JPH02291901A - Tactile array sensor - Google Patents

Tactile array sensor

Info

Publication number
JPH02291901A
JPH02291901A JP1112092A JP11209289A JPH02291901A JP H02291901 A JPH02291901 A JP H02291901A JP 1112092 A JP1112092 A JP 1112092A JP 11209289 A JP11209289 A JP 11209289A JP H02291901 A JPH02291901 A JP H02291901A
Authority
JP
Japan
Prior art keywords
electret
electrode
vibrator
insulating substrate
lsi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1112092A
Other languages
Japanese (ja)
Inventor
Kunitoshi Nishimura
国俊 西村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP1112092A priority Critical patent/JPH02291901A/en
Publication of JPH02291901A publication Critical patent/JPH02291901A/en
Pending legal-status Critical Current

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  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Geophysics And Detection Of Objects (AREA)

Abstract

PURPOSE:To make it possible to detect the position and the attitude of a light, minute component such as an optical component and an LSI by implanting hairlike bodies in an electret vibrator. CONSTITUTION:A rear-surface electrode 24 is arranged on an insulating substrate 31 in a honeycomb patter. FETs 25 and resistors 27 in IC forms are incorporated in the inside of the electrode 24 so that they are equivalent to circuits. At this time, however, a power source 26 is not incorporated. A power source terminal 32 and an output terminal 33 are wired at the lower side of the insulating substrate 31 by way of through holes. The electrode 24 is supported with a nonconductive body 34. A conductive partitioning wall 35 is designed so that its height is higher than the height of the electrode by 10 - 100mum. The wall 35 surrounds the electrode 24. An electret vibrator 21 is stuck to the upper surface of the partitioning wall 35. Hairlike bodies 36 are implanted into the upper surface. When the hairlike bodies 36 are pushed, the electret vibrator 21 is deformed. Electric signals are outputted based on the same principle of operation as that of an electret microphone. In this way, the position and the attitude of a light, minute component such as an optical component and an LSI can be detected.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、対象物との間の接触状態を検出し、その形
状や位置.姿勢を検出する触覚アレイセンサに関するも
ので、ロボットや工業機械に取り付けることにより有用
な機能を発揮できるものである。
[Detailed Description of the Invention] [Industrial Application Field] This invention detects the state of contact with an object, and determines its shape and position. This relates to a tactile array sensor that detects posture, and can perform useful functions by attaching it to robots and industrial machines.

〔従来の技術〕[Conventional technology]

ロボット装置やロボットシステムは、各種分野で有用な
働きをなすが、さらに人間に近い高度の働きをなすため
には、ロボットが扱う対象物の位置,形状等を正確に検
出できるセンサが必要となる。
Robotic devices and systems perform useful functions in various fields, but in order to function at a higher level similar to that of humans, sensors that can accurately detect the position, shape, etc. of objects handled by robots are required. .

第5図は特開昭62−204102号公報で示されるア
レイ状触覚センサである。第5図において、1は非弾性
が好ましい基礎材料であり、平坦あるいは任意の曲形の
台である。希望に応じて基礎材料1に隣接して弾性材2
を配置する。3は付勢層で、基礎材料1あるいは任意の
弾性材2に隣接して配置される.付勢層3はポリビニリ
デンフッ化物(PVF,)等の圧電性材料4と、その両
面にある電極5および6から構成される。?lt極5.
6は電極棒あるいは導体の平行のアレイであり、互いに
直角となるように配置されている。電極6に隣接して絶
縁層7が位置する。8は圧電性検出層で、絶縁層7に隣
接して位置する。この圧電性検出層8は両面に導体10
.11を備えた圧電性材料9から構成される。最後に全
体を周囲から保護するための任意の弾性保護層12を配
置する。
FIG. 5 shows an arrayed tactile sensor disclosed in Japanese Patent Laid-Open No. 62-204102. In FIG. 5, 1 is a base material preferably inelastic, and is a flat or arbitrarily curved platform. Elastic material 2 adjacent to base material 1 as desired
Place. Reference numeral 3 denotes a biasing layer, which is placed adjacent to the base material 1 or any elastic material 2. The biasing layer 3 is composed of a piezoelectric material 4 such as polyvinylidene fluoride (PVF) and electrodes 5 and 6 on both sides thereof. ? lt pole 5.
6 is a parallel array of electrode rods or conductors arranged at right angles to each other. An insulating layer 7 is located adjacent to the electrode 6 . 8 is a piezoelectric detection layer located adjacent to the insulating layer 7. This piezoelectric detection layer 8 has conductors 10 on both sides.
.. It consists of a piezoelectric material 9 with 11. Finally, an optional elastic protective layer 12 is placed to protect the whole from the surroundings.

