substances 0.000 claims abstract description 3
- 239000010408 film Substances 0.000 claims description 36
- 239000010409 thin film Substances 0.000 claims description 2
- 230000002411 adverse Effects 0.000 abstract description 3
- 239000004952 Polyamide Substances 0.000 abstract description 2
- 239000002131 composite material Substances 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 abstract description 2
- 229920002647 polyamide Polymers 0.000 abstract description 2
- 229920000728 polyester Polymers 0.000 abstract description 2
- 229920000098 polyolefin Polymers 0.000 abstract description 2
- 230000002045 lasting effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- -1 polyphenylene vinylene Polymers 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 5
- 239000004831 Hot glue Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005034 decoration Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 239000002075 main ingredient Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000005033 polyvinylidene chloride Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- XZIIFPSPUDAGJM-UHFFFAOYSA-N 6-chloro-2-n,2-n-diethylpyrimidine-2,4-diamine Chemical compound CCN(CC)C1=NC(N)=CC(Cl)=N1 XZIIFPSPUDAGJM-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- VBICKXHEKHSIBG-UHFFFAOYSA-N beta-monoglyceryl stearate Natural products CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 description 1
- 229920006378 biaxially oriented polypropylene Polymers 0.000 description 1
- 239000011127 biaxially oriented polypropylene Substances 0.000 description 1
- 239000000227 bioadhesive Substances 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005686 electrostatic field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000005001 laminate film Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910003446 platinum oxide Inorganic materials 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 229920006264 polyurethane film Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000006120 scratch resistant coating Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229940035044 sorbitan monolaurate Drugs 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 239000010981 turquoise Substances 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業一Fの利用分野
本発明は、プラスチックス成形品に帯電防止性を付与す
るためのプラスチックスシートに関するものである.
従来の技術
プラスチック成形品は特殊な材質のものを除いては一般
に帯電しやすく、製造工程中、保管・輸送中、使用中の
いずれの段階においても空気中のダストや微粒子を吸着
して表面が汚染されやすい.また、取り扱い中に梱包材
料と摩擦した場合や、駆動装置を内蔵する家電製品にあ
っては、表面帯電が特に著しいため、電子回路系に静電
破壊を生じたり,人体に不快な電撃ショックを与えるこ
とも多い.
そこでプラスチックス成形品に帯電防止性を付与するた
めに、(a)成形品の表面に吸水性高分子によるコーテ
ィングを施す方法、(b)成形品の表面に界面活性剤を
混入した塗料を塗布する方法、(C)成形品の表面にカ
ーポンブラックや金属粉などの導電性粉体を配合した塗
料を塗布する方法、(d)成形品製造原料自体に導電性
材料を混合して成形に供する方法などが採用されている
。DETAILED DESCRIPTION OF THE INVENTION Field of Application of Industry 1F The present invention relates to a plastic sheet for imparting antistatic properties to plastic molded products. Conventional technology Plastic molded products, except for those made of special materials, are generally susceptible to static electricity, and their surfaces can absorb dust and fine particles in the air during the manufacturing process, during storage/transportation, and during use. Easily contaminated. In addition, if there is friction with packaging materials during handling, or if the surface of home appliances with a built-in drive unit is particularly charged, electrostatic damage may occur in the electronic circuit system, and unpleasant electric shocks may occur to the human body. I often give. Therefore, in order to impart antistatic properties to plastic molded products, there are two methods: (a) coating the surface of the molded product with a water-absorbing polymer, and (b) applying a paint containing a surfactant to the surface of the molded product. (C) A method of applying a paint containing conductive powder such as carbon black or metal powder to the surface of the molded product; (d) A method of mixing a conductive material into the molded product manufacturing raw material itself and subjecting it to molding. methods are being adopted.
発明が解決しようとする課題
しかしながら、上記(a)の方法においては、成形品の
酎水性がなくなったり、表面特性が変化したりする上、
相対湿度が低いときの帯電防止性が著しく低下するとい
う問題点がある.上記(b)の方法においては、(a)
同様に、相対湿度が低いときの帯電防止性が著しく低下
するという問題点がある.
