JPH02287773A - Method for inspecting article with repeated pattern - Google Patents

Method for inspecting article with repeated pattern

Info

Publication number
JPH02287773A
JPH02287773A JP1107770A JP10777089A JPH02287773A JP H02287773 A JPH02287773 A JP H02287773A JP 1107770 A JP1107770 A JP 1107770A JP 10777089 A JP10777089 A JP 10777089A JP H02287773 A JPH02287773 A JP H02287773A
Authority
JP
Japan
Prior art keywords
article
pattern image
lead frame
frame material
unit pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1107770A
Other languages
Japanese (ja)
Other versions
JP2862271B2 (en
Inventor
Kenji Takeuchi
健二 竹内
Yoshizo Yamamoto
山本 好造
Yoshio Numa
沼 美穂
Toshiki Deguchi
俊樹 出口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyodo Printing Co Ltd
Original Assignee
Kyodo Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyodo Printing Co Ltd filed Critical Kyodo Printing Co Ltd
Priority to JP1107770A priority Critical patent/JP2862271B2/en
Publication of JPH02287773A publication Critical patent/JPH02287773A/en
Application granted granted Critical
Publication of JP2862271B2 publication Critical patent/JP2862271B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)

Abstract

PURPOSE:To reduce the damage of an article to be checked and to eliminate a need of a complicated positioning mechanism by positioning and arranging the article in a specific direction and extracting each unit pattern image from the image pick-up result of a preliminarily determined part to compare it with a reference pattern image. CONSTITUTION:An IC lead frame material 2 as the article to be checked consists of four repeat unit patterns P1 to P4 connected in the X direction and is placed on a table 4 and is brought into contact with a contact part 4a and is positioned in the Y direction and is fixed. Three line sensor cameras CA1, CA2, and CA3 arranged at the prescribed intervals are arranged to the upper left of the lead frame material 2, and the position of the article in the X direction is measured in accordance with the image pick-up results of the preliminarily determined part of the article 2, and each unit pattern image of the article is extracted based on the measured result and is compared with the reference pattern image. Thus, the check method of the article with repeated patterns is obtained which reduces the damage of the article and does not require a complicated positioning mechanism.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は繰返しパターンをもつ物品を検査する方法に関
し、特にその形状、傷、汚れなどの外観を光学的に検出
して欠陥の有無を検出するための方法に関する。この様
な光学的検査は特に平面的な物品たとえば電子部品リー
ドフレーム材や印刷物その他の繰返しパターンを持つ物
品の自動検査に好適に適用される。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for inspecting an article having a repeated pattern, and in particular, a method for optically detecting the appearance of the article, such as its shape, scratches, dirt, etc., to detect the presence or absence of defects. Concerning how to. Such optical inspection is particularly suitable for automatic inspection of planar articles such as electronic component lead frame materials, printed matter, and other articles having repetitive patterns.

[従来の技術及び発明が解決しようとする課題]従来、
各種物品の外観検査は裸眼または場合によっては光学顕
微鏡を用いて作業者の目視により行なわれることが多か
った。しかしながら、この様な目視検査は作業者により
判定がバラつき同一作業者であっても作業条件により判
定がバラつき作業者が疲労する等の難点があり、また検
査速度の向上が望めないという難点があった。
[Prior art and problems to be solved by the invention] Conventionally,
Appearance inspections of various articles have often been conducted visually by workers using the naked eye or, in some cases, using an optical microscope. However, this type of visual inspection has the disadvantages that the judgments vary depending on the worker, the judgments vary depending on the working conditions even by the same worker, the worker becomes fatigued, and it is difficult to expect an improvement in the inspection speed. Ta.

そこで、近年、検査の自動化が要求される様になってき
ている。この自動検査は基準となるパターンと被検査パ
ターンとを比較して、その差を検出することからなる。
Therefore, in recent years, there has been a demand for automation of testing. This automatic inspection consists of comparing a reference pattern and a pattern to be inspected and detecting the difference between them.

