JPH02284028A - Two-way type infrared sensor - Google Patents
Two-way type infrared sensorInfo
- Publication number
- JPH02284028A JPH02284028A JP1105372A JP10537289A JPH02284028A JP H02284028 A JPH02284028 A JP H02284028A JP 1105372 A JP1105372 A JP 1105372A JP 10537289 A JP10537289 A JP 10537289A JP H02284028 A JPH02284028 A JP H02284028A
- Authority
- JP
- Japan
- Prior art keywords
- infrared sensor
- attached
- fitted
- rooms
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 230000003287 optical effect Effects 0.000 claims abstract description 12
- 230000002457 bidirectional effect Effects 0.000 claims description 12
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 2
- 238000001514 detection method Methods 0.000 abstract description 6
- 238000000638 solvent extraction Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 101150073536 FET3 gene Proteins 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Radiation Pyrometers (AREA)
- Geophysics And Detection Of Objects (AREA)
- Burglar Alarm Systems (AREA)
- Fire-Detection Mechanisms (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は侵入警報器等に使用される人体検知用赤外線セ
ンサに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an infrared sensor for human body detection used in intruder alarms and the like.
[従来の技術]
11人警報益に用いられている赤外線センサは、LiT
a0.、PZT等の焦電効果をもたらす焦電物質を利用
したものである。[Prior art] The infrared sensor used for the 11-person alarm is LiT.
a0. , PZT and other pyroelectric substances that produce a pyroelectric effect are used.
第2図に赤外線センサの構成要素を示す。焦電体上に形
成された2つのエレメントI−a、 l −bを逆極
性でシリーズに接続し、焦電素子から得られた信号をバ
イアス抵抗2、FET3を介してソース端子3から出力
される。4はFETのドレイン端子と接続されており、
FETを作動させるt:めの電圧を供給している。これ
等の部品は赤外線選択透過フィルター7と金属ケース8
によって密閉されている。グランド端子6は4tt@ケ
ースとt気的に接続され、外米を磁波に対しt気的にシ
ールドされている。Figure 2 shows the components of the infrared sensor. Two elements I-a and l-b formed on the pyroelectric body are connected in series with opposite polarity, and the signal obtained from the pyroelectric element is outputted from the source terminal 3 via the bias resistor 2 and FET 3. Ru. 4 is connected to the drain terminal of the FET,
A voltage of t to activate the FET is supplied. These parts are the infrared selective transmission filter 7 and the metal case 8.
is sealed by. The ground terminal 6 is electrically connected to the case, and the outer surface is electrically shielded from magnetic waves.
これ等の部品を実際に赤外線センサとして組み立てた代
表的な構造を第3図に示す。セラミック基板9の受光部
側に焦tl+loが支持台11によって支持されている
。エレメント1−a、 1−bl−c、 1−dは
焦電体10の上に形成されている。FIG. 3 shows a typical structure in which these parts are actually assembled into an infrared sensor. A focus tl+lo is supported by a support stand 11 on the light receiving section side of the ceramic substrate 9. Elements 1-a, 1-bl-c, and 1-d are formed on the pyroelectric body 10.
セラミンク基板9の配線面側にはFET3、バイアス抵
抗2等が取り付けられ、第4図の回路に従って接続され
ている。端子・1.56はリードピン12が用いられる
。リードピン12はステム】3とガラス封止され、ステ
ム13は選択透過フィルター8が接着剤を用いて取り付
けられたカン14とt気溶接されている。A FET 3, a bias resistor 2, etc. are attached to the wiring surface side of the ceramic substrate 9, and are connected according to the circuit shown in FIG. Lead pin 12 is used for terminal 1.56. The lead pin 12 is glass-sealed to the stem 3, and the stem 13 is welded to a can 14 to which the selective transmission filter 8 is attached using adhesive.
このような従来型赤外線センサは、第3図からも判るよ
うに一方向に対して入射する赤外線しか検知することが
できない。第4図において24゜25は2つの独立した
室を示し、26は赤外線センサ、27はレンズを示す。As can be seen from FIG. 3, such a conventional infrared sensor can only detect infrared rays incident in one direction. In FIG. 4, reference numerals 24 and 25 indicate two independent chambers, 26 an infrared sensor, and 27 a lens.
従って警戒すべき全ての室に少なくとも1台の赤外線セ
ンサが必要であった。Therefore, at least one infrared sensor was required in every room to be monitored.