上記(C)や(d)の方法においては、成形品の色相が
限定されるという不利がある上、ポリカーポネートやポ
リメチルメタクリレート等でできた透明な成形品,を得
ようとする場合にはこの方法は適用しがたいなど、美装
性の点で難がある.
本発明は、このような状況に鑑み、成形品の外観に悪影
響を与えず,しかも湿度条件に左右されずかつ永続的な
帯電防止性を付与しうる帯電防止用プラスチックスシー
トを提供することを目的になされたものである.
課題を解決するための手段
本発明の帯電防止用プラスチックスシートは、基材フィ
ルム(1)の片面に金属または金属酸化物による導電性
薄層(2)を設けると共に、該導電性薄膜層(2)上に
帯電防止性物質を混入した保護被膜層(3)を設けたこ
とを特徴とするものである.
以下本発明を詳細に説明する.
L且2ユ』」A旦
基材フイルム(1)としては、たとえば、ポリエステル
系フィルム、ボリアミド系フィルム,ポリオレフィン系
フィルム,ポリ塩化ビニル系フィルム、ポリ塩化ビニリ
デン系フィルム、ボリスチレン系フィルム、ポリウレタ
ン系フィルム、セルロース系フィルムなどが用いられる
.基材フィルム(1)は透明であることが望ましい.ま
た,延伸されていてもよく、2層以上のラミネートフィ
ルムであってもよい.
基材フィルム(+)の厚さには特に限定はないが、5〜
2 0 0 JLI程度のものを用いることが多い.
県!』目1脛工D
基材フィルム(1)の片面には,金属または金属酸化物
による導電性S層(2)が設けられる.導電性薄R(2
)は、透明であることが特に望ましい.
上記の金属または金属酸化物としては,インジウム,イ
リジウム、アルミニウム,金,銀、銅、ニッケル、クロ
ム、チタン、ステンレス鋼、鉄、コバルト、モリブデン
、ロジウム、パラジウム、ガリウム、蔓鉛、スズ、タン
タル、白金などの金属や金属酸化物などがあげられ,こ
れらは単体、合金または混合物の形態で用いられる.こ
れらの中では特にITO(インジウムースズ複合酸化物
)が重要である.
導電性薄層(2)の形成は、イオンプレーティング、ス
パッタリング、真空蒸着、メッキ等の手段によりなされ
、その厚さは50〜2000Aあるいはそれ以上とする
ことが多い.
久盪111匹n
導電性薄膜層(2)上からは、帯電防止性物質を混入し
た保護被膜層(3)が設けられる.帯電防止性物質とし
ては、たとえば、ノニオン系、アニオン系、カチオン系
または両性界面活性剤等の界面活性剤;金属あるいはI
TO等の金属酸化物;カーポンブラック;有機スズ系化
合物をはじめとする有機金属化合物;ボリアニリン、ポ
リピロール、ポリチオフェン、ポリアセチレン、ボリフ
ェニレンビニレン等の有機化合物を7クセプターとし、
これを適当なドナーと組み合せたものなどが用いられ、
これらの中では、形成した導電性*膜層(2)が透明と
なるものが好ましい.保護被M 層(3)を形成するマ
トリックス成分としては、アクリル系樹脂、ウレタン系
樹脂,エボキシ系樹脂,ポリエステル系樹脂、シリコー
ン系樹脂、フッ素系樹脂、メラミン系樹脂、フェノール
系樹脂,尿素系樹脂、ジアリルフタレート系樹脂,アル
キッド樹脂、マレイン化ロジン、ポリビニルブチラール
,セルロース系高分子、ボリアミド系樹脂、塩化ビニル
ー酢酸ビニル共重合体をはじめとする種々の熱硬化性、
熱可塑性または活性エネルギー線硬化性高分子が用いら
れる.保護被膜層(3)は,殊にハードコーティング層
、つまり耐擦傷性コーティング層であることが好ましい
.ハードコーティング剤としては,アクリル樹脂やウレ
タン変性アクリル樹脂を主剤として用いた紫外線硬化型
ハードコーティング剤、シリコーン系樹脂を主剤として
用いた熱硬化型ハードコーティング剤などが例示される
.
