JP2669685B2 - Inspection equipment for linear objects - Google Patents
Inspection equipment for linear objectsInfo
- Publication number
- JP2669685B2 JP2669685B2 JP1073845A JP7384589A JP2669685B2 JP 2669685 B2 JP2669685 B2 JP 2669685B2 JP 1073845 A JP1073845 A JP 1073845A JP 7384589 A JP7384589 A JP 7384589A JP 2669685 B2 JP2669685 B2 JP 2669685B2
- Authority
- JP
- Japan
- Prior art keywords
- linear object
- height
- predetermined surface
- die pad
- storage unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
- Length Measuring Devices By Optical Means (AREA)
Description
【発明の詳細な説明】 ［概要］ 線状物体の所定面からの高さを測定して形状検査を行
う装置に関し、 所定面が標準状態から傾斜していることがあるため、
標準値と測定値とを比較し、傾斜していることに起因す
る補正値を格納して容易に真の形状を検査できるように
した検査装置を提供することを目的とし、 光切断法により、線状物体の所定面からの高さを撮像
する撮像装置と、撮像したデータよりその所定面からの
高さを測定する論理演算部を具備する線状物体形状検査
装置において、該論理演算部には互いに平行な複数本の
スリット光により所定面上に生じた像の標準間隔を予め
格納するデータ格納部と、検査すべき線状物体について
互いに平行な複数本のスリット光により所定面上に生じ
た像の間隔を測定し前述のデータと比較する比較部と、
比較部出力により所定面の傾きを補正する補正値を前記
データ格納部に格納する手段と、前記格納部・手段の動
作を制御する制御手段とを具備し、前記比較部の出力に
より撮像した高さデータを補正し線状物体の高さを検出
することで構成する。DETAILED DESCRIPTION OF THE INVENTION [Overview] Regarding an apparatus for measuring the height of a linear object from a predetermined surface and performing a shape inspection, the predetermined surface may be inclined from a standard state.
With the aim of providing an inspection device that compares a standard value with a measured value and stores a correction value due to the inclination so that the true shape can be easily inspected, by the optical cutting method, In a linear object shape inspection apparatus including an image pickup device for picking up an image of a height of a linear object from a predetermined surface and a logical operation part for measuring the height of the imaged data from the predetermined surface, the logical operation part is Is a data storage unit that stores in advance a standard interval of an image generated on a predetermined plane by a plurality of parallel slit lights, and is generated on a predetermined plane by a plurality of parallel slit lights for a linear object to be inspected. A comparison unit that measures the distance between the images and compares it with the data described above;
It is provided with means for storing a correction value for correcting the inclination of a predetermined surface in the data storage section by the output of the comparison section, and control means for controlling the operation of the storage section / means. It is configured by correcting the height data and detecting the height of the linear object.
［産業上の利用分野］ 本発明は特に線状物体の所定面からの高さを測定して
形状検査を行う装置に関する。[Field of Industrial Application] The present invention particularly relates to an apparatus for measuring the height of a linear object from a predetermined surface and performing shape inspection.
従来、半導体集積回路の製造工程において使用される
ような線状物体の形状検査装置では、ボンディングワイ
ヤの立体形状を測定することを、ワイヤの検査の１項目
としている。ダイパッドが傾斜しているとチップの左側
・右側の値が全く相違し、正常か異常かの判断が大変困
難となった。そのため所定面が標準面より傾斜している
とき、検査値を簡易に補正するための技術を開発するこ
とが要望された。2. Description of the Related Art Conventionally, in a linear object shape inspection apparatus used in a manufacturing process of a semiconductor integrated circuit, measuring a three-dimensional shape of a bonding wire is one item of wire inspection. When the die pad was tilted, the values on the left and right sides of the chip were completely different, making it very difficult to judge whether the chip was normal or abnormal. Therefore, it has been desired to develop a technique for easily correcting the inspection value when the predetermined surface is inclined with respect to the standard surface.