この様な自動検査は立体的な物品の検査にも適用するこ
とができるけれども、現実的には立体的物品の自動検査
はかなり困難であり、特に平面的な物品(実質上平面的
パターンとしてとらえ得る物品)たとえば電子部品リー
ドフレーム材や印刷物等の検査に最も良好に適用できる
Although this kind of automatic inspection can be applied to the inspection of three-dimensional objects, in reality automatic inspection of three-dimensional objects is quite difficult, especially for two-dimensional objects (which are treated as essentially two-dimensional patterns). It is best applied to the inspection of electronic component lead frame materials, printed matter, etc.).

被検査パターンを得るためには、カメラによる撮像が行
なわれ、カメラとしてはエリアセンサカメラまたはライ
ンセンサカメラを用いることができる。エリアセンサカ
メラを用いる場合には、被検査パターンのために全画素
数のメモリを要するが、撮像を一時に行なうことができ
るという利点がある。また、ラインセンサカメラを用い
る場合には、走査手段を要するが、メモリが少な(てす
み走査と並行して比較を行なうことができ効率的である
という利点がある。
In order to obtain the pattern to be inspected, an image is taken by a camera, and an area sensor camera or a line sensor camera can be used as the camera. When using an area sensor camera, a memory for the entire number of pixels is required for the pattern to be inspected, but it has the advantage that images can be captured at once. Furthermore, when using a line sensor camera, a scanning means is required, but there is an advantage that the memory is small (comparison can be carried out in parallel with quick scanning and it is efficient).

この様な自動検査の方法としては、例えば特開昭63−
15441号公報及び特開昭63−15380号公報に
記載されている方法がある。
As a method of such automatic inspection, for example, Japanese Patent Application Laid-Open No. 1983-
There are methods described in Japanese Patent Application Laid-open No. 15441 and Japanese Patent Application Laid-open No. 15380/1983.

しかし、これら公報に記載されている方法では、テーブ
ル上に載置した被検査物品をカメラに対して位置決めす
るのに、該テーブルの載置面内の2つの方向の突当て部
に対し被検査物品を突当てて固定することで行なってい
る。従って、この方法では、2方向の位置決め機構が必
要となり、装置構造が複雑になるとともに、被検査物品
の端部が突当てにより傷つく頻度が高かった。
However, in the methods described in these publications, in order to position the object to be inspected placed on a table with respect to the camera, the object to be inspected is This is done by pressing the item against each other and fixing it. Therefore, in this method, a positioning mechanism in two directions is required, which complicates the structure of the apparatus, and the ends of the inspected article are frequently damaged due to bumping.

そこで、本発明は、以上の様な従来技術の問題点に鑑み
、被検査物品を傷付けることが少な(、複雑な位置決め
機構の不要な、繰返しパターンをもつ物品の検査方法を
提供することを目的とするものである。
SUMMARY OF THE INVENTION In view of the problems of the prior art as described above, an object of the present invention is to provide a method for inspecting an article having a repetitive pattern, which does not require a complicated positioning mechanism, and which causes less damage to the article to be inspected. That is.

[課題を解決するための手段] 本発明によれば、以上の如き目的を達成するものとして
、 特定方向に繰返す単位パターンをもつ物品を上記特定方
向に関し端部どうじが重なりあう様な複数の領域ごとに
撮像し、かくして得た複数の画像から各単位パターン像
を抽出し、これらを基準パターン像と比較して判定を行
なう検査方法において、上記物品を上記特定方向と直交
する方向に関し位置決めして配置し、該物品の予め定め
られた部分の撮像結果から上記特定方向に関する物品の
位置を測定し、該測定結果に基づき上記物品の各単位パ
ターン像を抽出して上記基準パターン像との比較を行な
うことを特徴とする、繰返しパターンをもつ物品の検査
方法、 が提供される。
[Means for Solving the Problems] According to the present invention, in order to achieve the above objects, an article having a unit pattern that repeats in a specific direction is divided into a plurality of areas whose end portions overlap in the specific direction. In an inspection method in which each unit pattern image is extracted from a plurality of images obtained in this way and a judgment is made by comparing these with a reference pattern image, the above-mentioned article is positioned in a direction perpendicular to the above-mentioned specific direction. and measure the position of the article in the specific direction from the imaging results of a predetermined portion of the article, extract each unit pattern image of the article based on the measurement result, and compare it with the reference pattern image. A method for inspecting an article having a repetitive pattern is provided.