保護被膜層(3)における帯電防止性物質の混入量は、
帯電防止性物質の種類により大きく異なるので一概には
決められないが、たとえば0.1〜50重量%とするこ
とが多い.
保護被膜層(3)の形成は、通常、溶液コーティング法
、分散液コーティング法、エクストルージョンコーティ
ング法によってなされるが、場合によってはドライラミ
ネート法を採用することもある.
保護被膜層(3)の厚さは、たとえば0.5〜50ル履
に設定する.
皮jコ肌脛エリ
基材フィルム(1)の他面には接着剤層(4)を設け、
対象物である成形品に対する密着を図るようにする.た
だし、対象物である成形品側に接着剤層を設けたり、イ
ンモールド成形により成形と同時に接着を図るときは,
基材フィルム(1)の他面への接着剤層(0の設置を省
略することができる.
接着剤層(0としては、アクリル系接着剤、ポリエステ
ル系接着剤、ウレタン系接着剤、シリコーン系接着剤、
エポキシ系接着剤、ビニル系接着剤、天然物系接着剤等
の接着剤:ゴム系感圧性接着剤、アクリル系感圧性接着
剤、シリコーン系感圧性接着剤、ビニル系感圧性接着剤
等の感圧性接着剤;エチレンー酢酸ビニル共重合体系ホ
ットメルト接着剤,アクリル系ホットメルト接着剤、ポ
リエステル系ホットメルト接着剤等のホットメルト接着
剤;再湿接着剤;などが用いられる.接着剤層(4)の
厚さにも限定はないが、たとえば3〜100gm程度と
することが多い.笠fLikり
基材フィルム(1)の他面側(接着剤層(4)を設ける
ときは接着剤層(4)設置側の基材フィルム(1)面)
には、装Il!1層(5)を設けることが好ましい.
装f!li R(5)としては、印刷層、着色層などが
あげられる.
装飾層(5)の厚さにも特に限定はないが、3〜〜50
終膿程度とすることが多い.
帯 防 プラスチックスシート
本発明の帯電防止用プラスチックスシートは、保護被膜
層(3)/導電性薄層(2)7基材フィルム(1)を基
本の層構成とする.接着剤層(0を付加して保護被膜層
(3)/導電性薄層(2)/基材フィルム(1)l接着
剤層(0の層構成としたり、基材フィルム(1)の他面
側に装飾層(5)を設けて、保護被膜層(3)/導電性
薄層(2)l基材フィルム(1)/装S層(5)あるい
は保護被膜層(3)l導電性薄層(2)/基材フィルム
(1)l装飾層(5)/接着剤層(0の層構成としたり
ることができることは先に述べた通りである.これらの
層以外にも、本発明の趣旨を損なわない限りにおいて他
の層を付加することも可能である.
二二二とIL五kり
上記層構成のシートには、通常アース用端子(6)を付
設する.
アース用端子(6)は、シートの一端にホールをあけて
そこに付設したり、導電性薄層(2)から導電片を引き
出してそこに付設したりすればよい.
このアース用端子(6)には、使用時にアース線を接続
する.
肢東度工j
対象成形品としては、家電製品のハウジング争仕切り板
●カバー,オーディオ製品のカバー、ディスプレー力バ
ー、家具、建築用内装材,自動車の部品、風防、計器の
透視窓、灯取り窓、風防をはじめ、種々のものがあげら
れる・
成形品の材質としては,ポリエチレン、ボリプロビレン
、ボリスチレン、ポリエチレンテレフタレート,ポリブ
チレンテレフタレート、ABS樹脂、ナイロン、ボリア
セタール、ポリカーポネート、ポリ塩化ビニル、ポリ塩
化ビニリデン、ポリメチルメタクリレート、フェノール
樹脂、不飽和ポリエステル、エボキシ樹脂などが例示さ
れる.
作 用
上記層構成の木発明のシートは、成形品の表面に設置さ
れる.シートの設置方法としては,貼着のほか、成形品
を射出成形または真空成形で得る場合に予め金型内にイ
ンサートしておき、成形と同時に成形品表面に一体化す
ることもできる.シートに付設されたアース用端子(6
)にアース線を接続することにより成形品の効果的な帯
電防止が図られる.