［従来の技術］ 半導体集積回路の製造工程において、電気試験を行う
と同時に各工程毎の外観検査を簡便に行い、不良品は以
後の複雑な処理工程へ廻さないように配慮している。ワ
イヤボンディング工程の後、ワイヤの垂れ下がりの有
無、高さの正常性を検査する必要があり、従業員の目視
による検査では、小型・細密なため作業が困難となっ
た。光切断法による自動検査装置の開発が望まれてい
る。第５図は光切断法により線状物体の高さを検出する
装置の説明図である。第５図において、１は撮像装置、
２はスリット光、３は高さｈの線状物体、４は情報処理
装置、５は画像表示装置を示す。スリット光２が線状物
体３に対し、角度αで照射したとき物体３からの反射散
乱光と、物体の置かれた面からの反射光を撮像装置１で
撮像する。撮像装置１の出力を情報処理装置４において
処理し、表示装置５で表示すると、図示するように、幅
ｌだけ離れた像を得る。このとき ｈ＝l tanα の式によりｈを求めることが出来る。[Prior Art] In a manufacturing process of a semiconductor integrated circuit, an electric test is performed at the same time as a visual inspection is simply performed for each process so that a defective product is not sent to a complicated processing process thereafter. After the wire bonding process, it is necessary to inspect whether or not the wire hangs down, and the normality of the height. In the visual inspection by the employees, the work is difficult because it is small and detailed. The development of an automatic inspection device using a light-section method is desired. FIG. 5 is an explanatory view of an apparatus for detecting the height of a linear object by the light section method. In FIG. 5, 1 is an imaging device,
2 is slit light, 3 is a linear object having a height h, 4 is an information processing device, and 5 is an image display device. When the slit light 2 irradiates the linear object 3 at an angle α, the imaging device 1 captures the reflected scattered light from the object 3 and the reflected light from the surface on which the object is placed. When the output of the image pickup device 1 is processed by the information processing device 4 and displayed on the display device 5, as shown in the figure, an image separated by a width 1 is obtained. At this time, h can be obtained from the equation h = l tanα.
次に第６図は半導体集積回路にボンディングしたワイ
ヤについて、第５図の光切断法による検査を行ったとき
の説明図である。第６図において、６は集積回路チッ
プ、７はダイパッドと呼ばれるチップ６を載置する台、
８−1,8−２…は外部への接続リード、９−1,9−２…は
ワイヤ、10−1,10−２はワイヤ９において反射した光の
像、11−1,11−２…はダイパッド７において反射した光
の像を示す。即ち、図の左上方から４つのスリット光を
ワイヤに照射したとき、各ワイヤにおいてスリット光が
総て反射し、１つのスリット光はダイパッドには当たら
ずに反射してない。図のl1とスリット光の傾斜角とによ
りワイヤ９−１のダイパッド７からの高さを求めること
が出来る。Next, FIG. 6 is an explanatory diagram when the wire bonded to the semiconductor integrated circuit is inspected by the optical cutting method of FIG. In FIG. 6, 6 is an integrated circuit chip, 7 is a base on which a chip 6 called a die pad is mounted,
8-1, 8-2 ... External connection leads, 9-1, 9-2 ... Wires, 10-1, 10-2 are images of light reflected on the wire 9, 11-1, 11-2 .. Indicate an image of light reflected on the die pad 7. That is, when the wires are irradiated with four slit lights from the upper left of the figure, all the slit lights are reflected on each wire, and one slit light does not hit the die pad and is not reflected. The height of the wire 9-1 from the die pad 7 can be obtained from l 1 in the figure and the inclination angle of the slit light.
［発明が解決しようとする課題］ 第６図において、ダイパッド７が傾いていて、リード
８が正常であれば、ワイヤ９の高さが集積回路チップ６
の片側はより小に、チップの反対側はより大になって正
確に検出することが出来ない。[Problems to be Solved by the Invention] In FIG. 6, if the die pad 7 is inclined and the leads 8 are normal, the height of the wires 9 is
One side is smaller and the other side is larger and cannot be detected accurately.