本発明においては、上記特定方向に関する物品の位置の
測定結果から該方向に関する物品の長さを算出し、該長
さが許容範囲内の場合のみ基準長さとの差の半分だけず
れた特定方向端部位置を単位パターン像抽出の基準とな
す補正により検査座標の設定を行なうことができる。
In the present invention, the length of the article in the specific direction is calculated from the measurement result of the position of the article in the specific direction, and only when the length is within the allowable range, the edge of the specific direction is shifted by half the difference from the reference length. Inspection coordinates can be set by correction using the part position as a reference for unit pattern image extraction.

[実施例] 以下、図面を参照しながら本発明の具体的実施例を説明
する。
[Example] Hereinafter, specific examples of the present invention will be described with reference to the drawings.

第2図(a)は本発明の実施される装置の一例を示す概
略部分平面図であり、第2図(b)はその概略正面図で
ある。
FIG. 2(a) is a schematic partial plan view showing an example of an apparatus in which the present invention is implemented, and FIG. 2(b) is a schematic front view thereof.

これらの図において、2は被検査物品たるICリードフ
レーム材であり、本実施例ではX方向に連結された4つ
の繰返し単位パターンP]〜P4からなる。該リードフ
レーム材はテーブル4上に載置される。該テーブルの載
置面は水平であり、そのY方向に関する片方の端部には
突当て部4aが形成されており、リードフレーム材2は
該突当て部4aに突当てられて不図示の手段によりY方
向に関し位置決めされて固定されている。
In these figures, reference numeral 2 denotes an IC lead frame material which is an article to be inspected, and in this embodiment, it consists of four repeating unit patterns P] to P4 connected in the X direction. The lead frame material is placed on the table 4. The mounting surface of the table is horizontal, and an abutment part 4a is formed at one end in the Y direction, and the lead frame material 2 is abutted against the abutment part 4a and is moved by means (not shown). It is positioned and fixed in the Y direction by.

リードフレーム材2の右斜め上方には照明光源6が配置
されており、該光源から発せられた光がリードフレーム
材2の上面を照明する様になっている。リードフレーム
材2の左斜め上方にはX方向に所定の間隔にて配置され
た3台のラインセンサカメラCAL、CA2.CA3が
配置されている。
An illumination light source 6 is disposed diagonally above and to the right of the lead frame material 2, and the light emitted from the light source illuminates the upper surface of the lead frame material 2. Three line sensor cameras CAL, CA2 . CA3 is located.

面、上記照明光源6及びラインセンサカメラCAl、C
A2.CA3は不図示の共通の支持部材に取り付けられ
ており、これらは不図示の駆動手段によりテーブル4に
対してY方向に移動せしめられる。
surface, the illumination light source 6 and the line sensor camera CAl,C
A2. The CA 3 is attached to a common support member (not shown), and these members are moved in the Y direction with respect to the table 4 by a driving means (not shown).

第3図は各カメラの撮像状態を示す概略光学図である。FIG. 3 is a schematic optical diagram showing the imaging state of each camera.

図において、8−1 8−2 8−3はそれぞれカメラ
CAL、CA2.CA3の対物レンズであり、10−1
 10−2 10−3はそれぞれ該カメラCAI、CA
2.CA3の受光素子たるラインセンサである。図示さ
れる様に、各カメラのラインセンサはX方向に画素配列
を有する。カメラCALのラインセンサ10−1にはK
O〜に5のライン状領域が撮像され、カメラCA2のラ
インセンサ10−2にはに3〜に8のライン状領域が撮
像され、カメラCA3のラインセンサ1〇−3にはに7
〜Kllのライン状領域が撮像される。
In the figure, 8-1 8-2 8-3 are cameras CAL, CA2. It is a CA3 objective lens, 10-1
10-2 and 10-3 are the cameras CAI and CA, respectively.
2. This is a line sensor that is the light receiving element of CA3. As illustrated, the line sensor of each camera has a pixel array in the X direction. K for line sensor 10-1 of camera CAL
A line-shaped area of 5 to 0 is imaged, a line-shaped area of 3 to 8 is imaged to the line sensor 10-2 of the camera CA2, and a line-shaped area of 7 to 8 is imaged to the line sensor 10-3 of the camera CA3.
A linear region of ~Kll is imaged.

