JPH02288056A - Flat matrix crt - Google Patents

Abstract

PURPOSE:To simplify soldering work of a high pressure pin to a high pressure lead by setting the high pressure pin at almost the same height as that of the upper face of a plug, the high pressure pin being provided at the exit portion of the high pressure lead. CONSTITUTION:The position of the face of a high pressure pin 21 located on the exit side of a high pressure lead 6 and that of the face of a plug 19 are set at almost the same height: i.e., the recessed wiring portion of the low pressure pin 11 of the plug 19 is filled with an adhesive 16, and a high pressure lead 5 coming out of a vacuum portion V1 is guided and passed through the space portion V2 of the plug 19, and the high pressure lead 5 passed therethrough is guided and passed through a tube-shaped high pressure pin integrated with a plastic molding portion 13, and a guide protrusion 13a is brought in contact with the positioning protrusion 19c of the plug 19 and the adhesive 16 is stuck to the bottom glass 7 of the vacuum portion V1. Next, the adhesive 16 is thermally or naturally hardened, and the low pressure lead 10 and the low pressure pin 11a are joined by means of spot welding almost simultaneously with connection of the high pressure lead 5 with the high pressure pin 21 by way of soldering.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a flat matrix CRT forming a display screen of a large-sized image display device.

[Conventional technology]

FIG. 3 is a sectional view showing a conventional flat matrix CRT disclosed in, for example, Japanese Patent Laid-Open No. 150634/1982.

To briefly explain conventional devices of this type, flat matrix CRTs generally use phosphors (2) as display pixels.
A rectangular face glass (11 becomes the display part), and a spacer glass (6) following the shape is welded to the back side of this face and glass (1), and furthermore, this spacer glass (6) A bottom plate glass (7) is welded to the back to form a vacuum inside. Inside this vacuum, there is a filament that becomes a cathode electrode that generates thermoelectrons, and a face glass (1) that accelerates the generated thermoelectrons.
X to collide with the phosphor (2) of X to emit predetermined information
A grid and a Y grid are sequentially arranged toward the face glass side. These filaments and the X%Y grid have a low voltage pin aυ and a lead wire O connected to it.
Thermal electrons are generated in the filament by applying a low voltage through Q, and thermionic electrons are made to collide only with a predetermined phosphor (2) by selectively applying each of the X grid and Y grid. ing. A shielding plate is attached to the back side of each phosphor (2) so that thermoelectrons directed toward the phosphor (2) are not diffused to other adjacent phosphors (2).

Therefore, the phosphor (2) that is not bombarded by thermoelectrons does not emit fluorescence, and the flat matrix CRT displays fluorescence with good contrast. At this time, a high voltage is applied to each phosphor (2) of the face glass (11) using each as an anode electrode, so that it can always emit a predetermined color due to the collision of thermoelectrons. The Y grid plays the role of an electron lens, controlling the on/off of electrons.

This will be explained with reference to the diagram. In FIG. 3, +1) is a face glass, and (2) is a phosphor coated on the inner surface of the face glass (1), for example, in a 4×4 matrix structure in the length and width of the face glass (1). These phosphors (2) are connected by a conductor (3),
Lead wire (5) connected to high pressure bottle (4) in the center
) are connected. Furthermore, although not shown, a transparent lacquer is applied to the circular surface of the face glass (1) together with the phosphor (1), and aluminum vapor deposition is performed on the upper surface of the transparent lacquer, so that the face glass (1), the phosphor (2), and a transparent lacquer, an aluminum coating and a face plate C.
It forms Iη. (6) is a spacer glass welded along the shape of the face plate, and (7) is a bottom plate glass welded to the spacer glass facing the face plate. The first space (V) formed by the bottom glass (7) is maintained in a vacuum state. (8) is a plug fixed to the bottom glass (7);
8) A protrusion (8a) is formed at the center, a high voltage lead wire (5) is passed along this axis, and a glass tube (9) is surrounded by the outer side of the protrusion (8a). The space Ml (Vr) is sealed. OQ is the bottom plate glass (
7) The lead arm is pulled out from the X grid and Y grid (both not shown) attached to the inner surface. It is connected to a low voltage pin aυ arranged so as to form a circular shape around the outer periphery of. In addition, the plug (8
) has a circular protrusion (8) that is in close contact with the bottom glass (7).
b) is formed, which leads to high voltage lead wire (5).
) and the low voltage lead wire a1 are isolated from each other. In addition, in the second space (v2) formed between this plug (8) and the bottom plate glass (7), there is a perforation hole (8C) on the side of the protrusion (8a).
) is filled with an insulating filling to prevent high voltage leakage. Further, (6) is a shielding plate that prevents diffusion of thermoelectrons. Day 0 is the adhesive and αη is the phase plate.

According to the above configuration, since the high voltage pin (4) is attached to the protrusion (8a) formed at the center of the plug (8), the lead wire (5) for applying high voltage to the face plate can be kept to the shortest size. Therefore, the degree of high voltage leakage can be significantly suppressed, and the wiring work can be simplified. Moreover, since the lead wire (5) has a short dimension, the probability of failure can be suppressed.

