JPH0228887B2 - - Google Patents
Info
- Publication number
- JPH0228887B2 JPH0228887B2 JP57163036A JP16303682A JPH0228887B2 JP H0228887 B2 JPH0228887 B2 JP H0228887B2 JP 57163036 A JP57163036 A JP 57163036A JP 16303682 A JP16303682 A JP 16303682A JP H0228887 B2 JPH0228887 B2 JP H0228887B2
- Authority
- JP
- Japan
- Prior art keywords
- shaped
- metal terminal
- lid
- chip
- electrolytic capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 239000002184 metal Substances 0.000 claims description 25
- 239000003990 capacitor Substances 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000011888 foil Substances 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 4
- 239000008151 electrolyte solution Substances 0.000 claims description 2
- 229920005992 thermoplastic resin Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000007772 electroless plating Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000002648 laminated material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009503 electrostatic coating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
Description
【発明の詳細な説明】
本発明はチツプ状電解コンデンサの製造方法に
関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a chip-shaped electrolytic capacitor.
近年リード線をもたない小型電子部品が民生機
器の実装概念を大きく変え始め、その結果単に機
器を小型、薄型にするためだけでなく、組み立て
工程を自動化する目的で、抵抗やコンデンサのほ
かにトランジスタ、ダイオードなど各種のチツプ
部品が大量に使われ始めている。 In recent years, small electronic components without lead wires have begun to significantly change the packaging concept of consumer devices.As a result, they are being used not only to make devices smaller and thinner, but also to automate the assembly process, in addition to resistors and capacitors. Various chip components such as transistors and diodes are beginning to be used in large quantities.
電解コンデンサの分野においても従来のリード
線タイプの小型化要求とともに、チツプ化の要望
に応じて、いくつかのチツプ状電解コンデンサが
提供されているが、電解コンデンサはその素子内
部に電解液を有しているため、その気密性保持が
困難なこととコスト高な点から未だ充分なもので
はない。 In the field of electrolytic capacitors, several chip-shaped electrolytic capacitors have been provided in response to the demand for miniaturization of conventional lead wire types as well as the demand for chipping. However, it is still not sufficient because it is difficult to maintain airtightness and the cost is high.
従来、チツプ状電解コンデンサは第１図に示す
ようにコンデンサ素子１より導出した陽極引出リ
ード２ａを弾性封口体３に挿通し、コンデンサ素
子１より導出した陰極用引出リード２ｂを金属ケ
ース４の底部に溶接して上記素子１を金属ケース
４に収納したのち、上記引出リード２ａを金属端
子板５に、また金属ケース４の底部に金属端子板
６を溶接し、封口部に樹脂７を充填したものが考
案されているが、溶融半田中に浸漬した場合は封
口部が膨張するなどの欠点があり、これを改良す
るために特開昭57−20425号公報に示されている
ように、金属ケースに直接または第１のリード線
を介して第１の金属端子板を固着し、弾性封口体
を介した第１のリード線に第２の金属端子板を固
着してなる電解コンデンサにおいて、金属ケース
全体に絶縁性の樹脂を被覆したものが提供されて
いるが、製造工程が複雑になるためそのコストも
上昇し、実用にたえうるまでには到つていない。 Conventionally, in a chip-shaped electrolytic capacitor, as shown in FIG. After welding the element 1 to the metal case 4, welded the lead 2a to the metal terminal plate 5, welded the metal terminal plate 6 to the bottom of the metal case 4, and filled the sealing part with resin 7. However, there are drawbacks such as the sealing part expanding when immersed in molten solder.To improve this, a metal In an electrolytic capacitor, a first metal terminal plate is fixed to the case directly or via a first lead wire, and a second metal terminal plate is fixed to the first lead wire via an elastic sealing member. Cases in which the entire case is coated with an insulating resin have been provided, but the manufacturing process becomes complicated and the cost increases, and it has not yet reached the point where it can be put to practical use.
更に弾性封口体３によつて気密性を保持させる
ため、その厚さを薄くするには限界があり、この
結果内部素子１に比較して製品寸法が長くなると
いうチツプ部品として大きな欠点を有していた。 Furthermore, since airtightness is maintained by the elastic sealing member 3, there is a limit to how thin it can be made, and as a result, the product has a longer dimension than the internal element 1, which is a major drawback as a chip component. was.
