JPH0229524U - - Google Patents
Info
- Publication number
- JPH0229524U JPH0229524U JP10770188U JP10770188U JPH0229524U JP H0229524 U JPH0229524 U JP H0229524U JP 10770188 U JP10770188 U JP 10770188U JP 10770188 U JP10770188 U JP 10770188U JP H0229524 U JPH0229524 U JP H0229524U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- chip suction
- holder
- suctioning
- collet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000008188 pellet Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
- H01L2224/75303—Shape of the pressing surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10770188U JPH0229524U (de) | 1988-08-15 | 1988-08-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10770188U JPH0229524U (de) | 1988-08-15 | 1988-08-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0229524U true JPH0229524U (de) | 1990-02-26 |
Family
ID=31342352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10770188U Pending JPH0229524U (de) | 1988-08-15 | 1988-08-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0229524U (de) |
-
1988
- 1988-08-15 JP JP10770188U patent/JPH0229524U/ja active Pending