JPH02290308A - Oscillator - Google Patents

Abstract

PURPOSE:To attain stable oscillation by arranging a bonding pad of a surface acoustic wave element onto one side of a piezoelectric substrate being a component of the surface acoustic wave element so as to oppose to a bonding pad of an integrated circuit. CONSTITUTION:A bonding pad 9 connecting to a surface acoustic wave element 20 with a bonding wire or the like is arranged to one side of an integrated circuit element 8 having an oscillation circuit. A step 13 is part of a package in which the surface acoustic wave element 20 and the integrated circuit element 8 are mounted. An interdigital electrode 4, a grating reflector 6, a wiring pattern 3 and a bonding pad 2 are formed on the piezoelectric substrate 1 of the surface acoustic wave resonator 20 to constitute a 2-port type surface acoustic wave resonator. The bonding pad 2 is arranged side by side onto one side of the piezoelectric substrate 1 opposite to the integrated circuit element 8. Then the bonding pad 9 cf the integrated circuit element 8 and the bonding pad 2 of the surface acoustic wave resonator 20 are connected electrically with a bonding wire 7.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to an oscillator in which an integrated circuit element having an oscillation circuit and a surface acoustic wave element are configured in the same package.

(Prior Art) Conventionally, an oscillator using a surface acoustic wave element has a structure in which the surface acoustic wave element and the oscillation circuit are mounted in separate envelopes, and are electrically connected by an external pattern on a printed circuit board or the like. It was nine days ago.

However, recent advances in semiconductor technology have made it possible to integrate high-frequency oscillation circuits, and even in oscillators using surface acoustic wave elements, integration has become possible, as shown in Japanese Patent Application No. 63-325348. A suitable circuit has been devised.

Using these technologies, we aim to further reduce the size and improve the reliability of oscillators using surface acoustic wave elements.
An oscillator in which a surface acoustic wave device chip and an integrated circuit device chip are mounted in the same package is being considered.
In addition, as shown in Japanese Patent Application No. 1-60162,
Modulators with multiple built-in oscillators are also being considered.

An oscillator in which these surface acoustic wave elements and an integrated circuit element having an oscillation circuit are mounted in the same package is
Studies have only begun in recent years, and sufficient consideration has not been given to the optimal configuration, such as the shape of each chip, the arrangement of the chips, and the wiring method between the chips.

For this reason, for example, for wiring between chips, it is best to connect them with so-called bonder wires. Although this method is considered to be a li-like method, if the bonding butts on each chip are improperly placed, the bonding wires will become long, resulting in a large parasitic inductance or being susceptible to external electromagnetic induction, which may cause problems in the oscillation circuit. In some cases, the operation became unstable, or caused malfunctions.

Furthermore, the longer the bonding wire, the heavier the bonding wire, which may cause the bonding wire to break or come off when it vibrates. These problems are
Not only the placement of bonding pads, but also the shape of the chip,
The same thing happened when the chip was improperly placed.

By the way, when integrating the oscillation circuit, it is suitable to configure it with a differential amplifier circuit. By using a differential amplifier circuit, noise from the power supply line and electromagnetic induction from the outside can be canceled out by differential operation. In this case, the number of wiring lines between the surface acoustic wave element and the surface acoustic wave element is four in total, including two positive and negative input lines and two positive and negative output lines of the differential amplifier circuit. However, if the shape, arrangement, wiring method, etc. of each of the above-mentioned chips is inappropriate, the lengths of the positive and negative wires for the differential inputs will be different, and the lengths of the positive and negative wires for the differential outputs will be different. As a result, the positive and negative input impedances and the positive and negative output impedances differ, resulting in the circuit not operating as an ideal differential amplifier circuit, failing to achieve the designed performance, and reducing noise from the power supply line. The oscillation operation sometimes became unstable due to external electromagnetic induction.

Further, when a plurality of oscillation circuits are configured in the same integrated circuit, it is desirable that the oscillation circuits be placed as close as possible in order to match the electrical characteristics, temperature characteristics, etc. of each oscillation circuit. Therefore, wiring between the surface acoustic wave elements connected to each oscillation circuit, that is, bonding wires, must be placed close to each other. Therefore, mutual interference between oscillators via bonding wires due to electromagnetic induction or electrostatic induction is unavoidable, and especially when the oscillation frequency El of multiple oscillators is different, the external interference phenomenon may cause interference between other oscillators. Problems such as oscillation at the oscillation frequency or generation of spurious in the oscillation spectrum due to cross modulation may occur.

(Problems to be Solved by the Invention) The present invention provides an oscillator in which a surface acoustic wave element chip and an integrated circuit chip are mounted in the same package. Problems with unstable oscillation operation,
In addition, the aim is to solve the problems of cross-modulation caused by mutual interference between multiple oscillators and pull-in oscillation, by optimizing the shape and arrangement of each chip, and the wiring between chips.
[Structure of the invention] (Means for solving the problem) In order to solve the above-mentioned problem, the present invention has the following six basic configurations. .

The first basic configuration is such that the bonding pads of the surface acoustic wave element are arranged on one side facing the integrated circuit on the piezoelectric substrate.

The second basic configuration is characterized in that more than half of the bonding pads of the integrated circuit electrically connected to the surface acoustic wave element are arranged in the surface acoustic wave propagation direction of the surface acoustic wave element.

The third basic configuration is characterized in that the arrangement of bonding wires that electrically connect the differential amplifier and the surface acoustic wave element is line symmetrical.