カメラCAIの撮像領域とカメラCA2の撮像領域とは
に3〜に5の領域が重なり合っており、同様にカメラC
A2の撮像領域とカメラCA3の撮像領域とはに7〜に
8の領域が重なり合っている。また、リードフレーム材
2の各単位パターンP1〜P4はそれぞれに1〜に2.
に2〜に6゜K6〜に9.に9〜に10のX方向長さ(
すなわちf2)を有する。
The imaging area of camera CAI and the imaging area of camera CA2 overlap in areas 3 to 5, and similarly camera C
The imaging area of A2 and the imaging area of camera CA3 overlap in areas 7 to 8. Further, each unit pattern P1 to P4 of the lead frame material 2 is 1 to 2, respectively.
2~6°K6~9. The length in the X direction of 9 to 10 (
That is, it has f2).

尚、KO,Kllはリードフレーム材2のX方向両端よ
りも外側に位置し、従って3台のカメラによるX方向に
関する撮像範囲には被検査物品2が完全に納まっている
。即ち、リードフレーム材2をテーブル4上に配置固定
する際には、この様な配置となる程度のX方向位置の制
御は行なわれる。
Note that KO and Kll are located outside both ends of the lead frame material 2 in the X direction, and therefore, the inspected article 2 is completely contained within the imaging range in the X direction by the three cameras. That is, when placing and fixing the lead frame material 2 on the table 4, the position in the X direction is controlled to such an extent that such an arrangement is achieved.

第4図(a)、(b)はリードフレーム材2どカメラC
AL、CA2.CA3の全ラインセンサとの結像関係を
示す図である。ここで、■I、、I2はリードフレーム
材2に対するラインセンサの光学的等価像を示す。
Figure 4 (a) and (b) show lead frame material 2 and camera C.
AL, CA2. It is a figure which shows the imaging relationship with all the line sensors of CA3. Here, ■I, , I2 indicate optically equivalent images of the line sensor with respect to the lead frame material 2.

第1図は本発明の一実施例を説明するためのフロー図で
ある。
FIG. 1 is a flow diagram for explaining one embodiment of the present invention.

以下、上記第2〜4図を参照しながら、第1図に基づき
、本発明実施例を具体的に説明する。
Hereinafter, an embodiment of the present invention will be specifically described based on FIG. 1 while referring to FIGS. 2 to 4 above.

先ず、リードフレーム材2を第2図に示される様にテー
ブル4上の所定の位置にセットする(STl)。この際
、該リードフレーム材はY方向の端部を突当て部4aに
突当てた状態でY方向に位置決めされ、一方X方向には
位置決めは行なわない。但し、リードフレーム材2は、
X方向には予め定められた許容範囲内に位置する様にな
っており、この許容範囲内であれば、上記第3図に示さ
れる様に、リードフレームIt’、I’ 2の全体が3
台のカメラの撮像範囲に入る様になっている。
First, the lead frame material 2 is set at a predetermined position on the table 4 as shown in FIG. 2 (STl). At this time, the lead frame material is positioned in the Y direction with its end in the Y direction abutting against the abutting portion 4a, while no positioning is performed in the X direction. However, the lead frame material 2 is
It is arranged to be located within a predetermined tolerance range in the X direction, and within this tolerance range, as shown in FIG.
It is designed to be within the imaging range of the camera on the stand.

次に、不図示の駆動手段により、カメラCA1、CA2
.CA3及び照明光源6をY方向に移動させて、該カメ
ラをリードフレーム材2に対しそのX方向位置測定のた
めの所定位置になる様に配置させる(Sr1)。該所定
位置は、例えば、第4図(b)に示される様に、ライン
センサの光学的等価像が工、の位置(即ちリードフレー
ム材2のY方向端部の様にX方向全体がベタ面である様
な位置)にくる様な位置である。この様な位置は、突当
て部4aとの関係で予め設定することができる。
Next, the cameras CA1 and CA2 are driven by a driving means (not shown).
.. The CA 3 and the illumination light source 6 are moved in the Y direction, and the camera is placed at a predetermined position for measuring the position of the lead frame material 2 in the X direction (Sr1). The predetermined position is, for example, a position where the optical equivalent image of the line sensor is located as shown in FIG. It is a position that appears to be a surface). Such a position can be set in advance in relation to the abutting portion 4a.