実施例
次に実施例をあげて木発明をさらに説明する.実施例1
《シ一トの製造〉
第1図は、本発明の帯電防止用プラスチックスシートの
一例を示した断面図である.
厚さ150JLmのポリエチレンテレフタレートフィル
ムよりなる基材フィルム(1)の片面に,イオンプレー
ティング法によりITOを蒸着させ、厚さ400Aの導
電性薄層(2)を形成させた.
ついでこの導電性薄層(2)の上に、ソルビタンモノラ
ウレートおよびステアリン酸モノグリセライドを各1重
量%混入した界面活性剤系帯電防止性物質入りアクリル
系紫外線硬化型ハードコーティング剤を塗布し、紫外線
照射を行って、厚さ約31Lmの保護被膜層(3)を形
成させた.次に、基材フィルム(1)の他面に、染料を
添加したアクリル系インクを印刷したのち乾燥して装M
層(5)を形成し,ついでその上からアクリル系感圧接
着剤の溶液をコーティングし、80℃で乾燥して,厚さ
約251L■の接着剤層(4)を形成させた.
これにより、保護被膜層(3)/導電性薄層(2)/基
材フィルム(1)/装飾層(5)l接着剤層(0の層構
成を有する第1図に示した透明な帯電防止用プラスチッ
クスシートが得られた.
このシートの一端にホールをあけてアース用端子(6)
を付設した.
ポリメチルメタクリレートを射出成形して得られた厚さ
1■の板の表面に、このシートをその接着剤層(0側が
板偏になるように貼着し、シートの端子(6)にアース
線を接続した.
〈試験方法および結果〉
上記貼着成形品につき、静電フィールドメータ、静電気
印加装置、X−Yレコーダおよび表面抵抗計を用いて静
電気帯電減衰量および表面抵抗値を測定し、帯電防止性
を評価した.
印加時間は5秒とし,環境条件としては、温度18.8
”0 .湿度37.1%RHの乾燥条件を採用した.
結果は次の通りであった.
帯電量 印加中 −2.4 KV印加直後 −
〇.7 KV
5秒% −Q.5KV
lO秒後 −0.5 KV
15秒後 −0.8 KV
表面抵抗 io3〜104Ω
上記のように,実施例lの貼着成形品は,湿度37.1
%RHという乾燥条件にもかかわらず、確実に帯電防止
性を有することがわかる.
比較例1〜2
実施例lと同様にして,基材フィルム(l)/装飾層(
5)/接着剤層(4)の層構成のシート(比較例l)、
および,保護被膜層(3)7基材フィルム(1)l装飾
層(5)/接着剤層(0の層構成のシート(比較例2)
を作成した.
結果は次の通りであった.
比較例l
帯電量 印加中 −3.2 KV印加直後 −
3.8 KV
5秒後 −3.7 KV
15秒後 −3.8 KV
表面抵抗 lO′3〜1o″Ω
比較例2
帯″ttL量 印加中 −3.8 KV印加直後
−1.2 KV
5秒後 −1.2 KV
15秒後 −1.I KV
表面抵抗 109〜10 Ω
上記のように、比較例2の貼着成形品にあっても、湿度
37.1%RHという乾燥条件では帯電防止性が不足す
ることがわかる.
実施例2
第2図は、本発明の帯電防止用プラスチックスシートの
他の一例を示した断面図である.実施例1において装飾
層(5)の設置のみ省略したほかは実施例1を繰り返し
た.これにより,保護被膜層(3)/導電性薄層(2)
/基材フィルム(1)/接着剤層(0の層構成を有する
第2図に示した透明な帯電防止用プラスチックスシート
が得られた.なお,このシートの導電性薄層(2)から
導電片を引き出して、そこにアース用端子(6)を付設
した.
帯電防1F性は、実施例1と同様に好ましいものであっ
た.
実施例3
厚さloog層の二軸延伸ボリブロビレンフイルムより
なる基材フィルム(1)の片面に、スパッタリング法に
よりITOを蒸着させて、厚さ300Aの導電性薄層(
2)を形成させた.ついでこの導電性薄層(2)の上に
、有機スズ系帯電防止性物質を3重量%混入したアクリ
ルウレタン系樹脂溶液をコーティングし、乾燥、エージ
ングを行って、厚さ約5Bmの保護被膜層(3)を形成
させた.