第6図は、付勢層3の配置を詳細に示す分解図である。FIG. 6 is an exploded view showing the arrangement of the biasing layer 3 in detail.

この付oIjrgJ3は、その一方の面に配首された複
数の導体5と、反対側の面の複数の導体6により構成さ
れている。
This attachment oIjrgJ3 is composed of a plurality of conductors 5 arranged on one surface thereof and a plurality of conductors 6 on the opposite surface.

今、弾性保護層12(第5図)を介して、上方より外力
が加えられる場合を想定する。その外力は圧電性検出層
8等を介し、圧電性材料4にも力をおよぼす。今、圧電
性材料4の部分13に力が加わったとする。この時、電
極5,6の部分1415間に電位差が生じるので、行列
アドレス指定の時間多重化等の手法を用いれば、力の加
えられた位置およびその大きさを知ることができる。外
力がある分布をもつ場合、その分布の状態が上記の手法
により検出できる。すなわち、大きさを持った物体が弾
性保護層12に押しつけられると、出力信号よりその形
状や位置,姿勢を知ることができるわけである.圧電性
検出層8は、加えられた全外力の大きさを正確に検出す
る時等に使用する。
Now, assume that an external force is applied from above through the elastic protective layer 12 (FIG. 5). The external force also acts on the piezoelectric material 4 via the piezoelectric detection layer 8 and the like. Suppose now that a force is applied to the portion 13 of the piezoelectric material 4. At this time, a potential difference occurs between the portions 1415 of the electrodes 5 and 6, so if a technique such as time multiplexing of matrix addressing is used, the position where the force is applied and its magnitude can be known. If the external force has a certain distribution, the state of that distribution can be detected by the above method. In other words, when a large object is pressed against the elastic protective layer 12, its shape, position, and attitude can be determined from the output signal. The piezoelectric detection layer 8 is used to accurately detect the magnitude of the total external force applied.

〔発明が解決しようとする課題〕 しかしながら、上記従来のアレイ状触覚センサは、圧電
性検出層8,絶縁層7,1極6を介して圧電性材料4に
外力が加わるため、内部にいくに従い力が広がってしま
い、分解能を高くでき2♂い。
[Problems to be Solved by the Invention] However, in the conventional arrayed tactile sensor described above, since an external force is applied to the piezoelectric material 4 via the piezoelectric detection layer 8, the insulating layer 7, and the single pole 6, The force spreads out, making it difficult to increase the resolution by 2♂.

また、検田素子として圧電性材料4を用いているため、
ダラム以下の微少な力は検出できない等の欠点があった
, 触覚アレイセンサには、この他、検出素子として導電ゴ
ムを使用したもの等があるが、いずれも上記と同じ欠点
がある。
In addition, since the piezoelectric material 4 is used as the detector element,
There are other tactile array sensors that use conductive rubber as the detection element, but they all have the same drawbacks as above.

この発明の目的は、従来発明の欠点であった分解能の低
さ,検出感度の低さを解決したものであり、光部品やL
SI等の軽量微小な部品の位首.姿勢を正確に検出でき
る触覚アレイセンサを提倶することにある。
The purpose of this invention is to solve the drawbacks of conventional inventions, such as low resolution and low detection sensitivity.
Ranking of light and small parts such as SI. An object of the present invention is to provide a tactile array sensor that can accurately detect posture.