本発明は上述の欠点を解消し、小型で耐熱性の
優れたチツプ状電解コンデンサの製造方法を提供
するものである。 The present invention eliminates the above-mentioned drawbacks and provides a method for manufacturing a chip-shaped electrolytic capacitor that is small in size and has excellent heat resistance.
以下本発明を第２図〜第６図に示す実施例によ
り説明する。 The present invention will be explained below with reference to embodiments shown in FIGS. 2 to 6.
第２図イは蓋状金属端子８で外部封口用端子板
部８ａと筒状のインサート部８ｂとを一体にして
構成されており、ロはコンデンサ素子１０を挿通
する中空筒状ケース９で熱可塑性樹脂を成形した
ものである。 Figure 2A shows a lid-shaped metal terminal 8 that is constructed by integrating an external sealing terminal plate part 8a and a cylindrical insert part 8b, and B shows a hollow cylindrical case 9 through which a capacitor element 10 is inserted. It is molded from plastic resin.
第３図は組立工程における説明図で電極箔とセ
パレータを巻き回してなるコンデンサ素子１０を
中空筒状ケース９に収納し、該素子１０より引出
されたリード１１を蓋状金属端子８に溶接などに
よりあらかじめ接続する。 FIG. 3 is an explanatory diagram of the assembly process, in which a capacitor element 10 formed by winding electrode foil and a separator is housed in a hollow cylindrical case 9, and a lead 11 drawn out from the element 10 is welded to a lid-shaped metal terminal 8. Connect in advance.
第４図はチツプ状電解コンデンサの完成品の断
面図で上述の中空筒状ケース９に蓋状金属端子８
を接触させ超音波を加えながらインサートして封
口した後、両端の端子板部８ａの外面を除いた周
囲を包囲するように樹脂層１２を形成する。樹脂
層１２は粉体、液状などの樹脂を用いて形成でき
るが、粉末エポキシ系樹脂を用い、静電塗装法や
流動浸漬法などによつて付着させ両端部に付着し
た樹脂をエアーブラスト処理によつて除去したの
ち加熱硬化すれば形状寸法の均一化が可能とな
る。 Figure 4 is a cross-sectional view of a completed chip-shaped electrolytic capacitor, with a lid-shaped metal terminal 8 in the hollow cylindrical case 9 described above.
The resin layer 12 is formed so as to surround the terminal plate portions 8a at both ends except for the outer surface thereof. The resin layer 12 can be formed using powdered or liquid resin, but powdered epoxy resin is used, and the resin layer 12 is attached by electrostatic coating or fluidized dipping, and the resin attached to both ends is subjected to air blasting. If it is heated and cured after being twisted and removed, the shape and dimensions can be made uniform.
次に樹脂層１２の両端部および蓋状金属端子８
の外表面の所要部に銀ペーストなどを塗布、硬化
し導電層１３を形成する。そしてニツケル、銅な
どの半田付け可能な金属からなる無電解メツキ処
理を施して上記導電層１３上に無電解メツキ層１
４を形成したのちはんだメツキ層１５を形成して
完成したものである。 Next, both ends of the resin layer 12 and the lid-shaped metal terminal 8
A conductive layer 13 is formed by applying silver paste or the like to a desired portion of the outer surface of the conductive layer 13 and hardening the conductive layer 13 . Then, an electroless plating process made of a solderable metal such as nickel or copper is applied to the electroless plating layer 1 on the conductive layer 13.
4 and then a solder plating layer 15 was formed to complete the process.
第５図は蓋状金属端子８のインサート部分にあ
やめ（七子目）ローレツト加工を旋したもので接
合強度が向上し、内圧上昇に伴う引抜き強度が向
上し完成品の信頼性をより高めることになる。８
ｃはあやめローレツト加工部を示し、ローレツト
は凹部または凹部いずれに形成してもよい。 Figure 5 shows an insert part of the lid-shaped metal terminal 8 with iris knurling, which improves the joint strength and the pull-out strength as the internal pressure increases, further increasing the reliability of the finished product. Become. 8
c indicates an iris knurling part, and the knurling may be formed in either a recessed part or a recessed part.
あやめローレツト加工は、ピツチが1.2〜1.5mm
程度が望ましく、ピツチ１mm以下になると引抜き
強度は低下する。 The pitch of iris knurling is 1.2 to 1.5 mm.