The fourth basic configuration is to connect a plurality of oscillation circuits configured on the same integrated circuit and a plurality of surface acoustic wave elements corresponding to each of the plurality of oscillation circuits with bonding wires, and to generate one oscillation circuit. This structure is characterized in that the angle between the extension line of the bonding wire of the circuit and the extension line of the bonding wire of another oscillation circuit is 45 degrees or more and 135 degrees or less.

A fifth basic configuration includes an integrated circuit in which a first oscillation circuit and a second oscillation circuit are formed, a first surface acoustic wave element electrically connected to the first oscillation circuit, a second surface acoustic wave element electrically connected to the second oscillation circuit, and a second surface acoustic wave element electrically connected to the second oscillation circuit;
i>ff of the first amplifier at a position sandwiching the output electrode extraction portion of the first amplifier constituting the oscillation circuit and the output electrode extraction portion of the second amplifier forming the second oscillation circuit. This configuration is characterized in that an input electrode extraction section and an input electrode extraction section of the second amplifier are arranged.

In the sixth basic configuration, electrodes for connecting a surface acoustic wave element are formed on an integrated circuit board on which an oscillation circuit is formed, and the oscillation circuit is similarly formed on a piezoelectric substrate on which the surface acoustic wave element is formed. This structure is characterized in that an electrode is formed for connecting the integrated circuit board, and the electrode on the integrated circuit board and the electrode on the piezoelectric board are directly connected. (Function) By adopting the first and second basic configurations described above, the length of the electrical connection between the oscillation circuit and the surface acoustic wave element, such as the bonding wire, can be made sufficiently short. It is possible to suppress the phenomenon in which the oscillation operation becomes unstable due to external noise or parasitic inductance. Furthermore, since the bonding wire is shorter and lighter in weight, the possibility of the bonding wire breaking or coming off when vibrated is extremely reduced.

and. When the oscillation circuit is configured with a differential amplifier, by adopting the third configuration, the positive and negative input impedances of the differential amplifier can be made the same, and the positive and negative output impedances can also be made the same. This allows the circuit to operate as an ideal differential circuit, suppressing the phenomenon in which the oscillation operation becomes unstable due to noise from the power supply line or electromagnetic induction from the outside. Furthermore, if multiple oscillators are built-in, the fourth and fifth oscillators
By adopting the configuration, the bonding wire connecting the first oscillation circuit and the first surface acoustic wave element and the bonding wire connecting the second oscillation circuit and the second surface acoustic wave element are connected. Electromagnetic induction and static induction can be reduced, and mutual interference between oscillation circuits via bonding wires can be extremely reduced.

In addition, by adopting the sixth basic rule, it is possible to eliminate the bonding wire that connects the oscillation circuit and the surface acoustic wave element, which makes the oscillation operation unstable due to external noise and parasitic inductance. phenomena can be suppressed.

(Example) Hereinafter, an example of the first invention will be described in detail with reference to the drawings. In FIG. 1, reference numeral 8 denotes a Tosei circuit element having an oscillation circuit constituted by an amplifier circuit or the like, and bonding pads 9 connected to the surface acoustic wave element 20 by bonding wires or the like are arranged on one side.

Reference numeral 13 denotes a stem that becomes part of the package on which the surface acoustic wave resonator 20 and the integrated circuit element 8 are mounted. 1 is a piezoelectric substrate of a surface acoustic wave resonator 20, and an interdigital electrode 4 and a grating reflector 6 are disposed on this piezoelectric substrate.
, Routing pattern 3. A bonding pad 2 is formed, and a so-called two-port surface acoustic wave resonator is formed into an oval shape. Bonding pads 2 are arranged side by side on one side of piezoelectric substrate 1 facing integrated circuit element 8 . The bonding pad 9 of the integrated circuit element 8 and the bonding pad 2 of the surface acoustic wave resonator 20 are electrically connected by the bonding wire 7.

By arranging the bonding pad 2 of the surface acoustic wave resonator 20 on one side facing the integrated circuit element 8, the distance between the bonding pad 2 and the integrated circuit element 8 can be minimized. This allows the bonding wire 7 that forms the oscillation loop to be extremely short. Therefore, it is possible to reduce the parasitic inductance within the oscillation loop and to minimize the effects of external noise. Furthermore, the possibility that the bonding wire 7 will break or come off due to vibration can be reduced. Furthermore, since the structure is such that the bonding wires do not jump over the interdigital electrode 4 or the grating reflector 6, and the bonding wires do not cross each other, the bonding wires or the bonding wire 7 do not jump over the interdigital electrode 4 or the grating reflector 6. Accidents such as touching the reflector 6 and causing an electrical short circuit can be prevented. Therefore, it has a structure suitable for production.

The first invention is not limited to the embodiment shown in FIG. 1, but can be implemented with various modifications. Other embodiments of the first invention will be described below.

FIG. 2 shows an embodiment in which a one-port surface acoustic wave resonator is used as the surface acoustic wave resonator 20. In FIG. Components that have the same function as in Figure 1 are given the same numbers.

In FIG. 2, the same effect as in FIG. 1 can be obtained.

3 to 8 show examples in which a two-boat type surface acoustic wave resonator is used as the surface acoustic wave resonator 20, and the structure is different from that shown in FIG. 1. Components having the same function as those in FIG. 1 are given the same numbers, and only the two-boat type surface acoustic wave resonator 20 is shown.