本発明の目的は前述の欠点を改善し、所定面が標準状
態から傾斜していることがあるため、標準値と測定値と
を比較し、傾斜していることに起因する補正値を格納し
て容易に真の形状を検査できるようにした検査装置を提
供することにある。Since the object of the present invention is to improve the above-mentioned drawbacks and the predetermined surface may be inclined from the standard state, the standard value and the measured value are compared, and the correction value due to the inclination is stored. An object of the present invention is to provide an inspection device capable of easily inspecting a true shape.
［課題を解決するための手段］ 第１図は本発明の原理構成を示す図である。第１図に
おいて、１は撮像装置、２はスリット光、３は線状物
体、12は論理演算部、13は線状物体を載置した所定面、
14はデータ格納部、15はデータ比較部、16はデータ格納
手段、17はデータ処理手段、18はスリット光による所定
面上の像を示す。[Means for Solving the Problems] FIG. 1 is a diagram showing the principle configuration of the present invention. In FIG. 1, 1 is an imaging device, 2 is slit light, 3 is a linear object, 12 is a logical operation unit, 13 is a predetermined surface on which the linear object is placed,
Reference numeral 14 is a data storage unit, 15 is a data comparison unit, 16 is a data storage unit, 17 is a data processing unit, and 18 is an image on a predetermined surface by slit light.
線状物体３を撮像したデータにつき光切断法によりそ
の所定面13からの高さを測定する論理演算部12を具備す
る線状物体形状検査装置において、本発明は下記のよう
に構成する。即ち、 該論理演算部12には、互いに平行な２本のスリット光
により所定面上における像の標準間隔を予め格納するデ
ータ格納部14と、次に検査すべき線状物体３について互
いに平行な２本のスリットにより生じた像の間隔を測定
し前述のデータと比較する比較部15と、該比較部15の出
力により所定面13の傾きを補正する補正値を前記データ
格納部14に格納する手段16と、前記格納部・手段14・15
・16の動作を制御する制御手段17とを具備することで構
成する。The present invention is configured as described below in a linear object shape inspection apparatus including a logical operation unit 12 that measures the height of a data of the linear object 3 from a predetermined surface 13 by a light section method. That is, the logical operation unit 12 includes a data storage unit 14 that stores in advance a standard interval of an image on a predetermined plane by two parallel slit lights, and a parallel storage unit 14 for the next linear object 3 to be inspected. A comparison unit 15 that measures the interval between images generated by the two slits and compares the measured data with the above-described data, and a correction value that corrects the inclination of the predetermined surface 13 based on an output of the comparison unit 15 are stored in the data storage unit 14. Means 16 and the storage means / means 14/15
-It comprises a control means 17 for controlling the operation of 16.
［作用］ 線状物体３について二次元画像を撮像装置１により撮
像し、データ格納部14に格納する。また互いに平行な２
本のスリット光を使用する光切断法により線状物体３の
スリット光像２と、所定面13上の像18とにより、線状物
体３の所定面13からの高さと像18の間隔とを測定し、そ
れらデータを格納部14に格納する。次に検査すべき線状
物体３について互いに平行な２本のスリット光を使用し
て所定面上における像18の間隔を測定する。[Operation] A two-dimensional image of the linear object 3 is captured by the image capturing apparatus 1 and stored in the data storage unit 14. 2 parallel to each other
By the slit light image 2 of the linear object 3 and the image 18 on the predetermined surface 13 by the light cutting method using the slit light of a book, the height of the linear object 3 from the predetermined surface 13 and the distance between the images 18 are determined. It measures and stores the data in the storage unit 14. Next, with respect to the linear object 3 to be inspected, two slit lights parallel to each other are used to measure the distance between the images 18 on a predetermined surface.
そしてデータ格納部14を読出したデータと、前記測定
値とを比較部15において比較し、次に処理手段15におい
て所定面13の傾きを求める演算を行う。その値を格納手
段16によりデータ格納部14に格納する。Then, the data read from the data storage unit 14 is compared with the measured value in the comparison unit 15, and then the processing unit 15 performs an operation for obtaining the inclination of the predetermined surface 13. The value is stored in the data storage unit 14 by the storage unit 16.