次に、基材フィルム(1)の他面に、顔料を添加したア
クリル系コーティング剤を全面コーティングしたのち乾
燥して装飾層(5)を形成し,さらにその上からウレタ
ン系接着剤の溶掖をコーティングし、乾燥により溶剤の
大部分を揮発させて厚さ約25ル■の若干のター,クを
有する接着剤層(0を形成させた.
これにより、保護被lll!} (3)/導電性薄層(
2)l基材フィルム(1)/装飾層(5)l接着剤層(
0の層構成を有する透明な帯電防止用プラスチックスシ
ートが得られた.
ボリプロビレンを射出成形して得られた厚さ1量■の板
の表面に、このシートをその接着剤層(4)側が板偏に
なるように貼着し、加熱エージングを行った.シートの
端子(6)にはアース線を接続した.
帯電防止性は、実施例1と同様に好ましいものであった
.
発明の効果
本発明の帯電防止用プラスチックスシートを成形品に貼
着一体化すれば、成形品の外観に悪影響を与えず、しか
も湿度条件に左右されずかつ永続的な帯電防止性を付与
しうる.
また基材フィルム(1)の他面に装飾層(5)を設けれ
ば、帯電防止性と同時に積極的に成形品の美装化を図る
こともできる.Problems to be Solved by the Invention However, in the method (a) above, the molded product loses its aqueous properties and its surface characteristics change.
The problem is that the antistatic properties are significantly reduced when the relative humidity is low. In the method (b) above, (a)
Similarly, there is a problem in that the antistatic properties are significantly reduced when the relative humidity is low. The above methods (C) and (d) have the disadvantage that the hue of the molded product is limited, and when trying to obtain a transparent molded product made of polycarbonate, polymethyl methacrylate, etc. However, this method is difficult to apply and has aesthetic problems. In view of these circumstances, the present invention aims to provide an antistatic plastic sheet that does not adversely affect the appearance of molded products, is unaffected by humidity conditions, and can provide permanent antistatic properties. It was done for a purpose. Means for Solving the Problems The antistatic plastic sheet of the present invention has a conductive thin layer (2) of a metal or metal oxide on one side of a base film (1), and a conductive thin layer (2) of a metal or metal oxide. 2) A protective coating layer (3) containing an antistatic substance is provided on top. The present invention will be explained in detail below. Examples of the base film (1) include polyester films, polyamide films, polyolefin films, polyvinyl chloride films, polyvinylidene chloride films, polystyrene films, and polyurethane films. , cellulose-based films, etc. are used. It is desirable that the base film (1) be transparent. Furthermore, it may be stretched or may be a laminate film with two or more layers. There is no particular limitation on the thickness of the base film (+), but the thickness is between 5 and
Something around 200 JLI is often used. prefecture! 1st Section D A conductive S layer (2) made of metal or metal oxide is provided on one side of the base film (1). Conductive thin R (2
) is particularly desirable to be transparent. The above metals or metal oxides include indium, iridium, aluminum, gold, silver, copper, nickel, chromium, titanium, stainless steel, iron, cobalt, molybdenum, rhodium, palladium, gallium, lead, tin, tantalum, Examples include metals such as platinum and metal oxides, which are used alone, in alloys, or in mixtures. Among these, ITO (indium-tin composite oxide) is particularly important. The conductive thin layer (2) is formed by means such as ion plating, sputtering, vacuum deposition, plating, etc., and its thickness is often 50 to 2000 A or more. A protective film layer (3) containing an antistatic substance is provided on the conductive thin film layer (2). Examples of antistatic substances include surfactants such as nonionic, anionic, cationic, or amphoteric surfactants; metals or I
Metal oxides such as TO; carbon black; organometallic compounds including organotin compounds; organic compounds such as polyaniline, polypyrrole, polythiophene, polyacetylene, polyphenylene vinylene, etc. as 7 receptors;
A combination of this with an appropriate donor is used,
Among these, those in which the formed conductive film layer (2) is transparent are preferred. The matrix components forming the protected M layer (3) include acrylic resin, urethane resin, epoxy resin, polyester resin, silicone resin, fluorine resin, melamine resin, phenol resin, and urea resin. , diallylphthalate resin, alkyd resin, maleated rosin, polyvinyl butyral, cellulose polymer, polyamide resin, vinyl chloride-vinyl acetate copolymer, and various other thermosetting resins.