[発明が解決しようとする問題点]
本発明は、全ての室に少なくとも1台の赤外線センサを
要する現在の警戒方式を簡素化するために、2つの室を
同時に検知可能な双方向型赤外線センサを提供するもの
である。[Problems to be Solved by the Invention] The present invention provides a two-way infrared sensor that can detect two rooms simultaneously, in order to simplify current warning systems that require at least one infrared sensor in every room. It provides:
[問題を解決するための手段]
少なくと61つの開口を有する絶縁性基板において、開
口部の一方に光学フィルター、他方にイ、へTL素子、
その他の周辺部品を取り付け、別の光学フィルターを取
り付けた導電性ケースによってこれ等の部品を密閉した
構造をとることにより、基板の両方向からエレメントに
赤外線が入射するようにしたことを特徴とするものであ
る。[Means for solving the problem] In an insulating substrate having at least 61 openings, an optical filter is placed in one of the openings, a TL element is placed in the other side,
A device characterized by attaching other peripheral components and sealing these components with a conductive case to which another optical filter is attached, so that infrared rays can enter the element from both directions of the board. It is.
又、光学フィルターを基板の開口部に取り付けず、光学
フィルターを取り付けた2つの導電性ケースによって基
板を挟むように取り付けた構造をとることもできる。そ
の時、焦電素子は基板の片方に取る付けることら、又両
方に取り付けることもできるため、第2図に示した回路
が1回路のみならず2回路、或はそれ以上構成すること
も可能であり、アレイ素子化として拡張することにも本
発明は有効である。Alternatively, a structure may be adopted in which the optical filter is not attached to the opening of the substrate, but is attached so that the substrate is sandwiched between two conductive cases to which the optical filter is attached. At that time, the pyroelectric element can be attached to one side of the board or to both, so it is possible to configure not only one circuit but two or more circuits as shown in Figure 2. Therefore, the present invention is also effective when expanded as an array element.
[作用]
従って、従来型赤外線センサは1方向からの赤外線しか
取り込むことができなかった。[Function] Therefore, the conventional infrared sensor could only capture infrared rays from one direction.
−かし、本発明による双方向型赤外線センサはG6米の
赤外線セン什の受光面に対し、背面からの赤タト線ら入
光するようにしたことによ;フ、双方向検知が可能とな
った。これにより従来2つの室に別々に2台の浸入警報
器が必要であったが、2つの室を仕切る壁に本双方向型
赤外線センサを取り付けることにより、1台の警報器で
2つの室と同時に警戒することが可能となった。-However, the bidirectional infrared sensor according to the present invention allows light to enter the light receiving surface of the G6 infrared sensor from the red line from the back; therefore, bidirectional detection is possible. became. As a result, two separate intrusion alarms were required for the two rooms, but by installing this two-way infrared sensor on the wall that separates the two rooms, one alarm can be installed in the two rooms. At the same time, it became possible to be cautious.
[実施例]
以下、本発明における双方向型赤外線センサの一実施例
を第1図を用いて説明する。[Example] Hereinafter, an example of the bidirectional infrared sensor according to the present invention will be described with reference to FIG.
15はセラミック基1反、プリント基板等のt気#8縁
性基板を示す。この基板の1部に図のような表裏貫通し
た穴】7を設け、その片方に、又は両面に第4閏で示す
配線パターン16を形成する。Reference numeral 15 indicates a ceramic substrate and a #8 edge board such as a printed circuit board. A hole 7 penetrating the front and back as shown in the figure is provided in a part of this substrate, and a wiring pattern 16 shown by a fourth bolt is formed on one or both sides of the hole.
この配線パターンは、セラミック基板の場合はAgプリ
ント基板の場合はCu又はA1が用いられる。又ぜ・要
な場合、その表面にレジストパターンが形成される。そ
して、基板15に設けられた穴17の片方に焦電体10
を取り付け、この焦電体lOの片面にエレメントI−a
、 1−b、及びその他面に1−c、 I−dが形
成されている。Ia、1−b、1−c、l−dは第2図
と同じ接続が成されている。For this wiring pattern, in the case of a ceramic substrate, Cu or A1 is used in the case of an Ag printed circuit board. Again, if necessary, a resist pattern is formed on the surface. A pyroelectric material 10 is placed in one of the holes 17 provided in the substrate 15.
is attached, and element I-a is attached to one side of this pyroelectric body lO.
, 1-b, and 1-c and I-d are formed on the other surfaces. Ia, 1-b, 1-c, and ld are connected in the same way as in FIG.
又FET3及びバイアス抵抗2(図示していない)は、
穴】7以外の基板上に配置されている。In addition, FET3 and bias resistor 2 (not shown) are
hole] is placed on a board other than hole 7.