次に、3台のカメラで撮像な行なう(Sr1)。Next, images are taken using three cameras (Sr1).

次に、上記ST3の撮像の結果に基づきリードフレーム
材2のX方向長さLを算出する(Sr1)。この算出は
、リードフレーム材2の存在が検出されるセンサビット
のうちの両端のセンサビットから求めることができる。
Next, the length L in the X direction of the lead frame material 2 is calculated based on the result of the imaging in ST3 (Sr1). This calculation can be obtained from the sensor bits at both ends of the sensor bits where the presence of the lead frame material 2 is detected.

具体的には、該長さLは(Kl−に1.Oに対応するカ
メラビット数)X(カメラ1ビツトのX方向長さ)/(
カメラの撮像倍率)で求めることができる。
Specifically, the length L is (number of camera bits corresponding to 1.O in Kl-) x (length of camera 1 bit in the X direction)/(
It can be determined by the camera's imaging magnification.

次に、上記長さLが所定の許容範囲内であるか否かを判
定する(Sr1)。即ち、基準値り。に対する誤差δを
(L−L、)により測定し、IL−LO+が許容誤差よ
り大きいかどうかを判定する。
Next, it is determined whether the length L is within a predetermined allowable range (Sr1). In other words, the standard value. The error δ is measured by (LL, ), and it is determined whether IL-LO+ is larger than the allowable error.

上記ST5において、誤差が許容範囲内であった場合に
は、次いで、X方向の検査座標設定を行なう(Sr1)
。この設定は、上記に1に対し距離δ/2を加算した位
置を単位パターン抽出のX方向測定開始座標とする補正
を行なうものである。これにより、全パターンP1〜P
4の抽出を、第4図(a)に示されるKS−KEの領域
(X方長さし。)の範囲内で最も誤差の少ない形で行な
うことができる。
If the error is within the allowable range in ST5 above, then the inspection coordinates in the X direction are set (Sr1)
. This setting is for making a correction to set the position obtained by adding the distance δ/2 to 1 as the X-direction measurement start coordinate for unit pattern extraction. As a result, all patterns P1 to P
4 can be extracted with the smallest error within the range of the KS-KE region (length in the X direction) shown in FIG. 4(a).

上記ST6に続いて、各単位パターンの検査を行なう(
Sr7)。この検査は、上記3台のカメラをリードフレ
ーム材2に対しY方向に移動させながら撮像な行ない(
即ち、第4図(a)で示されるラインセンサの光学的等
価機工をY方向に走査させ)、該撮像結果に基づき上記
ST6で設定された検査座標により各カメラの撮像パタ
ーン像を適宜分解し更に適宜合成して、各単位パターン
P1〜P4の像を得、これらと基準パターン像との比較
を行なうことでなされ、所定の基準で良品と不良品との
判別が行なわれる。尚、この様な検査は、例えば上記特
開昭63−15141号公報及び特開昭63−1538
0号公報に記載の様にして行なうことができる。
Following ST6 above, each unit pattern is inspected (
Sr7). This inspection is performed by taking images while moving the three cameras mentioned above in the Y direction relative to the lead frame material 2 (
That is, the optically equivalent mechanism of the line sensor shown in FIG. 4(a) is scanned in the Y direction), and based on the imaging results, the imaging pattern image of each camera is appropriately decomposed using the inspection coordinates set in ST6 above. Furthermore, images of each of the unit patterns P1 to P4 are obtained by appropriately combining the images, and these are compared with a reference pattern image, thereby determining whether a good product or a defective product is present based on a predetermined standard. Incidentally, such an inspection is described, for example, in the above-mentioned Japanese Patent Application Laid-Open No. 63-15141 and Japanese Patent Application Laid-Open No. 63-1538.
This can be carried out as described in Publication No. 0.