The embodiments shown in FIGS. 3 to 8 will be described in detail.

FIG. 3 shows an example in which two bonding pad pairs corresponding to either input or output are arranged inside one bonding pad pair.

FIG. 4 shows an example in which one side on which the bonding pad 2 is arranged is perpendicular to the direction in which surface acoustic waves are excited.

FIG. 5 shows an example in which a wiring line 3 for arranging bonding pads 2 on one side is passed between an interdigital electrode 4 and a grating reflector 6.

FIG. 6 shows an example in which the routing line 3 is constructed using a part of the grating reflector 6.

Figures 7 and 8 are examples in which interdigital electrodes 4 are connected in series using lead wires 3, and Figure 7 is an example in which two adjacent bonding pad pairs each correspond to either input or output. , FIG. 8 shows an example in which the two pairs of bonding pads on both sides and the two pairs of bonding pads on the inside each correspond to either input or output.

As described above, in the embodiments shown in FIGS. 3 to 8, the same effects as in the embodiment shown in FIGS. 1-1 can be obtained.

9 to 11 show embodiments other than the structure shown in FIG. 2, in which a one-boat type surface acoustic wave resonator is used as the surface acoustic wave resonator 20. Components having the same function as those in FIG. 2 are given the same numbers, and only the structure of the surface acoustic wave resonator 20 is shown.

The embodiments shown in FIGS. 9 to 11 will be described below.

FIG. 9 shows an example in which the bonding pads 2 are arranged perpendicular to the direction in which surface acoustic waves are excited.

FIG. 10 shows an example in which the lead-out line 3 is constructed using a part of the grating reflector 6.

FIG. 11 shows an example in which bonding pads 2 are arranged on one side by connecting interdigital electrodes 4 in series using lead lines 3.

As described above, the embodiments shown in FIGS. 9 to 11 have the same effects as the embodiment shown in FIG. 1.

Although the embodiments shown in FIGS. 1 to 11 all use surface acoustic wave resonators, the present invention is not limited to this. For example, surface acoustic wave delay lines, surface acoustic wave filters, etc. , other surface acoustic wave elements may be used.

As explained above, the first invention is characterized in that the bonding pad of the surface acoustic wave element is arranged on one side facing the integrated circuit. According to the first invention, the distance between the bonding pad 2 and the integrated circuit element 8 can be minimized, and the bonding wire 7 forming the oscillation loop can be made extremely short. Therefore, it is possible to reduce the parasitic inductance within the oscillation loop, and to minimize the influence of external noise. Furthermore, the possibility that the bonding wire 7 will break or come off due to vibration can be reduced. Further, it is possible to prevent an accident in which the bonding wires or the bonding wire 7 touch the interdigital electrode 4 or the grating reflector 6 and cause an electrical short circuit, and a structure suitable for mass production can be obtained.

Next, the second invention will be explained in detail with reference to the drawings.

FIG. 12 is a configuration diagram showing an embodiment of the second invention. In the figure, an integrated circuit element 302 and a surface acoustic wave element 303 are mounted on a stem 301 that is part of the package. The integrated circuit element 302 has an oscillation circuit made up of an amplifier circuit or the like. integrated circuit 30
2 and the surface acoustic wave element 303 are bonding wires 3
04, and constitute an oscillator as a whole. Furthermore, a bonding pad 305 on the integrated circuit element 302 side provided for connecting the electrodes of the integrated circuit element 302 and the surface acoustic wave element 303 with the bonding wire 304 is connected to the surface acoustic wave propagation direction of the surface acoustic wave element 303. They are arranged approximately parallel to each other.

In a typical surface acoustic wave device, the size in the surface acoustic wave propagation direction is larger than the size in the vertical direction. In particular, in the case of a surface acoustic wave resonator, a grating reflector is required, which further increases the size in the surface acoustic wave propagation direction.

Therefore, as shown in FIG. 12, the integrated circuit element 30
The bonding pad 305 of No. 2 is connected to the surface acoustic wave element 30.
By placing it parallel to the surface acoustic wave propagation direction of 3,
The distance between the bonding pad 305 and the interdigital electrode of the surface acoustic wave element 303 can be minimized, and the bonding wire 304 forming the oscillation loop can be made extremely short. Therefore, it is possible to reduce the parasitic inductance within the oscillation loop, and to minimize the influence of external noise. Furthermore, the possibility that the bonding wire 304 will break or come off due to vibration can be reduced.

Also, the bonding wire is the interdigital electrode 4.
Since the bonding wires do not jump over the grating reflector 6 and the bonding wires do not cross each other, the bonding wires do not cross each other, and the bonding wires 304
Accidents such as touching the interdigital electrode 4 or the crating reflector 6 and causing an electrical short circuit can be prevented. Therefore, the structure is suitable for mass production.

The second invention is not limited to the embodiment shown in FIG. For example, the bonding pads 305 do not necessarily need to be arranged in parallel, but may be arranged in a concave shape or the like.

As explained above, the second invention is characterized in that the bonding pad connected to the surface acoustic wave element of the integrated circuit element is arranged substantially parallel to the surface acoustic wave propagation direction of the surface acoustic wave element, This has the effects described above.

Next, the third invention will be explained in detail with reference to the drawings. The third invention is an invention that is effective when the oscillation circuit has a differential amplification configuration.