The desired pitch is 1 mm or less, and the pull-out strength decreases.
第６図は蓋状端子金属８の材質として積層材料
を用いた場合である。コンデンサ素子１０から導
出した引出リード１１を接続する蓋状端子金属８
の内部底面は素子に含浸された電解液が付着する
ため、電極箔や引出リード１１と同一材質、すな
わちアルミニウムでなければならない。しかるに
外部表面はアルミニウムでは半田付け性を有せ
ず、このため上述のように導電層１３、無電解メ
ツキ層１４、半田メツキ層１５などを形成する必
要性を生ずる。従つて第６図のようにアルミニウ
ムからなる端子板部８ａと銅、ニツケルなどはん
だ付け可能な金属部１６との積層材料を用いれば
更にその製造工程は簡略化され、より安価な製品
を得ることができる。 FIG. 6 shows a case where a laminated material is used as the material of the lid-shaped terminal metal 8. Lid-shaped terminal metal 8 to which the lead-out lead 11 led out from the capacitor element 10 is connected.
Since the electrolytic solution impregnated into the element adheres to the inner bottom surface of the electrode foil, it must be made of the same material as the electrode foil and the lead-out lead 11, that is, aluminum. However, aluminum does not have solderability on the external surface, and therefore it becomes necessary to form the conductive layer 13, electroless plating layer 14, solder plating layer 15, etc. as described above. Therefore, if a laminated material is used as shown in FIG. 6, which includes a terminal plate part 8a made of aluminum and a solderable metal part 16 such as copper or nickel, the manufacturing process can be further simplified and a cheaper product can be obtained. Can be done.
次に上述の実施例にもとずいて50V、1μFのチ
ツプ状電解コンデンサを製作し、温度260℃の溶
融はんだ中に10秒間浸漬したのち、85℃雰囲気中
で50VDCを印加して静電容量と損失角の正接
（tanδ）の変化を測定した結果を第７図に示す。 Next, a 50V, 1μF chip-shaped electrolytic capacitor was manufactured based on the above example, and after immersed in molten solder at a temperature of 260℃ for 10 seconds, 50VDC was applied in an atmosphere of 85℃ to increase the capacitance. Figure 7 shows the results of measuring changes in the tangent (tan δ) of the loss angle.
図中曲線Ａは上述の実施例に基いて製作された
本発明品、曲線Ｂは従来品によるものである。図
から明らかなように本発明品Ａは従来品Ｂに比較
し1000時間後の静電容量減少も少くtanδの増加率
も小さいばかりか更にコンデンサ素子から外部端
子電極までの構造が単純化されるため初期のtanδ
値も低くなるという付帯効果を生じた。上述の実
施例では角型形状のみを示したが本発明は円筒状
の場合にも応用可能なことはいうまでもない。 In the figure, curve A is a product of the present invention manufactured based on the above-mentioned embodiment, and curve B is a product of the prior art. As is clear from the figure, compared to conventional product B, product A of the present invention not only has a smaller capacitance decrease after 1000 hours and a smaller increase rate of tanδ, but also has a simpler structure from the capacitor element to the external terminal electrode. For the initial tanδ
This had the side effect of lowering the value. Although only a square shape was shown in the above embodiment, it goes without saying that the present invention is also applicable to a cylindrical shape.
叙上上述のように本発明によるチツプ状電解コ
ンデンサは特性面とは信頼性正の両面の向上が可
能となり、工業的ならびに実用価値の大なるもの
である。 As described above, the chip-shaped electrolytic capacitor according to the present invention can improve both characteristics and reliability, and has great industrial and practical value.
第１図は従来のチツプ状電解コンデンサの断面
図、第２図〜第４図は本発明の一実施例で、第２
図イは蓋状金属端子の斜視図、ロは中空筒状ケー
スの斜視図、第３図はチツプ状電解コンデンサの
組立説明図、第４図は同チツプ状電解コンデンサ
の断面図、第５図および第６図は本発明に係る蓋
状金属端子のそれぞれ異る他の実施例の斜視図、
第７図は本発明品と従来品とを比較した高温負荷
試験特性例で、イは容量−時間特性図、ロはtanδ
−時間特性図である。
８：蓋状金属端子、８ｃ：あやめローレツト
部、９：中空筒状ケース、１０：コンデンサ素
子、１１：リード、１２：樹脂層、１３：導電
層、１４：無電解メツキ層、１５：はんだメツキ
層、１６：はんだ付け可能な金属。
FIG. 1 is a sectional view of a conventional chip electrolytic capacitor, and FIGS. 2 to 4 are examples of the present invention.