一方、上記ST5で誤差が許容範囲外であった場合には
、続いて不良品処理を行ない(Sr1)、単位パターン
検査は行なわない。この不良品処理は、適宜の選別手段
でリードフレーム材2を不良品として回収することによ
りなされる。
On the other hand, if the error is outside the allowable range in ST5, then defective product processing is performed (Sr1) and unit pattern inspection is not performed. This defective product processing is performed by collecting the lead frame material 2 as a defective product using an appropriate sorting means.

面、上記ST2におけるカメラの移動先である所定位置
は、例えば、第4図(b)に示される様に、ラインセン
サの光学的等価像がI2の位置(即ちリードフレーム材
2のY方向バーの部分の位置)にくる様な配置であって
もよく、この様な所定位置も突当て部4aとの関係で予
め設定することができる。そして、この場合には、上記
ST4においてリードフレーム材2のX方向長さしを算
出する際に、リードフレーム材2の存在が検出されるセ
ンサビットのうちの両端のセンサビットから求めた長さ
を基に換算によりリードフレーム材2の長さLを求める
ことができる。
The predetermined position to which the camera moves in ST2 is, for example, as shown in FIG. The position may be such that the position of the abutting portion 4a is the same as that of the abutting portion 4a. In this case, when calculating the length of the lead frame material 2 in the X direction in ST4, the length determined from the sensor bits at both ends of the sensor bits where the presence of the lead frame material 2 is detected. The length L of the lead frame material 2 can be determined by conversion based on .

以上の実施例において、リードフレーム材2は、Y方向
の端部がテーブル4の突当て部4aに対し突当てられて
も傷ついたり変形したりすることが殆どない。そして、
該リードフレーム材2はX方向の端部が突き当てられる
と該端部の細い部分が傷ついたり変形したりし易いとこ
ろ、上記実施例においては、X方向端部が突当て部に突
当てられてはいないので、傷ついたり変形したりするこ
とがない。
In the embodiments described above, the lead frame material 2 is hardly damaged or deformed even if the end portion in the Y direction is abutted against the abutting portion 4a of the table 4. and,
If the lead frame material 2 is abutted against the end in the X direction, the thin part of the end is likely to be damaged or deformed, but in the above embodiment, the end in the X direction is abutted against the abutment part. Since it is not covered, it will not be damaged or deformed.

また、上記実施例においては、リードフレーム材2をY
方向に関して位置決めし且っX方向に関しては位置決め
していないので、装置の位置決め機構が簡単化される。
Further, in the above embodiment, the lead frame material 2 is Y
Since positioning is performed in the direction and not in the X direction, the positioning mechanism of the device is simplified.

本発明が上記リードフレーム材のみでなく、その他の物
品の検査にも適用できることはいうまでもない。
It goes without saying that the present invention is applicable not only to the above-mentioned lead frame materials but also to the inspection of other articles.

[発明の効果] 以上説明した様に、本発明によれば、被検査物品を傷付
けることが少なく、複雑な位置決め機構の不要な、繰返
しパターンをもつ物品の検査方法が提供される。
[Effects of the Invention] As explained above, according to the present invention, there is provided a method for inspecting an article having a repeated pattern, which is less likely to damage the inspected article and does not require a complicated positioning mechanism.

本発明は、被検査物品が2方向のうちの一方のみ突当て
により端部が傷つき易いものである場合には、傷つきに
くい方向の端部な突当てて位置決め固定することにより
、不良品の発生の防止に特に有効である。
The present invention prevents the occurrence of defective products by positioning and fixing the object by abutting the end in the direction in which it is less likely to be damaged, when the end of the object to be inspected is easily damaged by abutment in only one of two directions. It is particularly effective in preventing