次に集積回路の他側におけるように線状物体の他側に
ついて光切断法により高さを測定したとき、データ格納
部14から補正値を読出して高さを補正する。それを繰り
返して線状物体の形状を正確に検査することが出来る。Next, when the height of the other side of the linear object is measured by the light section method as on the other side of the integrated circuit, the correction value is read from the data storage unit 14 to correct the height. By repeating this, the shape of the linear object can be inspected accurately.
［実施例］ 第２図乃至第４図は本発明の実施例として、線状物体
を集積回路のボンディングワイヤとし、ダイパッドから
の高さを測定するとき、ダイパッドの傾きにより測定し
た高さを補正することを説明するための図である。第２
図において、21〜25は互いに平行なスリット光を５本、
26はダイパッド、27はリード、28は集積回路チップ、29
はパッド、30はボンディングワイヤ、Ｐ〜Ｔはスリット
光がワイヤ30上に照射した点、U,Vはスリット光22,23が
ダイパッド26上における像を示す。またパッド29の中心
におけるダイパッド26からの垂直線をＺ軸とし、ダイパ
ッド上の原点をＯとする。またダイパッド26上の表面を
延長してＸ軸を考える。第２図に示すスリット光24,25
も互いに平行な２本のスリット光であり、その間隔を
ｗ、照射角をαとすると、図示するようにw/sin αはUV
の間隔と等しい。スリット光21がＺ軸と交わった時のＺ
成分をh0と置く。ΔPAQ,ΔPBQにおいて、下式の関係が
成立する。AQ＝w/sinα BQ＝l2−l1（ここでl2はＱのｘ座標値l1はＰのｘ座標
値） AB＝AQ−BQ,角PAB＝α h1＝h2＝PB＝AB・tanα このようにしてPQ間の距離（高さ）が求められたの
で、同様にQR,RS間の高さを求めることが出来る。[Embodiment] FIGS. 2 to 4 show an embodiment of the present invention in which a linear object is a bonding wire of an integrated circuit, and when the height from a die pad is measured, the height measured by the inclination of the die pad is corrected. It is a figure for explaining what is done. Second
In the figure, 21 to 25 are five slit lights parallel to each other,
26 is a die pad, 27 is a lead, 28 is an integrated circuit chip, 29
Denotes a pad, 30 denotes a bonding wire, P to T indicate points at which the slit light irradiates the wire 30, U and V indicate images of the slit light 22 and 23 on the die pad 26. The vertical line from the die pad 26 at the center of the pad 29 is the Z axis, and the origin on the die pad is O. The X-axis is considered by extending the surface on the die pad 26. Slit light 24,25 shown in Fig. 2
Is two slit lights parallel to each other, and if the interval is w and the irradiation angle is α, w / sin α is UV
Equal to the interval. Z when slit light 21 intersects the Z axis
Put the component as h 0 . In ΔPAQ and ΔPBQ, the following relationship is established. AQ = w / sin α BQ = l 2 −l 1 (where l 2 is the x coordinate value of Q l 1 is the x coordinate value of P) AB = AQ−BQ, angle PAB = α h 1 = h 2 = PB = AB · tanα Since the distance (height) between the PQs has been obtained in this manner, the height between the QR and RS can be similarly obtained.
次にダイパッド26の上面からの高さを求める。ダイパ
ッド26上においてスリット光22が反射し像が得られるた
め、l2−Ｕを求めてH2を計算できる。H2＝（l2−Ｕ）×
tanα H2が求まると、他のスリット光による高さは相対的高さ
h1−h2などが前述のように求められるため、Pl1,Rl3,Sl
4…を求めることができる。Next, the height from the upper surface of the die pad 26 is obtained. Since the slit light 22 is reflected on the die pad 26 to obtain an image, H 2 can be calculated by obtaining l 2 −U. H 2 = (l 2 −U) ×
Once tan α H 2 is obtained, the height due to the other slit light is the relative height.
Since h 1 −h 2 etc. are obtained as described above, Pl 1 , Rl 3 , Sl
You can ask for 4 ...
