JPH02290693A - Solder paste and soldering method for printed circuit board by using this paste - Google Patents
Solder paste and soldering method for printed circuit board by using this pasteInfo
- Publication number
- JPH02290693A JPH02290693A JP10880489A JP10880489A JPH02290693A JP H02290693 A JPH02290693 A JP H02290693A JP 10880489 A JP10880489 A JP 10880489A JP 10880489 A JP10880489 A JP 10880489A JP H02290693 A JPH02290693 A JP H02290693A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- soldering
- solder paste
- paste
- alcohols
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 52
- 238000005476 soldering Methods 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims description 13
- 230000008018 melting Effects 0.000 claims abstract description 12
- 238000002844 melting Methods 0.000 claims abstract description 12
- 239000012298 atmosphere Substances 0.000 claims abstract description 9
- 239000012190 activator Substances 0.000 claims abstract description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000002245 particle Substances 0.000 claims description 10
- 238000009835 boiling Methods 0.000 claims description 5
- 239000011261 inert gas Substances 0.000 claims description 5
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 2
- 229930195729 fatty acid Natural products 0.000 claims description 2
- 239000000194 fatty acid Substances 0.000 claims description 2
- 150000004665 fatty acids Chemical class 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 238000010894 electron beam technology Methods 0.000 claims 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract description 9
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract description 9
- 150000001298 alcohols Chemical class 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 9
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract description 9
- 238000004140 cleaning Methods 0.000 abstract description 5
- 239000002184 metal Substances 0.000 abstract description 5
- 229910052751 metal Inorganic materials 0.000 abstract description 5
- 150000001412 amines Chemical class 0.000 abstract description 4
- 238000000354 decomposition reaction Methods 0.000 abstract description 4
- 230000008020 evaporation Effects 0.000 abstract description 4
- 238000001704 evaporation Methods 0.000 abstract description 4
- 230000004907 flux Effects 0.000 abstract description 4
- 238000000859 sublimation Methods 0.000 abstract description 3
- 230000008022 sublimation Effects 0.000 abstract description 3
- 150000001408 amides Chemical class 0.000 abstract description 2
- 229910044991 metal oxide Inorganic materials 0.000 abstract description 2
- 150000004706 metal oxides Chemical class 0.000 abstract description 2
- 230000003647 oxidation Effects 0.000 abstract description 2
- 238000007254 oxidation reaction Methods 0.000 abstract description 2
- 239000010419 fine particle Substances 0.000 abstract 3
- 239000002253 acid Substances 0.000 abstract 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 239000002562 thickening agent Substances 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000000889 atomisation Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000003915 air pollution Methods 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- XHFGWHUWQXTGAT-UHFFFAOYSA-N dimethylamine hydrochloride Natural products CNC(C)C XHFGWHUWQXTGAT-UHFFFAOYSA-N 0.000 description 1
- IQDGSYLLQPDQDV-UHFFFAOYSA-N dimethylazanium;chloride Chemical compound Cl.CNC IQDGSYLLQPDQDV-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は無線通信機，電子計算機，事務機器，映像機器
，音響機器などに利用できるはんだ付け用のはんだペー
ストおよびそれを用いた電子機器の印刷配線板のはんだ
付け方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a solder paste for soldering that can be used in wireless communication equipment, electronic computers, office equipment, video equipment, audio equipment, etc., and printed wiring for electronic equipment using the same. This relates to a method of soldering plates.
従来の技術
印刷配線板の組立ては、基板に適当な鋼箔パターンをエ
ッチング技術により形成し、前記鋼箔パターンのランド
部に電子部品をはんだ付けして行われている。近年、機
器の小型化，高信頼性化などのため、リードレス電子部
品またはリード付き電子部品の表面実装工法が多用され
ている。従来この表面実装工法は基板の所定位置に接着
剤で電子部品を仮付けした後、噴流はんだ槽によりはん
だ付けするフローはんだ付け工法と、基板のランド部に
はんだペーストを塗布した後、電子部品を装着し、大気
中で熱風加熱炉または蒸気相はんだ付け装置によりはん
だを溶融させてはんだ付けをするりフローはんだ付け工
法とがあった。基板への電子部品の実装密度は、一般に
リフローはんだ付け工法の方が高いため、最近は、リフ
ローはんだ付け工法の採用率が増加している。BACKGROUND OF THE INVENTION Printed wiring boards are assembled by forming a suitable steel foil pattern on a board using an etching technique, and then soldering electronic components to the land portions of the steel foil pattern. In recent years, surface mounting methods for leadless electronic components or leaded electronic components have been frequently used to make devices smaller and more reliable. Conventionally, this surface mount method involves temporarily attaching electronic components to a predetermined position on the board with adhesive and then soldering them using a jet soldering bath.The other method involves applying solder paste to the lands of the board and then soldering the electronic components. There is a flow soldering method in which soldering is carried out by attaching the solder and melting the solder in a hot air heating furnace or a steam phase soldering device in the atmosphere. The mounting density of electronic components on a board is generally higher with reflow soldering, so the rate of adoption of reflow soldering has been increasing recently.