Thermoplastic or active energy ray-curable polymers are used. The protective coating layer (3) is particularly preferably a hard coating layer, that is, a scratch-resistant coating layer. Examples of hard coating agents include ultraviolet curable hard coating agents that use acrylic resin or urethane-modified acrylic resin as the main ingredient, and thermosetting hard coating agents that use silicone resin as the main ingredient. The amount of antistatic substance mixed in the protective coating layer (3) is:
Although it cannot be determined unconditionally because it varies greatly depending on the type of antistatic substance, it is often set to, for example, 0.1 to 50% by weight. The protective coating layer (3) is usually formed by a solution coating method, a dispersion coating method, or an extrusion coating method, but in some cases, a dry lamination method may be employed. The thickness of the protective coating layer (3) is set to, for example, 0.5 to 50 μm. An adhesive layer (4) is provided on the other side of the skin shin area base material film (1),
Try to ensure close contact with the target object, the molded product. However, when providing an adhesive layer on the molded product side, or when attempting to bond at the same time as in-mold molding,
The installation of the adhesive layer (0) on the other side of the base film (1) can be omitted. glue,
Adhesives such as epoxy adhesives, vinyl adhesives, natural adhesives, etc.: Rubber pressure sensitive adhesives, acrylic pressure sensitive adhesives, silicone pressure sensitive adhesives, vinyl pressure sensitive adhesives, etc. Pressure adhesives; hot melt adhesives such as ethylene-vinyl acetate copolymer hot melt adhesives, acrylic hot melt adhesives, and polyester hot melt adhesives; rewetting adhesives; etc. are used. There is no limit to the thickness of the adhesive layer (4), but it is often about 3 to 100 gm, for example. The other side of the base film (1) (when the adhesive layer (4) is provided, the base film (1) side on the side where the adhesive layer (4) is installed)
In this case, Ill! It is preferable to provide one layer (5). Dressing f! Examples of li R(5) include printed layers and colored layers. The thickness of the decorative layer (5) is also not particularly limited, but may be 3 to 50.
It is often at the stage of terminal pus. Antistatic Plastic Sheet The antistatic plastic sheet of the present invention has a basic layer structure consisting of a protective film layer (3), a conductive thin layer (2), and a base film (1). Adhesive layer (protective coating layer (3) / conductive thin layer (2) / base film (1) by adding 0, adhesive layer (0) layer structure, or base film (1) etc. A decorative layer (5) is provided on the surface side, and a protective coating layer (3) / conductive thin layer (2) / base film (1) / protective coating layer (5) or protective coating layer (3) / conductive As mentioned above, the layer structure of thin layer (2) / base film (1) / decoration layer (5) / adhesive layer (0) can be used. It is also possible to add other layers as long as it does not impair the spirit of the invention. A grounding terminal (6) is usually attached to a sheet with the above layer structure of 222 and IL5k. (6) can be attached to one end of the sheet by making a hole, or by pulling out a conductive piece from the conductive thin layer (2) and attaching it there. , connect the ground wire when in use.Toriko Shitoj Applicable molded products include housing divider covers for home appliances, covers for audio products, display power bars, furniture, interior materials for construction, automobile parts, There are various types including windshields, see-through windows for instruments, light windows, and windshields. Materials for molded products include polyethylene, polypropylene, polystyrene, polyethylene terephthalate, polybutylene terephthalate, ABS resin, nylon, polyacetal, Examples include polycarbonate, polyvinyl chloride, polyvinylidene chloride, polymethyl methacrylate, phenolic resin, unsaturated polyester, epoxy resin, etc. Function: The sheet of the invention with the above layer structure is installed on the surface of a molded product. The sheet can be installed by pasting, or if the molded product is obtained by injection molding or vacuum forming, it can be inserted into the mold in advance and integrated into the surface of the molded product at the same time as molding. Ground terminal attached to the seat (6
) By connecting a ground wire to the ground wire, molded products can be effectively prevented from being charged. EXAMPLE Next, the tree invention will be further explained by giving an example. Example 1 <<Manufacture of Sheet>> FIG. 1 is a sectional view showing an example of the antistatic plastic sheet of the present invention. ITO was deposited by ion plating on one side of a base film (1) made of polyethylene terephthalate film with a thickness of 150 JLm to form a conductive thin layer (2) with a thickness of 400 A. Next, on this conductive thin layer (2), an acrylic UV-curable hard coating agent containing a surfactant-based antistatic substance containing 1% by weight each of sorbitan monolaurate and stearic acid monoglyceride is applied. Irradiation was performed to form a protective coating layer (3) with a thickness of approximately 31 Lm. Next, acrylic ink containing dye is printed on the other side of the base film (1), and then dried and mounted.