第３図はダイパッド26が実線のように傾いた場合を、
破線が標準位置を示す。ダイパッド26が実線のように傾
いたとき、U,VがＵ′,V′となったとする。ダイパッド
が反時計廻りに傾いたとき、Ｖ−Ｕ＜Ｖ′−Ｕ′ 逆に時計廻りに傾いたとき Ｖ−Ｕ＞Ｖ′−Ｕ′である。FIG. 3 shows a case where the die pad 26 is inclined as shown by a solid line.
The dashed line indicates the standard position. It is assumed that U and V become U'and V'when the die pad 26 is inclined as shown by the solid line. When the die pad is tilted counterclockwise, VU <V'-U '. When the die pad is tilted clockwise, VU>V'-U'.
したがって上述のようにして、Ｖ′−Ｕ′を求めてＶ
−Ｕと比較することにより、ダイパッドの傾きの方向を
知ることが出来る。Therefore, as described above, V'-U 'is obtained and V
By comparing with -U, the direction of inclination of the die pad can be known.
次に第４図によりダイパッドの傾きを求めることを説
明する。Ｘ軸を正常なダイパッド面として、L1,L2は互
いに平行な２本のスリット光、L3は傾いたダイパッドの
表面の線とする。L2とＸ軸の交点をＫとすると、Ｋの座
標は（L,0）、L2とL3の交点をＭとすると、Ｍの座標は （a/（ａ−ｂ）・L,（ab）／（ａ−ｂ）・Ｌ）である。Next, obtaining the inclination of the die pad will be described with reference to FIG. With the X-axis as a normal die pad surface, L1 and L2 are two slit lights parallel to each other, and L3 is a line of the inclined die pad surface. If the intersection of L2 and X axis is K, the coordinate of K is (L, 0), and the intersection of L2 and L3 is M, the coordinate of M is (a / (ab) L, (ab) / (Ab) .L).
またL1についてＺ＝ax L2についてＺ＝ax−aL L3についてＺ＝bx ただしａ＞b,a＞０ Ｘ軸上のＭ点座標はaL/（ａ−ｂ） であるから、直線L3の傾きｂが大きくなったとき、スリ
ット光の像間隔は広くなり、傾きが小さくなると、間隔
は狭くなる。したがってスリット光の線間隔を測定し
て、標準値と比較すれば傾きを知ることが出来る。Also, for L1 Z = ax L2 Z = ax−aL L3 Z = bx where a> b, a> 0 Since the M point coordinate on the X axis is aL / (ab), the slope b of the straight line L3 is Becomes larger, the slit light image spacing becomes wider, and the smaller the tilt, the narrower the spacing. Therefore, the inclination can be known by measuring the line spacing of the slit light and comparing it with a standard value.
［発明の効果］ このようにして本発明によると、従来は作業者が目視
により行っていた線状物体の三次元形状検査を自動的に
行うことができる。従って、欠陥の見逃しを防止するこ
とが出来て、信頼性が大いに向上する。[Effects of the Invention] As described above, according to the present invention, a three-dimensional shape inspection of a linear object, which has conventionally been performed visually by an operator, can be automatically performed. Therefore, it is possible to prevent the defect from being overlooked, and the reliability is greatly improved.