従来のりフローはんだ付け工法に用いるはんだペースト
は、はんだ微粒子と、ロジンと、溶剤と、活性剤等とを
配合していた。粘度は、スクＪ−ン印刷に適すように調
整して用いていた。The solder paste used in the conventional glue flow soldering method contains solder particles, rosin, a solvent, an activator, and the like. The viscosity was adjusted to suit screen printing.
また、印刷配線板はりフローはんだ付けしたのち、弗素
系有機溶剤，塩素系有機溶剤，アルコール類またはこれ
らの混合溶剤により、ゴミ、はんだ粒、フラックスなど
を洗浄していた。Furthermore, after flow soldering a printed wiring board, dust, solder grains, flux, etc. are cleaned using a fluorine-based organic solvent, a chlorinated organic solvent, alcohol, or a mixed solvent thereof.
発明が解決しようとする課題
しかしながら、上記従来のはんだペーストを使ったりフ
ローはんだ付け工法は、はんだ付け後に、溶剤による洗
浄が必要であるが、よく使用される弗素系有機溶剤は大
気の環境汚染の原因になるため問題となっていた。Problems to be Solved by the Invention However, the conventional soldering paste and flow soldering methods described above require cleaning with a solvent after soldering, but the commonly used fluorine-based organic solvents cause atmospheric environmental pollution. This was a problem because it caused
また、蒸気相はんだ付け法も同様の洗浄が必要なだけで
はなく、加熱媒体として弗素系有機溶剤を用いるため、
同様に大気の環境汚染の問題があった。In addition, the vapor phase soldering method not only requires similar cleaning, but also uses a fluorine-based organic solvent as a heating medium.
Similarly, there was the problem of air pollution.
課題を解決するための手段
上記従来のりフローはんだ付け工法の欠点を解消するた
め、本発明者らは鋭意研究を重ねた結果、本発明に至っ
た。Means for Solving the Problems In order to eliminate the drawbacks of the conventional glue flow soldering method described above, the inventors of the present invention have conducted intensive research and have arrived at the present invention.
すなわち、ロジンを含まず沸点の高い、アルコール類に
より金属表面を活性にするはんだペーストを用いること
である。さらに詳し《は、はんだ微粒子とアルコール類
とから主になり、前記アルコール類は、１気圧における
沸点がはんだ微粒子の融点よりも高いものとしている。That is, a solder paste that does not contain rosin and has a high boiling point and activates the metal surface with alcohol is used. More specifically, it mainly consists of solder particles and alcohols, and the alcohols have a boiling point higher than the melting point of the solder particles at 1 atmosphere.
さらにはんだ微粒子の融点以上において蒸発，昇華，分
解などにより気化することが可能な活性剤を添加しても
良い。またメチルメタアクリレート樹脂オリゴマーと加
熱によりラジカルを生成する物質とを添加しても良い。Furthermore, an activator that can be vaporized by evaporation, sublimation, decomposition, etc. above the melting point of the solder particles may be added. Furthermore, a methyl methacrylate resin oligomer and a substance that generates radicals upon heating may be added.
本発明のはんだペーストを用いて印刷配線板のはんだ付
けを行う際には、不活性ガス雰囲気中において、はんだ
を溶融するのが好ましい。またアルコール類は、はんだ
の融点よりも３０度（セ氏）程度沸点が高いものが良《
、アルコール類は、１価アルコール，多価アルコール等
に加えエーテルであったも良い。When soldering printed wiring boards using the solder paste of the present invention, it is preferable to melt the solder in an inert gas atmosphere. Also, it is best to use alcohol with a boiling point about 30 degrees Celsius higher than the melting point of the solder.