〔課題を解決するための手段〕[Means to solve the problem]

この発明に係る触覚アレイセンサは、アl/イ状に配置
された電極と、その電極を取り囲む電極より高い隔壁と
、隔壁の上面によフて平面的に支持されるエレクトレッ
ト振動体と、ニレクトレット振動体上に植毛された毛状
体とからなるものである。
The tactile array sensor according to the present invention includes electrodes arranged in an Al/A shape, a partition wall surrounding the electrodes that is higher than the electrodes, an electret vibrating body supported in a plane by the upper surface of the partition wall, and a electret It consists of a vibrating body and a hair-like body.

(作用) この発明においては、毛状体を押圧するとニレクトレッ
ト振動体が変形し、エレクトレットマイクロホンと同じ
動作原理で電気信号が出力される。
(Function) In this invention, when the hair-like body is pressed, the electret vibrating body is deformed, and an electric signal is output based on the same operating principle as an electret microphone.

〔実施例〕〔Example〕

第1図はこの発明の検$原埋を示す図である。 FIG. 1 is a diagram showing the detection and burial of the present invention.

エレクトレット振動体21は、エレクトレット処理の施
された有機薄膜22とその表面に蒸着されたアルミ等の
導体金属23よりなる.24は背面電極であり、50〜
100μm程度の隙間でニレクトレット振動体21と向
い合っている。何等かの外力によりエレクトレット娠動
体21が変位すると、それに対応した誘導電荷が背面電
極24に生ずる。この静電容量は数十pFと小さいが、
高い入力インピーダンスのFET25のソースフォロワ
回路で増幅され、出力端子28に電圧が得られる。この
検出感度は極めて高く、エレクトレットマイクロフォン
として応用されている。FET25には電源26と抵抗
体27が直列に接続されるだけの極めて単純な回路構成
である。
The electret vibrating body 21 is composed of an electret-treated organic thin film 22 and a conductive metal 23 such as aluminum deposited on its surface. 24 is a back electrode, 50~
It faces the Nielectret vibrating body 21 with a gap of about 100 μm. When the electret movable body 21 is displaced by some external force, a corresponding induced charge is generated on the back electrode 24. This capacitance is small, several tens of pF, but
It is amplified by the source follower circuit of the FET 25 with high input impedance, and a voltage is obtained at the output terminal 28. This detection sensitivity is extremely high, and it is used as an electret microphone. The FET 25 has an extremely simple circuit configuration in which a power supply 26 and a resistor 27 are connected in series.

第2図はこの発明の一実施例である。第3図はその断面
図である.24は第1図と同じ背面電極であり、絶縁基
板31上に規制正しく、図の場合では蜂の巣状に配置さ
れている。背面電極24の内部にはIC化されたFET
25および抵抗体27が第1図で示される回路と等価と
なるように内蔵されている。ただしこの場合、電源26
は内蔵されておらず、電源端子32および出力端子33
が絶縁基板31の下側にスルーホールで配線されている
.背面電極24は不導体34で支持されている.35は
導体性の隔壁であり、背面電極24を取り囲んでいる.
また、その高さは背面電極24の高さより10〜100
μm高くなるように設計されている。
FIG. 2 shows an embodiment of this invention. Figure 3 is its cross-sectional view. 24 is the same back electrode as in FIG. 1, and is arranged on the insulating substrate 31 in a regular manner, in the case of the figure, in a honeycomb shape. There is an IC FET inside the back electrode 24.
25 and a resistor 27 are built in so as to be equivalent to the circuit shown in FIG. However, in this case, the power supply 26
is not built-in, and the power supply terminal 32 and output terminal 33
are wired through holes on the underside of the insulating substrate 31. The back electrode 24 is supported by a nonconductor 34. 35 is a conductive partition wall that surrounds the back electrode 24.
Further, its height is 10 to 100 mm higher than the height of the back electrode 24.
It is designed to be µm higher.