光学フィルター8は、1つは基板の開口部に直接取り付
けられ、もう1つは導電ケース14に取り付けられてい
る。焦を素子・FET等の部品は、導電ケース14と開
口部に取り付けられた光学フィルターによって密閉され
ている。One of the optical filters 8 is attached directly to the opening of the substrate, and the other is attached to the conductive case 14. Components such as the optical element and FET are sealed by a conductive case 14 and an optical filter attached to the opening.
このような構造において、赤外線は基板の両方向からエ
レメントに入光させることができる。】−a、1−b、
1−c、1−dの4つのエレメントは赤外線を効率よく
吸収するようN 1−Cr。In such a structure, infrared radiation can be incident on the element from both directions of the substrate. ]-a, 1-b,
The four elements 1-c and 1-d are made of N 1-Cr to efficiently absorb infrared rays.
Cr簿の薄膜を蒸着等によって形成する必要がある。It is necessary to form a thin film of Cr by vapor deposition or the like.
第5図は2つの囲まれた室19.20を示し、その間は
壁21で仕切られている。従って、この壁の一部に本双
方向型赤外線センサ22を取りflけ、その両側にレン
ズ23を設ければ1図のように1台で2つの室の同時警
戒が可能となる。FIG. 5 shows two enclosed chambers 19, 20, separated by a wall 21. Therefore, by installing the bidirectional infrared sensor 22 on a part of this wall and installing lenses 23 on both sides, it is possible to monitor two rooms simultaneously with one device as shown in Figure 1.
ス第1図では、絶縁性基板15の片面のみ構成部品を取
り付けた構造を示したが、第6図で示すように、絶縁性
基板15の両面にそれぞれ焦電素子、FET等の構成部
品を取り付は左右から入射する赤外線の信号を独立に引
き出すことも可能である。この場合、開口部には2つの
焦電素子を取り付は光学フィルターを取り付けた2つの
導電性ケースによって各部品を密閉する。Although FIG. 1 shows a structure in which components are attached only to one side of the insulating substrate 15, as shown in FIG. The installation also allows for independent extraction of infrared signals incident from the left and right sides. In this case, two pyroelectric elements are attached to the opening, and each component is sealed by two conductive cases to which an optical filter is attached.
図中の各番号は、第1図の各番号と対応している。もち
ろん基捜の片方の面に構成する回路は。Each number in the figure corresponds to each number in FIG. 1. Of course, there is the circuit that is configured on one side of Motoso.
デュツアルツイン(2回路)、又はそれ以上の回路を構
成することも可能である。It is also possible to configure a dual twin (two circuits) or more circuits.
さらに第7図で示すように、1枚の絶縁性基板の上に、
2個以上の導tf!Eケースを取り付けた双方向へ“1
赤外線アレノセンサも容易に構成できる。Furthermore, as shown in Figure 7, on one insulating substrate,
2 or more lead tf! “1” to both directions with E-case attached.
An infrared alleno sensor can also be easily constructed.
し効果]
以上説明してきt:ように、従来2つの室に少なくとら
】台づつの検知器が必要であったが、本発明における双
方向型赤外線センサを用いることによって、1台の検知
器で2つの室を同時に警戒することが可能となっ゛た。As explained above, in the past, at least one detector was required in two rooms, but by using the bidirectional infrared sensor of the present invention, one detector can be used. It became possible to guard two rooms at the same time.
又、本双方向型赤外センサは、方向検知、自動ドア等、
様々な用途において従来とは異なった概念により用いる
ことができ、今後の赤外線センサの用途拡大に大いに貢
献することが予測される。In addition, this bidirectional infrared sensor can be used for direction detection, automatic doors, etc.
It can be used in a variety of applications with a concept different from conventional ones, and is expected to greatly contribute to expanding the applications of infrared sensors in the future.
第1図は本発明における双方向型赤外線センサの一実施
例を示した構造図、第2図は赤外線センサの電気回路図
、第3図は従来の赤外線センサの構造図、第4図は従来
の赤外線センサを用いた検知方式を示した図、第5図は
本発明における双方向型赤外線センサを用いた検知方式
を示した閃、第6図は本発明における双方向型赤外線セ
ンサの他の実施例を示した構造図、第7図は本発明にお
ける双方向型赤外綿センサをアレイ化した外観図を示す
。Fig. 1 is a structural diagram showing an embodiment of a bidirectional infrared sensor according to the present invention, Fig. 2 is an electric circuit diagram of the infrared sensor, Fig. 3 is a structural diagram of a conventional infrared sensor, and Fig. 4 is a conventional infrared sensor. 5 is a diagram showing a detection method using a bidirectional infrared sensor according to the present invention, and FIG. 6 is a diagram showing a detection method using a bidirectional infrared sensor according to the present invention. FIG. 7 is a structural diagram showing an embodiment, and an external view of an array of bidirectional infrared cotton sensors according to the present invention.