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例を説明するためのフロー図で
ある。 第2図(a)は本発明の実施される装置の一例を示す概
略部分平面図であり、第2図(b)ばその概略正面図で
ある。 第3図は各カメラの撮像状態を示す概略光学図である。 第4図(a)、(b)はリードフレーム4jとカメラの
全ラインセンサとの結像関係を示す図である。 2:リードフレーム材、 4:テーブル、  4a:突当て部、 6:照明光源、 8−1〜8−3;対物レンズ、 10−1〜10−3ニラインセンサ、 CAL〜CA3 :ラインセンサカメラ、P1〜P4:
単位パターン。
FIG. 1 is a flow diagram for explaining one embodiment of the present invention. FIG. 2(a) is a schematic partial plan view showing an example of an apparatus in which the present invention is implemented, and FIG. 2(b) is a schematic front view thereof. FIG. 3 is a schematic optical diagram showing the imaging state of each camera. FIGS. 4(a) and 4(b) are diagrams showing the imaging relationship between the lead frame 4j and all line sensors of the camera. 2: Lead frame material, 4: Table, 4a: Abutting portion, 6: Illumination light source, 8-1 to 8-3; Objective lens, 10-1 to 10-3 Ni line sensor, CAL to CA3: Line sensor camera , P1 to P4:
unit pattern.

Claims (2)

【特許請求の範囲】[Claims] (1)特定方向に繰返す単位パターンをもつ物品を上記
特定方向に関し端部どうしが重なりあう様な複数の領域
ごとに撮像し、かくして得た複数の画像から各単位パタ
ーン像を抽出し、これらを基準パターン像と比較して判
定を行なう検査方法において、上記物品を上記特定方向
と直交する方向に関し位置決めして配置し、該物品の予
め定められた部分の撮像結果から上記特定方向に関する
物品の位置を測定し、該測定結果に基づき上記物品の各
単位パターン像を抽出して上記基準パターン像との比較
を行なうことを特徴とする、繰返しパターンをもつ物品
の検査方法。
(1) An article having a unit pattern that repeats in a specific direction is imaged in multiple areas where the ends overlap each other in the specific direction, and each unit pattern image is extracted from the multiple images thus obtained, and these are In an inspection method in which a determination is made by comparing with a reference pattern image, the article is positioned and arranged in a direction perpendicular to the specific direction, and the position of the article in the specific direction is determined from the imaging result of a predetermined portion of the article. 1. A method for inspecting an article having a repeated pattern, the method comprising: measuring a unit pattern of the article, extracting each unit pattern image of the article based on the measurement results, and comparing the extracted unit pattern image with the reference pattern image.
(2)上記特定方向に関する物品の位置の測定結果から
該方向に関する物品の長さを算出し、該長さが許容範囲
内の場合のみ基準長さとの差の半分だけずれた特定方向
端部位置を単位パターン像抽出の基準となす補正により
検査座標の設定を行なう、請求項1に記載の繰返しパタ
ーンをもつ物品の検査方法。
(2) Calculate the length of the article in the specified direction from the measurement result of the position of the article in the specified direction, and only if the length is within the allowable range, the end position in the specified direction is shifted by half the difference from the reference length. 2. The method for inspecting an article having a repetitive pattern according to claim 1, wherein the inspection coordinates are set by correction using the unit pattern image as a reference for extracting the unit pattern image.
JP1107770A 1989-04-28 1989-04-28 Inspection method for articles with repetitive patterns Expired - Fee Related JP2862271B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1107770A JP2862271B2 (en) 1989-04-28 1989-04-28 Inspection method for articles with repetitive patterns

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1107770A JP2862271B2 (en) 1989-04-28 1989-04-28 Inspection method for articles with repetitive patterns

Publications (2)

Publication Number Publication Date
JPH02287773A true JPH02287773A (en) 1990-11-27
JP2862271B2 JP2862271B2 (en) 1999-03-03

Family

ID=14467572

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1107770A Expired - Fee Related JP2862271B2 (en) 1989-04-28 1989-04-28 Inspection method for articles with repetitive patterns

Country Status (1)

Country Link
JP (1) JP2862271B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04235305A (en) * 1991-01-11 1992-08-24 Kanebo Denshi Kk Automatic visual inspection apparatus for electronic element
JPH0644360A (en) * 1990-12-27 1994-02-18 Internatl Business Mach Corp <Ibm> Visual inspection method and device for electronic part with lead

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0644360A (en) * 1990-12-27 1994-02-18 Internatl Business Mach Corp <Ibm> Visual inspection method and device for electronic part with lead
JPH04235305A (en) * 1991-01-11 1992-08-24 Kanebo Denshi Kk Automatic visual inspection apparatus for electronic element

Also Published As

Publication number Publication date
JP2862271B2 (en) 1999-03-03

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