In addition to monohydric alcohols, polyhydric alcohols, etc., the alcohols may also be ethers.
作 用
本発明のはんだペーストはロジンを含まず、またアルコ
ール類は、はんだの溶融時に金属の表面酸化物を還元す
る作用があり、はんだ付け時に蒸発，昇華，分解などに
より気化してしまうので、印刷板線板にはほとんど何も
残らず、後の洗浄工程が不要となる。Function The solder paste of the present invention does not contain rosin, and alcohols have the effect of reducing surface oxides of metals when melting solder, and are vaporized during soldering due to evaporation, sublimation, decomposition, etc. Almost nothing remains on the printing plate line board, eliminating the need for a subsequent cleaning step.
また、はんだを溶融して電子部品をはんだ付けする際に
、不活性ガス雰囲気中で行えば、高温による金属の酸化
を最小にでき、ロジンが無くても都合よ《はんだ付けで
きる。活性剤としては、カルボン酸，アミン，アミド，
アミンハロゲン化水素酸塩等が使用でき、金属酸化物の
溶解除去の作用がある。Furthermore, when melting solder and soldering electronic components, it is possible to minimize oxidation of the metal due to high temperatures by doing so in an inert gas atmosphere, and soldering can be conveniently performed even without rosin. Activators include carboxylic acids, amines, amides,
Amine hydrohalides and the like can be used, and have the effect of dissolving and removing metal oxides.
実施例 次に本発明の実施例を説明する。Example Next, examples of the present invention will be described.
（実施例１）
まず粒径１０μｍ程度のはんだ粉を窒素中にてアトマイ
ズ法により製造し、これにジエチレングリコールモノブ
チルエーテルアセテートを全重量に対し１０％、ジブロ
ビレングリコールを全重量に対し１０％加え、スクリー
ン印刷可能なペースト状に調整した。(Example 1) First, solder powder with a particle size of about 10 μm was produced by the atomization method in nitrogen, and diethylene glycol monobutyl ether acetate was added at 10% of the total weight, and dibrobylene glycol was added at 10% of the total weight. , prepared into a screen-printable paste.
（実施例２）
窒素中でアトマイズ法により製造したはんだ粉にトリエ
チレングリコールを全重量の１５・％となるように加え
、ペースト状に調整した。(Example 2) Triethylene glycol was added to solder powder produced by an atomization method in nitrogen in an amount of 15% of the total weight to prepare a paste.
（実施例３）
実施例２のはんだペーストに増粘剤として、脂肪酸アミ
ドを全重量の０．５％加えた。(Example 3) Fatty acid amide was added as a thickener to the solder paste of Example 2 in an amount of 0.5% of the total weight.
（実施例４）
実施例２のはんだペーストに増粘剤として、メチルメタ
アクリレート樹脂のオリゴマーを全重量の０．３％、増
粘剤の熱分解助剤としてアゾビスイソブチルニトリルを
０，０１％加えた。(Example 4) To the solder paste of Example 2, 0.3% of the total weight of methyl methacrylate resin oligomer was added as a thickener, and 0.01% of azobisisobutylnitrile was added as a thermal decomposition aid for the thickener. added.
以上、実施例１〜４のはんだペーストをテスト基板に印
刷して印刷配線板７を得、図のように窒素雰囲気中にて
はんだペーストを２４０℃でリフローし、銅箔に対する
はんだの広がりを調べた。As described above, the solder paste of Examples 1 to 4 was printed on a test board to obtain a printed wiring board 7, and the solder paste was reflowed at 240°C in a nitrogen atmosphere as shown in the figure, and the spread of the solder on the copper foil was examined. Ta.
なお、同図において、ｌは断熱箱、２は電熱ヒータ、３
はチェーンコンベア、４は窒素供給管、５はファン、６
は排気筒である。In addition, in the same figure, l is a heat insulation box, 2 is an electric heater, and 3 is a heat insulating box.
is a chain conveyor, 4 is a nitrogen supply pipe, 5 is a fan, 6
is the exhaust stack.
またフラックスの残渣についても観察した。その結果を
第１表に示す。また、従来のロジン入りはんだペースト
についても比較テストを行った。We also observed flux residue. The results are shown in Table 1. A comparative test was also conducted on conventional rosin-containing solder paste.