As an example of an oscillation circuit configured with a differential amplifier, a circuit as shown in FIG. 13 has been devised. In the figure, transistors 505 and 506 are a pair of transistors that perform differential amplification, and their respective collectors are connected to one end of a DC power supply 501 via resistors 508 and 509 having the same resistance value, respectively. In addition, each emitter is connected to a common DC current source 5.
07 to the other end of the DC power supply 501, and each base has a resistor 511 and 512 with the same resistance value.
It is connected to the output terminal of the bias circuit 510 via. Note that the bias circuit 510 receives power from the DC power supply 501. The above circuit constitutes a differential amplifier circuit, and one port 503 of the two-port surface acoustic wave resonator 502 is connected between its output, that is, transistors 505 and 506, and each collector, and the input of the differential amplifier circuit, that is, Another port 504 is connected between the bases of transistors 505 and 506. Output terminals 513 and 514 are connected to the collectors of transistors 505 and 506, respectively. With the above configuration, positive feedback is applied from the output of the differential amplifier circuit to the input via the two-port surface acoustic wave resonator 502, and oscillation occurs. Oscillation output is from output terminals 513 and 514. It is taken out as a differential output. If the oscillation circuit is configured with a differential amplifier in this way, patent application No. 63-325348
As explained in the same issue, there are advantages such as no high frequency current flows through the DC power supply 501 and no capacitors are required, making it suitable for integrated circuit implementation. However, high frequency current does not flow through the DC power supply 501 when the circuit operates as an ideal differential circuit. If the output impedances become unbalanced, ideal differential operation will not be achieved and a high frequency current will flow through the DC power supply 501. This current is undesirable because it causes noise to other circuits connected to the DC power supply.

Therefore, when actually arranging the above circuit, the positive and negative circuits should be connected so that the positive and negative input impedances and the positive and negative output impedances of the differential amplifier circuit are the same. It is preferable to arrange the side circuits so that they are symmetrical. The third invention takes this into consideration.

FIG. 14 is a configuration diagram showing an embodiment of the third invention.

In the figure, 109 is a stem that becomes part of the package, and has lead pins 141, 142, 171, 17.
2,181 and 182 are buried. The lead pins 141, 142, 171, 172 are connected to the stem 109.
is electrically isolated from the A surface acoustic wave element 101 and an integrated circuit element 108 are mounted on the stem 109. The surface acoustic wave device lot includes bonding pads 111 connected to input interdigital electrodes,
112 and bonding pads 113 and 114 connected to the output interdigital electrodes. The integrated circuit element 108 has an oscillation circuit constituted by a differential amplifier circuit, and bonding pads +21 . 1.22
and a bonding pad 123 connected to the positive and negative outputs.
, 124 are formed. Other integrated circuit elements include
Bonding pads 125 for positive and negative output terminals of the oscillation circuit
, 126. Power supply terminal bonding pad 127
, a bonding pad 128 for a control terminal, and a bonding pad 129 for a ground terminal are formed. and,
Bonding pads 111 and 121. 112 and 122
, 113 and 123. 114 and 124 are bonding wires 191, 192, 193, 194, respectively.
electrically connected. As a result, the output of the surface acoustic wave element and the manual power of the differential amplifier circuit are connected, and the human power of the surface acoustic wave element and the output of the differential amplifier circuit are respectively connected to form an oscillation loop. In addition, the bonding pad 125 and the lead pin 141, the bonding pad 126 and the lead pin 142, and the bonding pad 12
7 and the lead pin 171, the bonding pad 128 and the lead pin 172, and the bonding pad 129 and the lead pins 1.81 and 182 are electrically connected by bonding wires, respectively.

With the above configuration, the integrated circuit element 10
8 bonding pads 123, 1.21, 122
, 124 are arranged line-symmetrically. That is, the arrangement of the input/output terminals of the differential amplifier circuit constituting the oscillation circuit is line symmetrical, with the order of positive output terminal, positive input terminal P, negative input terminal, and negative output terminal. Furthermore, bonding wire 1.9
The arrangement and lengths of 3, 191, 192, and 194 are also line symmetrical. Therefore, the impedance of the positive and negative input terminals of the differential amplifier circuit can be made the same, and the impedance of the positive and negative output terminals can also be made the same.

As a result, it can be operated as a circuit or an ideal differential amplifier circuit, noise from the power supply line and the influence of external electromagnetic induction can be extremely reduced, and stable oscillation operation can be performed.

The third invention is not limited to the embodiment shown in FIG. 14, but can be implemented with various modifications. For example, the arrangement of the input and output bonding pads of a differential amplifier circuit is as follows: positive output terminal, negative input terminal, positive input terminal, negative output terminal, positive input terminal, positive output terminal, negative output terminal. The order may be an output terminal, a negative input terminal, a positive input terminal, a negative output terminal, a positive output terminal, a negative input terminal, etc. in short,
It is only necessary that the input and output bonding pads of the differential amplifier circuit be arranged line-symmetrically.

Further, the number and arrangement of bonding pads other than the input/output bonding pads of the differential amplifier circuit constituting the oscillation circuit may be changed as necessary. For example, as shown in FIG. 15, an oscillation circuit is configured by connecting a surface acoustic wave element 101 between the input and output of a differential amplifier circuit 102, and the oscillation output is transmitted within the same integrated circuit as the differential amplifier circuit 102. In the case of a circuit configuration in which the unbalanced output amplifying circuit 105 formed in the above circuit amplifies and outputs the amplified signal, the output terminal may be -.
Therefore, compared to the embodiment shown in FIG. 14, the number of bonding pads and lead pins can be reduced, resulting in a configuration as shown in FIG. 16. Even in this case, the human output bonding pads 123, 121, 122, 1 of the differential amplifier circuit
24 arrangement and bonding wires 193, 191
, 192, 194 are line symmetrical with respect to the center line 110 of the surface acoustic wave element.
The same effect as the embodiment shown in FIG. 4 can be obtained.

