JPH0229531U - - Google Patents
Info
- Publication number
- JPH0229531U JPH0229531U JP10887088U JP10887088U JPH0229531U JP H0229531 U JPH0229531 U JP H0229531U JP 10887088 U JP10887088 U JP 10887088U JP 10887088 U JP10887088 U JP 10887088U JP H0229531 U JPH0229531 U JP H0229531U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit package
- ceiling portion
- fixing means
- fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000010354 integration Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Description
第１図ａは本考案の第１実施例のパツケージカ
バーを保護対象の集積回路パツケージにかぶせた
状態を示す斜視図、同図ｂは同図ａのＡ―Ａ断面
図、第２図ａ，ｂはそれぞれ本考案の第２実施例
の斜視図およびＡ―Ａ断面図、第３図は本考案の
第３実施例の斜視図、第４図は本考案のパツケー
ジカバーの用いられるＤＩＰ型集積回路パツケー
ジの斜視図である。
１，５……天井部、２，６……リード端子保護
カバー部、３，４，７……固定部、１１……集積
回路パツケージ（本体）、１２……リード端子。
Fig. 1a is a perspective view showing the package cover of the first embodiment of the present invention covering an integrated circuit package to be protected, Fig. 1b is a sectional view taken along line AA in Fig. 2a, b is a perspective view and an A-A sectional view of the second embodiment of the present invention, FIG. 3 is a perspective view of the third embodiment of the present invention, and FIG. 4 is a DIP type integration in which the package cover of the present invention is used. FIG. 3 is a perspective view of the circuit package. 1, 5... Ceiling part, 2, 6... Lead terminal protective cover part, 3, 4, 7... Fixing part, 11... Integrated circuit package (main body), 12... Lead terminal.
Claims (1)
の天井部の周辺の少くとも２辺から下方に垂れ曲
げられているリード端子保護カバー部と、前記天
井部を前記集積回路パツケージの本体に固定する
ための固定手段とを備えていることを特徴とする
集積回路パツケージカバー。 A ceiling portion that covers the upper surface of the integrated circuit package; a lead terminal protection cover portion that hangs downward from at least two sides around the ceiling portion; and a portion for fixing the ceiling portion to the main body of the integrated circuit package. An integrated circuit package cover comprising: a fixing means; and a fixing means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10887088U JPH0229531U (en) | 1988-08-18 | 1988-08-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10887088U JPH0229531U (en) | 1988-08-18 | 1988-08-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0229531U true JPH0229531U (en) | 1990-02-26 |
Family
ID=31344606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10887088U Pending JPH0229531U (en) | 1988-08-18 | 1988-08-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0229531U (en) |
-
1988
- 1988-08-18 JP JP10887088U patent/JPH0229531U/ja active Pending