第１表
ここで有機酸アミドはペーストにチキソトロビーを与え
る増粘剤として作用し、はんだペーストのだれ防止の効
果がある。またメチルメタアクリレート樹脂のオリゴマ
ーは粘稠性の増粘剤として作用し、はんだペーストのだ
れ防止の効果がある。アゾビスイソブチルニトリルは、
ほんだ溶融時にメチルメタアクリレート樹脂のオリゴマ
ーを分解して低分子化することにより気化しやすくする
作用がある。Table 1 Here, the organic acid amide acts as a thickener that imparts thixotropy to the paste, and has the effect of preventing the solder paste from dripping. Furthermore, the methyl methacrylate resin oligomer acts as a viscous thickener and has the effect of preventing solder paste from dripping. Azobisisobutylnitrile is
When melted, the oligomers of methyl methacrylate resin are decomposed to lower the molecular weight, thereby making it easier to vaporize.
また、蒸発，＃華，分解などにより気化することができ
る活性剤を微量添加したものを（実施例５）〜（実施例
６）に示す。第１表と同様に評価した結果を第２表に示
す。Examples 5 to 6 show examples in which a trace amount of an activator that can be vaporized by evaporation, blooming, decomposition, etc. is added. Table 2 shows the results of the same evaluation as in Table 1.
（実施例５）
実施例２のはんだペーストに活性剤としてマロン酸を全
重量の０．３％加えた。(Example 5) Malonic acid was added as an activator to the solder paste of Example 2 in an amount of 0.3% of the total weight.
（実施例６）
実施例２のはんだペーストに活性剤として、ジメチルア
ミン塩酸塩を全Ｍ量の０．０３％加えた。(Example 6) Dimethylamine hydrochloride was added as an activator to the solder paste of Example 2 in an amount of 0.03% of the total M amount.
（ノ・Ｌ ″Ｆ ５ 一シ ９
第２表
発明の効果
以上説明したように、本発明のはんだペーストは、ロジ
ンを含まないため、ブラックスの残渣がほとんど残るこ
とがな《、洗浄工程を必要としないという特有の効果が
あるものである。(No. L ″F 5 Ishi 9 Table 2 Effects of the Invention As explained above, the solder paste of the present invention does not contain rosin, so almost no black residue remains. It has a unique effect in that it is not necessary.
さらに印刷配線板のはんだ付けを行う際、不活性ガス雰
囲気中ではんだ付けをすることにより、ロジンを含まな
い上記はんだペーストを用いてもよりよいはんだ付けが
できるという優れた効果のあるものである。Furthermore, when soldering printed wiring boards, by soldering in an inert gas atmosphere, even if the above-mentioned solder paste that does not contain rosin is used, it has the excellent effect of allowing better soldering. .
図は本発明の一実施例におけるはんだ付け方法に用いた
装置を示す断面図である。
２・・・・・・電熱ヒーター ４・・・・・・窒素供給
管、７・・・・・・印刷配線板。
代理人の氏名 弁理士 粟野重孝 ほか１名クー−一橘
−真杯と−ダ
７−−一訊盈艷トThe figure is a sectional view showing an apparatus used in a soldering method in an embodiment of the present invention. 2...Electric heater 4...Nitrogen supply pipe, 7...Printed wiring board. Name of agent: Patent attorney Shigetaka Awano and one other person: Kuu-Ittachibana-Shinhaito-Da7--Issun-eishoto
Claims (6)
記アルコール類は、１気圧における沸点がはんだ微粒子
の融点よりも高いものであることを特徴とするはんだペ
ースト。(1) A solder paste mainly consisting of solder particles and alcohol, wherein the alcohol has a boiling point higher than the melting point of the solder particles at 1 atmosphere.
剤を添加したことを特徴とする請求項１記載のはんだペ
ースト。(2) The solder paste according to claim 1, further comprising an activator that is vaporizable at temperatures above the melting point of the solder particles.
たことを特徴とする請求項１記載のはんだペースト。(3) The solder paste according to claim 1, further comprising a methyl methacrylate resin oligomer.
とを特徴とする請求項３記載のはんだペースト。(4) The solder paste according to claim 3, further comprising a substance that generates radicals upon heating.
ースト。(5) The solder paste according to claim 1, further comprising a fatty acid amide.