As explained above, the third invention is characterized in that the bonding pads of the differential amplifier forming the oscillation circuit are arranged line-symmetrically. As a result, six or more first, second, and third aspects of the invention, which provide the above-mentioned effects, have been described. However, the applicant has confirmed that in a device with a plurality of built-in oscillators, mutual interference between the oscillators cannot be ignored. Therefore, I made my fourth invention.

Next, the fourth invention will be explained in detail with reference to the drawings.

Figure 4 is a configuration diagram showing an embodiment of the fourth invention. In the figure, two oscillation circuits formed in an integrated circuit element 201 and two surface acoustic wave resonators formed in a surface acoustic wave element 206 are bonding wires 202 and 202, respectively.
It is electrically connected at 203. Bonding pad 20
2, 203 is. Each corresponds to a connection terminal with a surface acoustic wave resonator of two oscillation circuits included in the integrated circuit element.

Bonding wires 204 corresponding to the two oscillation circuits,
205, high frequency currents of respective oscillation frequencies flow. At this time, an induced magnetic field is generated near the bonding wires 204 and 205. However, according to the embodiment shown in FIG. 17, the bonding wires 204 and 205 are arranged at right angles to each other, and the induced magnetic fields of each are orthogonal, so that no induced electromotive force is generated in the bonding wire of the other side. Therefore, the bonding wires 204, 20
Mutual interference between oscillation circuits via 5 can be extremely reduced. Therefore, even if the oscillation frequencies of the two oscillation circuits are different, it is possible to prevent pull-in oscillation and reduce the occurrence of spurious in the oscillation spectrum due to cross modulation.

According to the inventors' experiments, bonding pad 2
10 and the center point of the bonding pad 202 (an extension of the bonding wire 204), the center point of the bonding pad 220, and the bonding pad 203.
The bonding wire 205 is a straight line connecting the center point of
The angle made with (an extension of) does not have to be a perfect right angle,
When the angle is between approximately 45 degrees and 135 degrees, the mutual interference between the oscillators can be sufficiently reduced compared to when the angles are 0 degrees, that is, parallel.

The fourth invention is not limited to the embodiment shown in FIG. 17, but can be implemented with various modifications.

In the embodiment shown in FIG. 17, the bonding pads 202 and 203 for connecting the surface acoustic wave elements of the integrated circuit element are arranged in a straight line, but they do not necessarily have to be in a straight line.
For example, as shown in FIG.
Even if bonding wires 2 and 213 are arranged in a concave shape, the object of the fourth invention is achieved as long as (extensions of) bonding wires 214 and 215 are arranged at right angles to each other.

Further, in the embodiment shown in FIG. 17, the bonding pad 20
2, 203 and the bonding pads of the surface acoustic wave resonator 206 are arranged in parallel and at the same pitch to improve bonding productivity, but this does not necessarily have to be the case. , if the bonding wires 204 and 205 are nearly orthogonal,
It is clear that the effect of the fourth invention is produced.

Furthermore, although two two-port surface acoustic wave resonators, that is, two interdigital electrodes are used in FIG. You may use children.

Moreover, as shown in FIG. 19, even if a surface acoustic wave delay line is used, there is no change in the gist of the fourth invention.

In this case, it is desirable to provide each surface acoustic wave delay line with a sound absorbing material 209 that acts as a surface acoustic wave attenuator in order to avoid reflection from the end face of the substrate and surface acoustic wave interference between both delay lines. .

In each of the embodiments of the fourth invention described above, a plurality of surface acoustic wave resonators are formed on the same substrate, but even if each is formed on an independent substrate, the fourth invention still applies. It is clear that this does not deviate from the main idea.

As explained above, the fourth invention makes each bonding wire that electrically connects a plurality of oscillation circuits configured in the same integrated circuit and a plurality of surface acoustic wave elements nearly orthogonal. It is characterized by Thereby, mutual interference between the plurality of oscillation circuits can be extremely reduced. Pull-in oscillation can be prevented, and generation of spurious in the oscillation spectrum due to cross modulation can be reduced.

However, when there are multiple oscillators, there is a great risk that electrostatic induction will occur even between bonding wires. At this time, noise, cross modulation, etc. occur.

To prevent this, it is necessary to increase the distance between bonding wires. However, if the distance between the bonding wires is increased, the device becomes larger, and the purpose of miniaturization by mounting an integrated circuit and a surface acoustic wave element in the same package cannot be achieved. Therefore, the present applicant has made the fifth invention in view of this point.

Next, the fifth invention will be explained in detail with reference to the drawings.