Layer (5) was formed, and then an acrylic pressure-sensitive adhesive solution was coated thereon and dried at 80°C to form adhesive layer (4) with a thickness of about 251 L. As a result, the transparent electrically charged layer shown in FIG. A protective plastic sheet was obtained. Drill a hole at one end of this sheet and connect the ground terminal (6).
has been added. This sheet was pasted on the surface of a 1-inch thick plate obtained by injection molding polymethyl methacrylate, with the adhesive layer (0 side being biased), and a ground wire was connected to the terminal (6) of the sheet. <Test method and results> For the above bonded molded product, the electrostatic charge attenuation and surface resistance were measured using an electrostatic field meter, electrostatic charge applicator, X-Y recorder, and surface resistance meter. The prevention property was evaluated. The application time was 5 seconds, and the environmental conditions were a temperature of 18.8
Drying conditions of 0. Humidity and 37.1% RH were adopted. The results were as follows. Charge amount During application -2.4 Immediately after KV application -
〇. 7 KV 5 seconds% -Q. 5 KV after 10 seconds -0.5 KV after 15 seconds -0.8 KV Surface resistance io3~104Ω As mentioned above, the adhesive molded product of Example 1 has a humidity of 37.1
Despite the drying conditions of % RH, it can be seen that it definitely has antistatic properties. Comparative Examples 1 to 2 In the same manner as in Example 1, base film (l)/decoration layer (
5)/Sheet with layer configuration of adhesive layer (4) (Comparative Example 1),
And, protective coating layer (3) 7 base film (1) decoration layer (5)/adhesive layer (0 sheet (comparative example 2)
It was created. The results were as follows. Comparative example l Charge amount During application -3.2 Immediately after KV application -
3.8 KV After 5 seconds -3.7 KV After 15 seconds -3.8 KV Surface resistance lO'3~1o''Ω Comparative example 2 Band''ttL amount During application -3.8 KV Immediately after application -1.2 KV After 5 seconds -1.2 KV After 15 seconds -1. I KV Surface resistance 109 to 10 Ω As mentioned above, it can be seen that even the adhesive molded product of Comparative Example 2 lacks antistatic properties under dry conditions of humidity 37.1% RH. Example 2 FIG. 2 is a sectional view showing another example of the antistatic plastic sheet of the present invention. Example 1 was repeated except that only the installation of the decorative layer (5) was omitted. As a result, the protective coating layer (3)/conductive thin layer (2)
A transparent antistatic plastic sheet shown in FIG. 2 having a layer structure of /base film (1)/adhesive layer (0) was obtained.The conductive thin layer (2) of this sheet The conductive piece was pulled out and a grounding terminal (6) was attached to it. The antistatic property was as good as in Example 1. Example 3 Biaxially oriented polypropylene with a loog thickness layer ITO was deposited on one side of the base film (1) by sputtering to form a conductive thin layer (300A thick).