記アルコール類の１気圧における沸点が前記はんだ微粒
子の融点よりも高いはんだペーストを基板の所定位置に
塗布する工程と、前記はんだペースト上に電子部品を載
置する工程と、不活性ガス雰囲気中で前記基板を予熱す
る工程と、不活性ガス雰囲気中で前記はんだペーストを
溶融する工程とを備えたことを特徴とする印刷配線板の
はんだ付け方法。(6) A step of applying a solder paste mainly consisting of solder particles and alcohol, the boiling point of which is higher than the melting point of the solder particles at 1 atm, to a predetermined position on the board, and applying an electron beam onto the solder paste. Soldering a printed wiring board, comprising the steps of mounting a component, preheating the board in an inert gas atmosphere, and melting the solder paste in an inert gas atmosphere. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10880489A JPH02290693A (en) | 1989-04-27 | 1989-04-27 | Solder paste and soldering method for printed circuit board by using this paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10880489A JPH02290693A (en) | 1989-04-27 | 1989-04-27 | Solder paste and soldering method for printed circuit board by using this paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02290693A true JPH02290693A (en) | 1990-11-30 |
Family
ID=14493905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10880489A Pending JPH02290693A (en) | 1989-04-27 | 1989-04-27 | Solder paste and soldering method for printed circuit board by using this paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02290693A (en) |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997032457A1 (en) * | 1996-02-28 | 1997-09-04 | Hitachi, Ltd. | Method for manufacturing electronic circuit device |
| US5865365A (en) * | 1991-02-19 | 1999-02-02 | Hitachi, Ltd. | Method of fabricating an electronic circuit device |
| US5919317A (en) * | 1994-12-07 | 1999-07-06 | Nippondenso Co., Ltd. | Soldering flux, soldering paste and soldering method using the same |
| US5973406A (en) * | 1996-08-26 | 1999-10-26 | Hitachi, Ltd. | Electronic device bonding method and electronic circuit apparatus |
| JP2000061689A (en) * | 1998-08-27 | 2000-02-29 | Denso Corp | Solder paste, soldering method, and surface-mounting type electronic device |
| US6218030B1 (en) | 1995-03-24 | 2001-04-17 | Nippondenso Co., Ltd. | Soldered product |
| US6227436B1 (en) | 1990-02-19 | 2001-05-08 | Hitachi, Ltd. | Method of fabricating an electronic circuit device and apparatus for performing the method |
| US6471115B1 (en) | 1990-02-19 | 2002-10-29 | Hitachi, Ltd. | Process for manufacturing electronic circuit devices |
| US6605357B1 (en) | 1999-07-28 | 2003-08-12 | Denso Corporation | Bonding method and bonding structure of thermoplastic resin material |
| US6887319B2 (en) | 2002-04-16 | 2005-05-03 | Senju Metal Industry Co., Ltd. | Residue-free solder paste |
| US6935553B2 (en) | 2002-04-16 | 2005-08-30 | Senju Metal Industry Co., Ltd. | Reflow soldering method |
| US7575150B2 (en) | 2001-09-26 | 2009-08-18 | Nof Corporation | Flux composition for solder, solder paste, and method of soldering |
| WO2012118077A1 (en) * | 2011-03-02 | 2012-09-07 | 千住金属工業株式会社 | Flux |
| WO2012118076A1 (en) * | 2011-03-02 | 2012-09-07 | 千住金属工業株式会社 | Flux |
| WO2013099853A1 (en) * | 2011-12-26 | 2013-07-04 | 千住金属工業株式会社 | Solder paste |
| WO2017057651A1 (en) * | 2015-09-30 | 2017-04-06 | オリジン電気株式会社 | Solder paste for reduction gas, and method for producing soldered product |
| JP2017152387A (en) * | 2017-03-16 | 2017-08-31 | エヌイーシー ショット コンポーネンツ株式会社 | Dissipative flux and method of manufacturing protection element using the same |
-
1989
- 1989-04-27 JP JP10880489A patent/JPH02290693A/en active Pending
Cited By (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6227436B1 (en) | 1990-02-19 | 2001-05-08 | Hitachi, Ltd. | Method of fabricating an electronic circuit device and apparatus for performing the method |
