JPH0229524U - - Google Patents

Info

Publication number
JPH0229524U
JPH0229524U JP10770188U JP10770188U JPH0229524U JP H0229524 U JPH0229524 U JP H0229524U JP 10770188 U JP10770188 U JP 10770188U JP 10770188 U JP10770188 U JP 10770188U JP H0229524 U JPH0229524 U JP H0229524U
Authority
JP
Japan
Prior art keywords
semiconductor chip
chip suction
holder
suctioning
collet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10770188U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10770188U priority Critical patent/JPH0229524U/ja
Publication of JPH0229524U publication Critical patent/JPH0229524U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75302—Shape
    • H01L2224/75303—Shape of the pressing surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP10770188U 1988-08-15 1988-08-15 Pending JPH0229524U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10770188U JPH0229524U (zh) 1988-08-15 1988-08-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10770188U JPH0229524U (zh) 1988-08-15 1988-08-15

Publications (1)

Publication Number Publication Date
JPH0229524U true JPH0229524U (zh) 1990-02-26

Family

ID=31342352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10770188U Pending JPH0229524U (zh) 1988-08-15 1988-08-15

Country Status (1)

Country Link
JP (1) JPH0229524U (zh)

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