20 and 21 show an embodiment of the fifth invention, in which FSK (frequency shift keying) modulation is performed by switching the output signals of two oscillators with different oscillation frequencies according to the digital modulation signal. 3 shows an FSX modulator. FIG. 20 shows the circuit configuration, and FIG. 21 shows a schematic structural diagram. Integrated circuit element 401
A first oscillation circuit 402 having an oscillation frequency f2 and a second oscillation circuit 403 having an oscillation frequency f2 are formed above. Each oscillation circuit has an elliptical configuration of amplifiers 404 and 405, and output electrodes of the amplifiers 404 and 405 are electrically connected to surface acoustic wave elements 410 and 411 having different resonance frequencies formed on a piezoelectric substrate 409. It is connected. The two surface acoustic wave elements may be made on the same piezoelectric substrate, or may be made separately on two piezoelectric substrates. In this embodiment, an l port type resonator is used as the surface acoustic wave element. These two surface acoustic wave resonators 410 and 411 serve as oscillation sources for oscillation circuits 402 and 403, respectively, so they have different oscillation frequencies f.
, , f2 can be set. The output signals of the two oscillation circuits are input to a switching circuit 406 formed on the same IC board 401. Further, the modulated input signal of the switching circuit 406 is inputted manually from the input terminal 408, and the output signal of the switching circuit 406 is outputted from the input terminal 407. Power is supplied to each of the circuits 402, 403, and 406 from a power terminal (not shown). By adopting the configuration as described above, the oscillation circuits 402 and 403 are activated in response to the digital modulation signal input from the modulation input terminal 408.
output signal or frequency f. Either of the l fl signals is selected by the switching circuit 406 and sent to the output terminal 407.
is output from. That is, FSX modulation is performed.

By the way, the amplifiers 404 and 405 that constitute the oscillation circuit
When electrically connecting surface acoustic wave elements 410 and 411, bonding pads 404-1, 404-2, 405- are placed around the outer periphery of integrated circuit 401, as shown in FIG.
1, 405-2 is formed, and the bonding wire 42
0,421 is normally used for connection.

In this embodiment, the output electrode extraction portion of the first amplifier 404, that is, the bonding pad 404-2, and the output electrode extraction portion of the second amplifier 5, that is, the bonding pad 405-2, are arranged at positions adjacent to each other, and An input electrode extraction portion of the first amplifier, that is, a bonding pad 404-1, and an input electrode extraction portion of the second amplifier, that is, a bonding pad 405-, are sandwiched between them.
Place 1.

According to this configuration, bonding pads 404-2 and 404-2
5-2 becomes the output electrode of the amplifier. Since the impedance is low and the signal level is also about the same, mutual interference via the bonding pad and the bonding wire connected thereto can be reduced. Furthermore, the input electrodes with high impedance and low signal level, that is, the bonding pads 404-1 and 405-1, are placed further away from the adjacent oscillation circuits, respectively. Fluctuations in signal level due to electromagnetic induction or electrostatic induction from an adjacent oscillation circuit via the bonding pad and the bonding wire connected thereto can be suppressed as much as possible.

Due to these effects, it is possible to perform good operation as an FSX modulator. That is, since the mutual interference between the oscillator widths can be sufficiently reduced, the output terminal 407 can be connected to f. When the signal f is being output, f is the signal being output. It is possible to sufficiently suppress the mixing of undesirable signals such as the mixing of signals.

In the embodiments shown in FIGS. 20 and 21, a 1-port type surface acoustic wave resonator is used as the surface acoustic wave element, but the same effect can be obtained by using a 2-port type surface acoustic wave resonator. , or in an oscillation circuit configuration using a surface acoustic wave delay line. Figures 22 and 23 use a surface acoustic wave delay line as the surface acoustic wave element, and similarly to Figures 20 and 21, the FS
An X modulator is shown.

FIG. 22 shows the circuit configuration, and FIG. 23 shows a schematic structural diagram. Two different oscillation frequencies f1
, f2, the first oscillation circuit 402 and the second oscillation circuit 403, and the output electrode extraction portions 404-2-A, 404-2-8, 4 of the respective amplifiers 404, 405.
05-2-A and 405-2-8 are located adjacent to each other,
An amplifier 4 is placed between these four output electrode extraction parts.
Input electrode extraction portion, that is, bonding pad 40
4-1-A, 404-1-B, and the input electrode extraction portion of the amplifier 405, that is, the bonding pad 405-1-
8 are arranged. The amplifier 404 is electrically connected to the delay line 430, and the amplifier 405 is electrically connected to the delay line 440 by bonding wires 420, 421, etc. In this case, the input electrode of each amplifier is connected to either the input interdigital electrode or the output interdigital electrode of the delay line, and the output electrode of the amplifier is connected to the other interdigital electrode of the delay line. . Note that 401 is an integrated circuit, 406 is a switching circuit, 408 is a modulation input terminal, and 407 is an output terminal. F
The operation as an SX modulator is similar to the embodiments shown in FIGS. 20 and 21. According to this configuration, the same effects as explained in the embodiments of FIGS. It becomes possible to reduce the influence of signal level fluctuations exerted on the amplifier input electrodes from the circuit.

As explained above, according to the fifth invention, in an oscillation circuit that simultaneously oscillates two different oscillation frequencies, the output electrode extraction portions of the amplifiers forming an ellipse of each oscillator are placed adjacent to each other, and the output By arranging the input electrode extraction part of the amplifier at a position sandwiching the electrode extraction part, mutual interference that occurs between the two oscillation circuits via the bonding wire can be suppressed, and the amplifier input side with a low signal level can be connected to the adjacent oscillation circuit. This can reduce fluctuations in the signal level. As a result, SK modulation and the like can be performed efficiently.

Next, the sixth invention will be explained in detail with reference to the drawings.