隔壁35の上面にはエレクトレット振動体21が貼られ
、さらにその上面には毛状体36が膜面に垂直となるよ
うに植毛されている。
The electret vibrating body 21 is pasted on the upper surface of the partition wall 35, and further, hair-like bodies 36 are flocked on the upper surface so as to be perpendicular to the membrane surface.

何等かの物体が上面より押しつけられると、毛状体36
を介してエレクトレット振動体21を変形させるので、
第1図で説明したように、その変形の程度を電気信号と
して取り出すことができる。アレイ状に配置した各素子
からの信号を演算処理すれば物体の形状等は識別できる
When some object is pressed from the top surface, the hair-like body 36
Since the electret vibrating body 21 is deformed through
As explained in FIG. 1, the degree of deformation can be extracted as an electrical signal. The shape of an object can be identified by processing signals from each element arranged in an array.

第2図の実施例においては、絶縁基板31に対し背面電
極24と同一側にFET25や抵抗体27を配したが、
第4図に示すように、反対側に配してもよい。この場合
、電気的信号処理部(FET25や抵抗体27)と受感
部(エレクトレット振勤膜21や背面電極24等)が完
全に分離できるので、製作が容易になる。
In the embodiment shown in FIG. 2, the FET 25 and the resistor 27 are placed on the same side of the insulating substrate 31 as the back electrode 24;
As shown in FIG. 4, they may be placed on opposite sides. In this case, the electrical signal processing section (FET 25 and resistor 27) and the sensing section (electret vibration membrane 21, back electrode 24, etc.) can be completely separated, which facilitates manufacturing.

なお、各素子の配置は蜂の巣状配置で説明したが、これ
に限定されることなく碁盤目状等、いかなる配置であっ
てもよいが、物体の形状等を各素子の出力信号より演算
することを考慮すれば単純な碁盛目状が望ましい。以上
の構造は、機械加工と電気素子の組合せによって製作可
能であるが、LSIの製造技術を応用することも可能で
あり、その場合は個々の検出素子は0.1mm以下と非
常に小さく、すなわち分解能を高くすることが可能であ
る。
Although the arrangement of each element has been described as a honeycomb arrangement, the arrangement is not limited to this and may be any arrangement such as a grid pattern. However, it is also possible to calculate the shape of an object etc. from the output signal of each element. Considering this, a simple Go scale is desirable. The above structure can be manufactured by a combination of machining and electric elements, but it is also possible to apply LSI manufacturing technology, in which case the individual detection elements are very small, 0.1 mm or less, i.e. It is possible to increase the resolution.

(発明の効果) 以上説明したように、この発明はアレイ状に配置された
電極と、その電極を取り囲む電極より高い隔壁と、隔壁
の上面によって平面的に支持されるエレクトレット振動
体と、ニレクトレット振乃体上に植毛された毛状体とか
らなり、エレクトレットマイクロフォンと同じ動作原理
を用いているため、検出感度が非常に高い。また、力は
毛状体を介してエレクトレット振動体を変形させるため
毛状体が緩衝材となり、膜に局部的な力をおよぼさず、
安定した性能が得られる特徴がある。さらに、この発明
の構成は極めて単純であり、LSIの製造プロセスを用
いて製造することも可能であるため、1つの素子を微細
化可能である。すなわち、分解能が極めて高い触覚アレ
イセンサが実現できる利点を併せ有する。
(Effects of the Invention) As explained above, the present invention includes electrodes arranged in an array, a partition wall surrounding the electrodes that is higher than the electrodes, an electret vibrator supported in a plane by the upper surface of the partition wall, and a electret vibrator. It consists of a hair-like body with hairs planted on the body, and uses the same operating principle as an electret microphone, so the detection sensitivity is extremely high. In addition, since the force deforms the electret vibrating body through the hair-like body, the hair-like body acts as a buffer, and does not apply local force to the membrane.
It has the characteristic of providing stable performance. Furthermore, since the configuration of the present invention is extremely simple and can be manufactured using an LSI manufacturing process, one element can be miniaturized. That is, it also has the advantage of realizing a tactile array sensor with extremely high resolution.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明の原理を説明するための図、第2図は
この発明の一実施例を示す要部を破断した斜視図、第3
図はその断面図、第4図はこの発明の他の実施例を示す
断面図、第5図は従来の触覚アレイセンサの一例を示す
分解斜視図、第6図はその詳細を示す分解斜視図である
。 図中、21はニレクトレット振動体、22は有機薄膜、
23は導体金属、24は背面電極、25はFET、26
は電源、27は抵抗体、28は出力端子、31は絶縁基
板、32は電源端子、33は出力端子、34は不導体、
35は隔壁である。 第7図 第2図 第 図 第 図 第 図
Fig. 1 is a diagram for explaining the principle of the invention, Fig. 2 is a perspective view showing an embodiment of the invention with main parts cut away, and Fig. 3 is a diagram for explaining the principle of the invention.
4 is a sectional view showing another embodiment of the present invention, FIG. 5 is an exploded perspective view showing an example of a conventional tactile array sensor, and FIG. 6 is an exploded perspective view showing details thereof. It is. In the figure, 21 is a Nielectret vibrator, 22 is an organic thin film,
23 is a conductive metal, 24 is a back electrode, 25 is an FET, 26
is a power supply, 27 is a resistor, 28 is an output terminal, 31 is an insulating substrate, 32 is a power supply terminal, 33 is an output terminal, 34 is a nonconductor,
35 is a partition wall. Figure 7 Figure 2 Figure Figure Figure

