JPH0228171U - - Google Patents
Info
- Publication number
- JPH0228171U JPH0228171U JP10727088U JP10727088U JPH0228171U JP H0228171 U JPH0228171 U JP H0228171U JP 10727088 U JP10727088 U JP 10727088U JP 10727088 U JP10727088 U JP 10727088U JP H0228171 U JPH0228171 U JP H0228171U
- Authority
- JP
- Japan
- Prior art keywords
- chassis
- closes
- optical sensor
- sensor device
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims 2
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Facsimile Heads (AREA)
Description
第1図〜第9図は本考案の実施例を示すもので
あつて、第1図及び第2図は密着型イメージセン
サを示し、第1図は第2図の―線矢視断面図
、第2図は第1図の―線矢視断面図、第3図
は横蓋の斜視図、第4図はシヤーシの平面図、第
5図及び第6図は他の例による密着型イメージセ
ンサを示し、第5図は第6図の―線矢視断面
図、第6図は第5図の―線矢視断面図、第7
図は他の例による受光素子部の底面図、第8図は
第7図の―線矢視拡大断面図、第9図は第7
図の部分拡大図である。第10図及び第11図は
夫々従来の密着型イメージセンサの分解斜視図で
ある。
なお、図面に示された符号において、1……シ
ヤーシ、1a……シヤーシの側面開口、1b……
シヤーシの底面開口、3……LEDアレイ、5…
…セルフオツクレンズアレイ、6,6A……透明
基板、6B……駆動回路用基板、7……受光素子
、12……駆動用ICチツプ、16,17,26
,27……横蓋、16a,17a,26a,27
a……横蓋本体、16b,16c,17b,17
c,26b,26c,27b,27c……横蓋折
曲部、18……裏蓋、19……ボルトである。
1 to 9 show embodiments of the present invention, in which FIGS. 1 and 2 show a contact type image sensor, and FIG. 1 is a sectional view taken along the line - in FIG. Fig. 2 is a sectional view taken along the line - - of Fig. 1, Fig. 3 is a perspective view of the side cover, Fig. 4 is a plan view of the chassis, and Figs. 5 and 6 are other examples of contact type image sensors. , FIG. 5 is a cross-sectional view taken along the line arrow in FIG. 6, FIG.
The figure is a bottom view of a light-receiving element section according to another example, FIG.
It is a partially enlarged view of the figure. 10 and 11 are exploded perspective views of conventional contact type image sensors, respectively. In addition, in the symbols shown in the drawings, 1... Chassis, 1a... Chassis side opening, 1b...
Chassis bottom opening, 3... LED array, 5...
...Self-occurrence lens array, 6, 6A... Transparent substrate, 6B... Drive circuit board, 7... Light receiving element, 12... Drive IC chip, 16, 17, 26
, 27... Side lid, 16a, 17a, 26a, 27
a... Side lid body, 16b, 16c, 17b, 17
c, 26b, 26c, 27b, 27c... side cover bent portion, 18... back cover, 19... bolt.
Claims (1)
このシヤーシの側面開口を塞ぐ横蓋と、前記シヤ
ーシの底面開口を塞ぐ裏蓋とを有する光センサ装
置において、前記横蓋と前記裏蓋とが共通の固定
具によつて前記シヤーシに固定されていることを
特徴とする光センサ装置。 a chassis that supports at least the light receiving element portion;
In this optical sensor device having a side cover that closes a side opening of the chassis and a back cover that closes a bottom opening of the chassis, the side cover and the back cover are fixed to the chassis by a common fixture. An optical sensor device characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10727088U JPH0228171U (en) | 1988-08-12 | 1988-08-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10727088U JPH0228171U (en) | 1988-08-12 | 1988-08-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0228171U true JPH0228171U (en) | 1990-02-23 |
Family
ID=31341531
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10727088U Pending JPH0228171U (en) | 1988-08-12 | 1988-08-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0228171U (en) |
-
1988
- 1988-08-12 JP JP10727088U patent/JPH0228171U/ja active Pending
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