第１図は本発明の原理構成を示す図、 第２図乃至第４図は本発明の実施例としてダイパッドの
傾きを測定することを説明するための図、 第５図は光切断法により線状物体の高さを検出する装置
の説明図、 第６図は半導体集積回路にボンディングしたワイヤにつ
いての検査を説明するための図である。 ３……線状物体 12……論理演算部 13……所定面 14……データ格納部 15……データ比較部 16……データ格納手段 17……動作制御部FIG. 1 is a diagram showing a principle configuration of the present invention, FIGS. 2 to 4 are diagrams for explaining measuring a tilt of a die pad as an embodiment of the present invention, and FIG. 5 is a line by an optical cutting method. FIG. 6 is an explanatory view of an apparatus for detecting the height of a strip-shaped object, and FIG. 6 is a view for explaining inspection of a wire bonded to a semiconductor integrated circuit. 3 Linear object 12 Logical operation unit 13 Predetermined surface 14 Data storage unit 15 Data comparison unit 16 Data storage unit 17 Operation control unit
───────────────────────────────────────────────────── フロントページの続き (72)発明者 平岡 規之 神奈川県川崎市中原区上小田中1015番地 富士通株式会社内 (72)発明者 ▲塚▼原 博之 神奈川県川崎市中原区上小田中1015番地 富士通株式会社内 (56)参考文献 特開 昭61−264204（ＪＰ，Ａ) 特開 昭63−26509（ＪＰ，Ａ) 特開 平２−51007（ＪＰ，Ａ) 特開 平２−82366（ＪＰ，Ａ) ────────────────────────────────────────────────── ─── Continuation of the front page (72) Noriyuki Hiraoka Inventor Noriyuki Hiraoka 1015 Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture, Fujitsu Limited (72) Inventor ▲ Hiroyuki Tsuka ▼ 1015 Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Fujitsu Stock In-house (56) Reference JP 61-264204 (JP, A) JP 63-26509 (JP, A) JP 2-51007 (JP, A) JP 2-82366 (JP, A) )
Claims (1)
（13）からの高さを撮像する撮像装置（１）と、撮像し
たデータよりその所定面（13）からの高さを測定する論
理演算部（12）を具備する線状物体形状検査装置におい
て、 該論理演算部（12）には、互いに平行な複数本のスリッ
ト光により所定面（13）に生じた像の標準間隔を予め格
納するデータ格納部（14）と、 検査すべき線状物体（３）について互いに平行な複数本
のスリット光により所定面（13）上に生じた像の間隔を
測定し前述のデータと比較する比較部（15）と、 該比較部（15）の出力により所定面（13）の傾きを補正
する補正値を前記データ格納部（14）に格納する手段
（16）と、 前記格納部・手段（14）（15）（16）の動作を制御する
制御手段（17）とを具備し、前記比較部（15）の出力に
より、撮像した高さデータを補正し、線状物体の高さを
検出すること を特徴とする線状物体の形状検査装置。An imaging device (1) for imaging the height of a linear object (3) from a predetermined surface (13) by a light-section method, and determining the height from the predetermined surface (13) based on the imaged data. In a linear object shape inspection apparatus equipped with a logical operation unit (12) for measuring, the logical operation unit (12) has a standard interval of images generated on a predetermined surface (13) by a plurality of slit lights parallel to each other. And a data storage unit (14) for preliminarily storing the distance between the images formed on the predetermined surface (13) of the linear object (3) to be inspected by a plurality of slit lights parallel to each other. A comparing unit (15) for comparing, a means (16) for storing a correction value for correcting a tilt of the predetermined surface (13) based on an output of the comparing unit (15) in the data storage unit (14); A control means (17) for controlling the operation of the means (14) (15) (16), and the comparison section (15) Output, the corrected height data captured, linear object shape inspection apparatus, characterized by detecting the height of the linear object.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1073845A JP2669685B2 (en) | 1989-03-28 | 1989-03-28 | Inspection equipment for linear objects |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1073845A JP2669685B2 (en) | 1989-03-28 | 1989-03-28 | Inspection equipment for linear objects |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02253110A JPH02253110A (en) | 1990-10-11 |
| JP2669685B2 true JP2669685B2 (en) | 1997-10-29 |
Family
ID=13529886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1073845A Expired - Fee Related JP2669685B2 (en) | 1989-03-28 | 1989-03-28 | Inspection equipment for linear objects |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2669685B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07113531B2 (en) * | 1990-11-06 | 1995-12-06 | 株式会社ミツトヨ | Coordinate conversion method of measuring device |
| JP6014572B2 (en) * | 2013-11-06 | 2016-10-25 | Ｊｆｅスチール株式会社 | Thickness measuring device, thickness measuring method and corrosion depth measuring method |
| JP6249041B2 (en) * | 2016-04-18 | 2017-12-20 | トヨタ自動車株式会社 | Suspension system |
| CN116313940B (en) * | 2023-05-18 | 2023-08-11 | 上海聚跃检测技术有限公司 | Cutting method and auxiliary cutting device for wire bonding structure |
-
1989
- 1989-03-28 JP JP1073845A patent/JP2669685B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02253110A (en) | 1990-10-11 |
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