Claims (1)

【特許請求の範囲】[Claims]  アレイ状に配置された電極と、その電極を取り囲む前
記電極より高い隔壁と、前記隔壁の上面によって平面的
に支持されるエレクトレット振動体と、前記エレクトレ
ット振動体上に植毛された毛状体とからなることを特徴
とする触覚アレイセンサ。
consisting of electrodes arranged in an array, a partition wall surrounding the electrodes that is higher than the electrodes, an electret vibrating body supported in a plane by the upper surface of the partition wall, and a hair-like body implanted on the electret vibrating body. A tactile array sensor characterized by:
JP1112092A 1989-05-02 1989-05-02 Tactile array sensor Pending JPH02291901A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1112092A JPH02291901A (en) 1989-05-02 1989-05-02 Tactile array sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1112092A JPH02291901A (en) 1989-05-02 1989-05-02 Tactile array sensor

Publications (1)

Publication Number Publication Date
JPH02291901A true JPH02291901A (en) 1990-12-03

Family

ID=14577910

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1112092A Pending JPH02291901A (en) 1989-05-02 1989-05-02 Tactile array sensor

Country Status (1)

Country Link
JP (1) JPH02291901A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006292499A (en) * 2005-04-08 2006-10-26 Hitachi Chem Co Ltd Method of obtaining attenuation peak frequency, method of designing wiring having transmission property of no attenuation peak and wiring board using them
JP2006308436A (en) * 2005-04-28 2006-11-09 Agilent Technol Inc Compensation measuring method and verification measuring method
JP2007312551A (en) * 2006-05-19 2007-11-29 Univ Of Tokyo Electrostatic induction type converting device
JP2010127940A (en) * 2008-11-28 2010-06-10 Melexis Technologies Sa Vertical hall sensor

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006292499A (en) * 2005-04-08 2006-10-26 Hitachi Chem Co Ltd Method of obtaining attenuation peak frequency, method of designing wiring having transmission property of no attenuation peak and wiring board using them
JP4613671B2 (en) * 2005-04-08 2011-01-19 日立化成工業株式会社 Multilayer wiring board manufacturing method and multiwire wiring board manufacturing method
JP2006308436A (en) * 2005-04-28 2006-11-09 Agilent Technol Inc Compensation measuring method and verification measuring method
JP2007312551A (en) * 2006-05-19 2007-11-29 Univ Of Tokyo Electrostatic induction type converting device
JP2010127940A (en) * 2008-11-28 2010-06-10 Melexis Technologies Sa Vertical hall sensor

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