FIG. 24 is a configuration diagram showing an embodiment of the sixth invention.

In the figure, a piezoelectric base 602 is mounted on a stem 601 that is part of the package. Piezoelectric substrate 602
Above is a surface acoustic wave resonator 603 and its connection terminal 604.
and a wiring pattern 6 that becomes the output electrode of the integrated circuit 605.
06 is formed. An integrated circuit 605 including an oscillation circuit and its connection terminals 607 is mounted on the piezoelectric base 602. Note that the piezoelectric substrate 602
The surface on which the connection terminal 604 and the wiring pattern 606 are formed faces the surface on which the connection terminal 607 of the integrated circuit 605 is formed, and the connection terminal 604 and the wiring pattern 606 and the connection terminal 607 are Connected voltage-wise. Furthermore, the wiring pattern 606 and the stem 601
The external connection pin 608 embedded in the wafer is electrically connected to the external connection pin 608 by a bonding wire 609. The external connection pin 608 serves as a power supply terminal or output terminal of the oscillation circuit.

With the above configuration, the surface acoustic wave resonator 603 and
Since it is directly connected to the integrated circuit 605, no bonding wire is required. Therefore, the parasitic inductance within the oscillation loop can be made extremely small, and the influence of external noise can also be made very small. Furthermore, the possibility that the wiring between the surface acoustic wave resonator 603 and the integrated circuit 605 is broken due to vibration can be extremely reduced.

The sixth invention is not limited to the embodiment shown in FIG. 24, but can be implemented with various modifications. For example, the connection terminal 604, the wiring pattern 606, and the connection terminal 607 can be arranged arbitrarily. Further, the number of connection terminals 604, wiring patterns 606, and connection terminals 607 can be increased or decreased as necessary. Similarly, its shape can also be modified as required. The surface acoustic wave element serving as the oscillation source is not limited to the surface acoustic wave resonator 603, and may of course be a surface acoustic wave delay line or the like.

As explained above, the sixth invention is characterized in that an integrated circuit is mounted on a piezoelectric substrate on which a surface acoustic wave element is formed, and has the above-mentioned effects.

The six basic configurations of the present invention have been described above, but these basic configurations are not independent of each other and can be implemented in various combinations.

For example, in the embodiments shown in FIGS. 1 and 2 that describe the first invention, the second invention has already been implemented. Also, the third
In the embodiments shown in FIGS. 14 and 16, which illustrate the invention of
The first invention and the second invention have already been implemented. Similarly, in the embodiments shown in FIGS. 17 to 19 explaining the fourth invention, the first invention and the second invention have already been implemented. In addition, in the embodiments shown in FIGS. 17 to 19 explaining the fourth invention, if the amplifier circuits constituting each oscillation circuit in the integrated circuit elements 201 and 211 are differential amplifier circuits, each oscillator The third invention can be implemented for. Furthermore, FIGS. 21 and 2 explain the fifth invention.
The fourth invention can also be implemented with respect to the embodiment shown in FIG.

For example, FIG. 25 shows a configuration diagram when the fourth invention and the fifth invention are combined. In FIG. 25, integrated circuit 4
01 has the same configuration as the embodiment shown in FIG.
Output electrodes of the amplifier 404 constituting the first oscillation circuit 402, that is, bonding pads 4042 to A, 404
-2-8 and the amplifier 4 constituting the second oscillation circuit 403
05 output electrode or bonding pad 405-2
-A. 405-2-8 are located adjacent to each other, and the amplifier 404 is located at a position sandwiching these four bonding pads.
Manual electrode or bonding pad 404-l-A
, 405-1-8, and input electrodes or bonding pads 405-1-A and 405-1-B of the amplifier 405.
and are arranged. In addition, the surface acoustic wave resonator 216
As in the embodiments shown in FIGS. 17 and 18, two surface acoustic wave resonators are formed. The two oscillation circuits in the integrated circuit 401 constituted by the amplifier circuit and the two surface acoustic wave resonators are connected by two sets of bonding wires 214 and 215 arranged orthogonally to each other. There is.

By adopting such a configuration, the effects of both the fourth invention and the fifth invention can be obtained, and compared to the case where the fourth invention or the fifth invention is implemented alone, the effect between the two oscillation circuits is improved. Mutual interference can be reduced.

In addition to the above, the sixth invention can also be combined with other inventions. Although the first invention and the second invention are already used in FIG. 29 explaining the sixth invention, the sixth invention may also include combining the third and fifth inventions. I can do it.

Several combinations other than those described above are possible.

By combining some of the six basic configurations of the present invention in this way, the effects of each of the basic configurations are added, so that higher effects can be obtained.

The present invention is not limited to the embodiments and modifications described above, and can be modified and implemented without departing from the gist thereof.

〔Effect of the invention〕

By employing the first and second basic configurations described above, the length of the bonding wire that electrically connects the integrated circuit element and the surface acoustic wave element can be made sufficiently short. Therefore, it is possible to reduce the parasitic inductance, reduce the influence of electromagnetic induction, and stabilize the oscillation operation. In addition, the possibility of the bonding wire breaking or coming off can be extremely reduced. Similarly, by adopting the sixth basic configuration, the above-mentioned effects that are even higher than those of the first and second basic configurations can be obtained.

Further, when the oscillation circuit is configured with a differential amplifier circuit, it can be operated as an ideal differential circuit.

Therefore, the noise from the power line and the influence of electromagnetic induction can be reduced, and the oscillation operation can be stabilized.