Figure A is a perspective view of a lid-shaped metal terminal, B is a perspective view of a hollow cylindrical case, Figure 3 is an explanatory diagram of assembly of a chip-shaped electrolytic capacitor, Figure 4 is a cross-sectional view of the same chip-shaped electrolytic capacitor, and Figure 5 and FIG. 6 are perspective views of other different embodiments of the lid-shaped metal terminal according to the present invention,
Figure 7 shows an example of high temperature load test characteristics comparing the product of the present invention and the conventional product, where A is the capacity-time characteristic diagram and B is the tanδ
- It is a time characteristic diagram. 8: Lid-shaped metal terminal, 8c: Iris knurling part, 9: Hollow cylindrical case, 10: Capacitor element, 11: Lead, 12: Resin layer, 13: Conductive layer, 14: Electroless plating layer, 15: Solder plating Layer 16: Solderable metal.
Claims (1)
向させてコンデンサ素子を形成し、該素子に電解
液を含浸したのち、両端の開口した熱可塑性樹脂
からなる中空筒状ケースに挿通し、上記素子より
引出されたリードを蓋状金属端子に接続し、該蓋
状金属端子を超音波を加えながら上記中空筒状ケ
ースへインサートして封口し、上記金属端子の外
表面の所要部を残して全体を包囲するよう樹脂層
を形成し、両端部の外面にはんだメツキ層または
はんだ付け可能な金属部を形成して電極を構成し
たことを特徴とするチツプ状電解コンデンサの製
造方法。 ２ 上記蓋状金属端子のインサート部分にあやめ
（七子目）ローレツトを設けたことを特徴とする
特許請求の範囲第１項記載のチツプ状電解コンデ
ンサの製造方法。[Claims] 1. A capacitor element is formed by making an anode foil and a cathode foil face each other with a separator interposed therebetween, and after impregnating the element with an electrolytic solution, a hollow cylindrical case made of thermoplastic resin with openings at both ends is placed. The leads pulled out from the element are connected to a lid-shaped metal terminal, and the lid-shaped metal terminal is inserted into the hollow cylindrical case and sealed while applying ultrasonic waves, and the outer surface of the metal terminal is sealed as required. A method for manufacturing a chip-shaped electrolytic capacitor, characterized in that an electrode is formed by forming a resin layer to surround the whole except for a portion, and forming a solder plating layer or a solderable metal portion on the outer surface of both ends. . 2. The method of manufacturing a chip-shaped electrolytic capacitor according to claim 1, characterized in that an iris (seventh child) knurl is provided in the insert portion of the lid-shaped metal terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16303682A JPS5951521A (en) | 1982-09-17 | 1982-09-17 | Chip type electrolytic condenser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16303682A JPS5951521A (en) | 1982-09-17 | 1982-09-17 | Chip type electrolytic condenser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5951521A JPS5951521A (en) | 1984-03-26 |
| JPH0228887B2 true JPH0228887B2 (en) | 1990-06-27 |
Family
ID=15765962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16303682A Granted JPS5951521A (en) | 1982-09-17 | 1982-09-17 | Chip type electrolytic condenser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5951521A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5683020A (en) * | 1979-12-11 | 1981-07-07 | Matsushita Electric Ind Co Ltd | Solidstate electrolytic condenser |
| JPS58103120A (en) * | 1981-12-16 | 1983-06-20 | マルコン電子株式会社 | Leadless type aluminum electrolytic condenser |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5699840U (en) * | 1979-12-26 | 1981-08-06 |
-
1982
- 1982-09-17 JP JP16303682A patent/JPS5951521A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5683020A (en) * | 1979-12-11 | 1981-07-07 | Matsushita Electric Ind Co Ltd | Solidstate electrolytic condenser |
| JPS58103120A (en) * | 1981-12-16 | 1983-06-20 | マルコン電子株式会社 | Leadless type aluminum electrolytic condenser |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5951521A (en) | 1984-03-26 |
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