The high voltage lead (5) passing through the glass exhaust pipe (9) provided in the center of the bottom plate glass (7) is connected by solder to the high voltage pin (4) of the plug (8), and the other low voltage leads are connected to the plug (8).
) is connected to the low-pressure pin aυ by half-time or welding, and the plug (8) and the vacuum tube are bonded with adhesive.

[Problem to be solved by the invention]

Since the conventional flat matrix CRT is configured as described above, when connecting the vacuum section (Vt) and the plug (8), the high pressure bottle (4) in the center of the plug (8) is connected.
) was located in the recess, making soldering work difficult.

The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to obtain an inexpensive and highly reliable kranotomarix CRT that facilitates the soldering work of high-voltage pins.

[Means to solve the problem]

In the flat matrix CRT according to the present invention, the high voltage pin is made into a tubular pin, and the high voltage pin at the high voltage lead outlet is positioned at approximately the same height as the top surface of the plug, and the high voltage lead is passed through the hollow part of the bottle to the exit side of the high voltage pin. penetrate,
Eight empty spaces around the high voltage lead on the outlet side are filled with solder up to the inner periphery of the high voltage pin.

[For production]

The flat matrix and CRT according to the present invention are designed so that the surface position of the high voltage pin on the outlet side of the high voltage lead and the surface position of the plug are approximately the same height, making it easy to solder the high voltage pin and the high voltage lead. make things better.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1, numeral 1) is a tubular high-pressure pin, 03 is a plastic molded product press-fitted to cover the outer periphery of the high-pressure pin l2Il, C9 is a lock bin, and C9 is a plug. Also, in the detailed view, Fig. 2, 3D is a tubular high-pressure bottle, (21a) is the chamfered part (5) of the high-pressure lead, and (9C) is the part installed on the inner wall of the plug 09! ll determining protrusion, C3 is a plastic molded product into which the high pressure pin 011 is press-fitted;
13b is the air vent hole, 041 is solder.

Note that the other configurations are the same as those of the prior art, so explanations will be omitted.

High pressure lead (5) between the first vacuum section (Vt) and plug 0
The connection method will be explained as an example. First, fill the concave part of the wiring part of the low voltage pin 0υ of plug a3 with adhesive Qθ, and then fill the vacuum part (V
The high voltage lead (5) coming out of l) is guided to the space part (C2) of plug 09 and penetrated, and then the high voltage lead (5) that has passed through.
Tubular high pressure c21 integrated with plastic molded part θJ
At the same time as the guiding protrusion (13a) is brought into contact with the positioning protrusion (19C) of the plug α9, the adhesive a0 is adhered to the bottom plate glass (7) of the vacuum part (Vl).

Next, the adhesive a0 is heated or naturally cured, and the low voltage lead αQ is connected to the low voltage pin (lla
) to spot weld. Note that the tubular pin Q+1 has a paring hole (21
a) or has a chamfered (21a) shape. Further, the space portion (C2) of the plug a9 is not filled with resin such as adhesive.

In addition, although the air vent hole (13b) was provided in the above embodiment, this may be omitted.

〔Effect of the invention〕

As described above, according to the present invention, the high-voltage pin is made into a tubular shape, the high-voltage pin at the high-voltage lead outlet is positioned at approximately the same height as the top surface of the plug, and the high-voltage lead is passed through the hollow part of the bottle. It is constructed so that it penetrates to the outlet side, and the space around the high voltage lead on the outlet side is filled with solder up to the inner circumference of the high voltage pin, so workability is good.
This has the effect of producing a product that is inexpensive and highly reliable.

[Brief explanation of drawings]

FIG. 1 is a partial cross-sectional view showing a flat matrix CRT according to an embodiment of the present invention, FIG. 2 is a detailed cross-sectional view showing the high voltage pin portion of FIG. 1, and FIG. 3 is a cross-sectional view showing a conventional flat matrix CRT. It is a diagram. (1) is face glass, (2) is phosphor, (3) is conductor, C11l is high voltage pin, (6) is high voltage lead, (6
) is spacer glass, (7) is bottom plate glass, 0 is plug, (9) is exhaust pipe, OQ is low pressure lead, αυ is low pressure pin, a is shielding plate, C1 is molded part, 041 is solder, θ solder Mouth. Kuhin, 0Q is adhesive, Qη is face plate. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.

Claims (1)

[Claims] A high-voltage pin is attached to the center of the plug to apply a high voltage to the phosphor formed in a matrix on the face plate through lead wires, and thermionic electrons are generated in the filament. In a flat matrix CRT, a plurality of low voltage pins are provided on the periphery of the plug surrounding the high voltage pin for applying a low voltage to the filament and the grid through respective lead wires in order to control the flight area of the filament to the phosphor by the grid. , the high-voltage pin is a tubular pin, a high-voltage lead is passed through the hollow part of the pin to the outlet side, and the surface position of the high-pressure pin on the outlet side is approximately the same height as the surface position of the plug;
A flat matrix CRT characterized in that the space around the high voltage lead at the outlet of the high voltage pin is filled with solder up to the inner periphery of the high voltage pin.