Furthermore, when a plurality of oscillators are built-in, mutual interference between the oscillators via bonding wires can be extremely reduced by adopting the basic configuration shown in FIGS. 4 and 5.

Therefore, cross-modulation can be reduced and pull-in oscillation can be prevented.

[Brief explanation of drawings]

FIG. 1 is a schematic plan view showing one embodiment of the first invention;
11 are schematic plan views showing other embodiments of the first invention, FIG. 12 is a schematic plan view showing an embodiment of the second invention, and FIG. 13 is for explaining the third invention. Circuit diagram, 1st
Figure 4 is a schematic perspective view showing an embodiment of the third invention;
The figure is a circuit diagram showing another embodiment of the third invention, FIG. 16 is a schematic perspective view showing another embodiment of the third invention, and FIG. 17 is a schematic diagram showing an embodiment of the fourth invention. The plan view, FIGS. 18 and 19 are schematic plan views showing other embodiments of the fourth invention,
FIG. 20 is a circuit configuration diagram showing an embodiment of the fifth invention, FIG. 21 is a schematic structural diagram showing an embodiment of the fifth invention, and FIG.
Figure 2 is a circuit configuration diagram showing another embodiment of the fifth invention.
Figure 3 is a schematic structural diagram showing another embodiment of the fifth invention;
Figure 4 is a schematic structural diagram showing an embodiment of the sixth invention;
The figure is a schematic configuration diagram when the fourth invention and the fifth invention are combined. (1), (303, (20). (40), (101),
(206), (216), (409), (4 10)
, (4 It), (430) , (440) ,
(602)・Surface acoustic wave element (8), (108). (201), (211
), (302), (4 10), (605)
...Integrated circuit (2), (305), (121), (122)
．． (123). (124) , (125) ,
(1.26) , (127) , (128)
, (19].) , (192) , (193),
(194), (202), (203), (21
0) , (212) , (213) , (220
)...Bonding pad ■, (10) . (204) , (205) ,
(214) , (215) . (304) ,(
420), (421)...Bonding wire 301 Stem/Figure l Figure Figure Issue Figure Figure Cause Figure Figure

Claims (7)

[Claims] (1) An integrated circuit disposed within an envelope and having at least an amplifying effect; and a surface acoustic wave element disposed within the same envelope as this integrated circuit and electrically connected to the integrated circuit. In the oscillator, the bonding pads of the surface acoustic wave element are arranged on one side of the piezoelectric substrate forming the surface acoustic wave element so as to face the bonding pads of the integrated circuit. oscillator. (2) In an oscillator comprising an integrated circuit placed in an envelope, and a surface acoustic wave element placed in the same envelope as the integrated circuit and electrically connected to the integrated circuit. . An oscillator, wherein more than half of the bonding pads of the integrated circuit electrically connected to the surface acoustic wave element are arranged in the surface acoustic wave propagation direction of the surface acoustic wave element. (3) an integrated circuit disposed within an envelope and comprising at least a differential amplifier; and an elastic surface disposed within the same envelope as the integrated circuit and electrically connected to the integrated circuit. An oscillator comprising a wave element, wherein bonding wires that electrically connect the differential amplifier and the surface acoustic wave element are arranged in line symmetry. (4) A plurality of oscillators each composed of an integrated circuit composed of at least a plurality of oscillation circuits and a plurality of surface acoustic wave elements electrically connected to the oscillation circuit are arranged in the same envelope. In the oscillator, a bonding pad of the oscillation circuit and a bonding pad of the surface acoustic wave element are electrically connected, and the mutual angle of the bonding wires corresponding to each oscillator of each bonding wire constituting the oscillator is An oscillator characterized in that the angle is 45 degrees or more and 135 degrees or less. (5) A semiconductor integrated circuit including a first oscillation circuit and a second oscillation circuit on the same semiconductor substrate; a first amplifier comprising at least a first surface acoustic wave element electrically connected to the second oscillation circuit, and a second surface acoustic wave element electrically connected to the second oscillation circuit; The input electrode extraction portion of the first amplifier and the input electrode of the second amplifier are located at positions sandwiching the output electrode extraction portion of the first amplifier and the output electrode extraction portion of the second amplifier constituting the second oscillation circuit. An oscillator characterized in that a take-out section is arranged. (6) Comprising an integrated circuit board on which an oscillation circuit is configured, an electrode placed on this integrated circuit board, a piezoelectric substrate on which a surface acoustic wave element is formed, and an electrode placed on this piezoelectric substrate. . An oscillator, wherein an electrode of the integrated circuit board and an electrode of the piezoelectric substrate are directly connected. (7) A semiconductor integrated circuit including a first oscillation circuit and a second oscillation circuit on the same semiconductor substrate; a first amplifier comprising at least a first surface acoustic wave element electrically connected to the second oscillation circuit, and a second surface acoustic wave element electrically connected to the second oscillation circuit; The input electrode extraction portion of the first amplifier and the input electrode of the second amplifier are located at positions sandwiching the output electrode extraction portion of the first amplifier and the output electrode extraction portion of the second amplifier constituting the second oscillation circuit. and a bonding wire that electrically connects the bonding pad of the first surface acoustic wave element and the output electrode extraction part of the first amplifier, An oscillator forming an angle of 45 degrees or more and 135 degrees or less with a bonding wire that electrically connects a bonding pad and an output electrode extraction portion of the second amplifier.