| US6471115B1 (en) | 1990-02-19 | 2002-10-29 | Hitachi, Ltd. | Process for manufacturing electronic circuit devices |
| US5865365A (en) * | 1991-02-19 | 1999-02-02 | Hitachi, Ltd. | Method of fabricating an electronic circuit device |
| DE19545783B4 (en) * | 1994-12-07 | 2009-05-07 | Denso Corp., Kariya-shi | A method for specifying the suitability of an organic substance as a soldering flux and soldering method using the same |
| US6142363A (en) * | 1994-12-07 | 2000-11-07 | Nippondenso Co., Ltd. | Soldering method using soldering flux and soldering paste |
| US5919317A (en) * | 1994-12-07 | 1999-07-06 | Nippondenso Co., Ltd. | Soldering flux, soldering paste and soldering method using the same |
| US6562147B2 (en) | 1995-03-24 | 2003-05-13 | Denso Corporation | Soldered product |
| US6218030B1 (en) | 1995-03-24 | 2001-04-17 | Nippondenso Co., Ltd. | Soldered product |
| KR100322823B1 (en) * | 1996-02-28 | 2002-05-09 | 가나이 쓰도무 | Method for manufacturing electronic circuit device |
| JPH09232742A (en) * | 1996-02-28 | 1997-09-05 | Hitachi Ltd | Manufacture of electronic circuit device |
| WO1997032457A1 (en) * | 1996-02-28 | 1997-09-04 | Hitachi, Ltd. | Method for manufacturing electronic circuit device |
| US5973406A (en) * | 1996-08-26 | 1999-10-26 | Hitachi, Ltd. | Electronic device bonding method and electronic circuit apparatus |
| JP2000061689A (en) * | 1998-08-27 | 2000-02-29 | Denso Corp | Solder paste, soldering method, and surface-mounting type electronic device |
| US6488781B1 (en) | 1998-08-27 | 2002-12-03 | Denso Corporation | Soldering paste, soldering method, and surface-mounted type electronic device |
| US6605357B1 (en) | 1999-07-28 | 2003-08-12 | Denso Corporation | Bonding method and bonding structure of thermoplastic resin material |
| US7575150B2 (en) | 2001-09-26 | 2009-08-18 | Nof Corporation | Flux composition for solder, solder paste, and method of soldering |
| US6887319B2 (en) | 2002-04-16 | 2005-05-03 | Senju Metal Industry Co., Ltd. | Residue-free solder paste |
| US6935553B2 (en) | 2002-04-16 | 2005-08-30 | Senju Metal Industry Co., Ltd. | Reflow soldering method |
| EP2682221A1 (en) * | 2011-03-02 | 2014-01-08 | Senju Metal Industry Co., Ltd | Flux |
| EP2682221A4 (en) * | 2011-03-02 | 2014-10-15 | Senju Metal Industry Co | Flux |
| WO2012118076A1 (en) * | 2011-03-02 | 2012-09-07 | 千住金属工業株式会社 | Flux |
| JPWO2012118076A1 (en) * | 2011-03-02 | 2014-07-07 | 千住金属工業株式会社 | No residue flux |
| CN103402698A (en) * | 2011-03-02 | 2013-11-20 | 千住金属工业株式会社 | Flux |
| WO2012118077A1 (en) * | 2011-03-02 | 2012-09-07 | 千住金属工業株式会社 | Flux |
| JP2013132654A (en) * | 2011-12-26 | 2013-07-08 | Senju Metal Ind Co Ltd | Solder paste |
| WO2013099853A1 (en) * | 2011-12-26 | 2013-07-04 | 千住金属工業株式会社 | Solder paste |
| US20150027589A1 (en) * | 2011-12-26 | 2015-01-29 | Senju Metal Industry Co., Ltd. | Solder Paste |
| DE112012005672B4 (en) * | 2011-12-26 | 2019-11-14 | Denso Corporation | solder paste |
| WO2017057651A1 (en) * | 2015-09-30 | 2017-04-06 | オリジン電気株式会社 | Solder paste for reduction gas, and method for producing soldered product |
| JPWO2017057651A1 (en) * | 2015-09-30 | 2017-11-24 | オリジン電気株式会社 | Solder paste for reducing gas, manufacturing method of soldered product |
| TWI666085B (en) * | 2015-09-30 | 2019-07-21 | 日商歐利生股份有限公司 | Solder paste for reducing gas, method of manufacturing soldered products |
| US10610981B2 (en) | 2015-09-30 | 2020-04-07 | Origin Company, Limited | Solder paste for reduction gas, and method for producing soldered product |
| JP2017152387A (en) * | 2017-03-16 | 2017-08-31 | エヌイーシー ショット コンポーネンツ株式会社 | Dissipative flux and method of manufacturing protection element using the same |
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