Claims (1)
は両面に、導体配線パターンを形成し、開口部の一方に
光学フィルターを装着し、他方に焦電素子と周辺の電子
部品を配置付けた後、別の光学フィルターを取り付けた
、少なくとも1つの導電性ケースによってこれ等の部品
を密閉すべく取り付けたことを特徴とする双方向型赤外
線センサ。 2 少なくとも1つの開口を有する絶縁性基板の片面又
は両面に、導体配線パターンを形成し、開口部に焦電素
子を取り付け、その他の部分に電子部品を配置付けた後
、光学フィルターを取り付けた少なくとも2つの導電性
ケースによって、これ等の部品を基板の両面から密閉す
べく取り付けたことを特徴とする双方向型赤外線センサ
。[Claims] 1. A conductor wiring pattern is formed on one or both sides of an insulating substrate having at least one opening, an optical filter is attached to one of the openings, and a pyroelectric element and peripheral electronic components are attached to the other side. A bidirectional infrared sensor, characterized in that, after the components are arranged, these components are sealed by at least one conductive case, which is equipped with another optical filter. 2. A conductor wiring pattern is formed on one or both sides of an insulating substrate having at least one opening, a pyroelectric element is attached to the opening, electronic components are arranged in other parts, and an optical filter is attached. A bidirectional infrared sensor characterized in that these components are attached to a board so as to be sealed from both sides using two conductive cases.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1105372A JPH02284028A (en) | 1989-04-24 | 1989-04-24 | Two-way type infrared sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1105372A JPH02284028A (en) | 1989-04-24 | 1989-04-24 | Two-way type infrared sensor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02284028A true JPH02284028A (en) | 1990-11-21 |
Family
ID=14405868
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1105372A Pending JPH02284028A (en) | 1989-04-24 | 1989-04-24 | Two-way type infrared sensor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02284028A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06258137A (en) * | 1993-03-04 | 1994-09-16 | Matsushita Electric Ind Co Ltd | Pyroelectric infrared ray sensor |
KR100324794B1 (en) * | 1998-06-02 | 2002-02-20 | 모리시타 요이찌 | Infrared radiation detector and method of manufacturing the same |
JP2011080817A (en) * | 2009-10-06 | 2011-04-21 | Murata Mfg Co Ltd | Infrared detector |
JP2011526368A (en) * | 2008-07-02 | 2011-10-06 | ウステル・テヒノロジーズ・アクチエンゲゼルシヤフト | Device for detecting parameters of filamentous specimens |
WO2012111851A1 (en) * | 2011-02-18 | 2012-08-23 | 日本電気株式会社 | Infrared detection sensor array and infrared detection device |
CN106680885A (en) * | 2016-12-30 | 2017-05-17 | 杭州后博科技有限公司 | Non-maintenance personnel on-tower two-stage detection method and system |
CN108564747A (en) * | 2018-05-25 | 2018-09-21 | 吉林大学 | A kind of " intelligence poultry+" farm's safety alarm system based on pyroelectricity |
-
1989
- 1989-04-24 JP JP1105372A patent/JPH02284028A/en active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06258137A (en) * | 1993-03-04 | 1994-09-16 | Matsushita Electric Ind Co Ltd | Pyroelectric infrared ray sensor |
KR100324794B1 (en) * | 1998-06-02 | 2002-02-20 | 모리시타 요이찌 | Infrared radiation detector and method of manufacturing the same |
JP2011526368A (en) * | 2008-07-02 | 2011-10-06 | ウステル・テヒノロジーズ・アクチエンゲゼルシヤフト | Device for detecting parameters of filamentous specimens |
JP2011080817A (en) * | 2009-10-06 | 2011-04-21 | Murata Mfg Co Ltd | Infrared detector |
WO2012111851A1 (en) * | 2011-02-18 | 2012-08-23 | 日本電気株式会社 | Infrared detection sensor array and infrared detection device |
CN103415758A (en) * | 2011-02-18 | 2013-11-27 | 日本电气株式会社 | Infrared detection sensor array and infrared detection device |
EP2677288A4 (en) * | 2011-02-18 | 2017-12-13 | Nec Corporation | Infrared detection sensor array and infrared detection device |
CN106680885A (en) * | 2016-12-30 | 2017-05-17 | 杭州后博科技有限公司 | Non-maintenance personnel on-tower two-stage detection method and system |
CN108564747A (en) * | 2018-05-25 | 2018-09-21 | 吉林大学 | A kind of " intelligence poultry+" farm's safety alarm system based on pyroelectricity |
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