2) was formed. Next, this conductive thin layer (2) is coated with an acrylic urethane resin solution mixed with 3% by weight of an organic tin antistatic substance, dried and aged to form a protective coating layer with a thickness of about 5 Bm. (3) was formed. Next, the other side of the base film (1) is entirely coated with an acrylic coating agent containing pigments, dried to form a decorative layer (5), and then a urethane adhesive is applied on top of the decorative layer (5). By drying, most of the solvent was evaporated to form an adhesive layer (0) with some turquoise and a thickness of about 25 mm. This created a protective coating (3)/ Conductive thin layer (
2) Base film (1)/Decorative layer (5) Adhesive layer (
A transparent antistatic plastic sheet having a layer structure of 0 was obtained. This sheet was attached to the surface of a 1-inch thick plate obtained by injection molding polypropylene so that the adhesive layer (4) side was biased, and heat aging was performed. A ground wire was connected to the terminal (6) on the seat. The antistatic properties were as favorable as in Example 1. Effects of the Invention If the antistatic plastic sheet of the present invention is attached and integrated with a molded product, it will not adversely affect the appearance of the molded product, and will provide permanent antistatic properties that are not affected by humidity conditions. sell. Furthermore, by providing a decorative layer (5) on the other side of the base film (1), it is possible to actively improve the aesthetic appearance of the molded product while also providing antistatic properties.
第1図は、本発明の帯電防止用プラスチックスシートの
一例を示した断面図である.FIG. 1 is a sectional view showing an example of the antistatic plastic sheet of the present invention.
Claims (5)
による導電性薄層(2)を設けると共に、該導電性薄膜
層(2)上に帯電防止性物質を混入した保護被膜層(3
)を設けたことを特徴とする帯電防止用プラスチックス
シート。1. A conductive thin layer (2) made of metal or metal oxide is provided on one side of the base film (1), and a protective coating layer (3) containing an antistatic substance is provided on the conductive thin film layer (2).
) is an antistatic plastic sheet.
たことを特徴とする請求項1記載のシート。2. The sheet according to claim 1, characterized in that an adhesive layer (4) is provided on the other surface of the base film (1).
求項1記載のシート。3. The sheet according to claim 1, wherein the protective coating layer (3) is a hard coating layer.
ことを特徴とする請求項1記載のシート。4. The sheet according to claim 1, characterized in that a decorative layer (5) is provided on the other surface of the base film (1).
項1記載のシート。5. The seat according to claim 1, wherein the seat is provided with a grounding terminal (6).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1115696A JPH02295732A (en) | 1989-05-09 | 1989-05-09 | Antistatic plastic sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1115696A JPH02295732A (en) | 1989-05-09 | 1989-05-09 | Antistatic plastic sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02295732A true JPH02295732A (en) | 1990-12-06 |
Family
ID=14668977
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1115696A Pending JPH02295732A (en) | 1989-05-09 | 1989-05-09 | Antistatic plastic sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02295732A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0710998U (en) * | 1993-07-02 | 1995-02-14 | 幸夫 城尾 | Electronic circuit cover with electromagnetic wave blocking function |
WO2006126820A1 (en) * | 2005-05-23 | 2006-11-30 | Kwang Suck Suh | Plastic sheet having enhanced formability for carrier tape |
JP2007108220A (en) * | 2005-10-11 | 2007-04-26 | Nitto Denko Corp | Antistatic optical film, antistatic adhesive type optical film, and image display device |
JP2012186222A (en) * | 2011-03-03 | 2012-09-27 | Nagase Chemtex Corp | Molding electromagnetic wave shield sheet and electromagnetic wave shield molded body |
-
1989
- 1989-05-09 JP JP1115696A patent/JPH02295732A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0710998U (en) * | 1993-07-02 | 1995-02-14 | 幸夫 城尾 | Electronic circuit cover with electromagnetic wave blocking function |
WO2006126820A1 (en) * | 2005-05-23 | 2006-11-30 | Kwang Suck Suh | Plastic sheet having enhanced formability for carrier tape |
JP2007108220A (en) * | 2005-10-11 | 2007-04-26 | Nitto Denko Corp | Antistatic optical film, antistatic adhesive type optical film, and image display device |
JP2012186222A (en) * | 2011-03-03 | 2012-09-27 | Nagase Chemtex Corp | Molding electromagnetic wave shield sheet and electromagnetic wave shield molded body |
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