JPH02281071A - Unsaturated polyester resin composition - Google Patents
Unsaturated polyester resin compositionInfo
- Publication number
- JPH02281071A JPH02281071A JP10166889A JP10166889A JPH02281071A JP H02281071 A JPH02281071 A JP H02281071A JP 10166889 A JP10166889 A JP 10166889A JP 10166889 A JP10166889 A JP 10166889A JP H02281071 A JPH02281071 A JP H02281071A
- Authority
- JP
- Japan
- Prior art keywords
- unsaturated polyester
- polyester resin
- resin composition
- curing
- vinyl monomer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920006337 unsaturated polyester resin Polymers 0.000 title claims abstract description 28
- 239000000203 mixture Substances 0.000 title description 16
- 239000000178 monomer Substances 0.000 claims abstract description 10
- 229920006305 unsaturated polyester Polymers 0.000 claims abstract description 10
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 10
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 10
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 8
- 125000005843 halogen group Chemical group 0.000 claims abstract description 7
- 125000004956 cyclohexylene group Chemical group 0.000 claims abstract description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 4
- 239000011342 resin composition Substances 0.000 claims abstract 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims 2
- -1 maleinimide compound Chemical class 0.000 abstract description 19
- 238000002156 mixing Methods 0.000 abstract description 8
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 abstract description 5
- 150000001350 alkyl halides Chemical class 0.000 abstract description 2
- 150000004985 diamines Chemical class 0.000 abstract description 2
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 abstract description 2
- 150000003141 primary amines Chemical class 0.000 abstract description 2
- 150000003512 tertiary amines Chemical class 0.000 abstract description 2
- 125000001302 tertiary amino group Chemical group 0.000 abstract description 2
- 229910052736 halogen Inorganic materials 0.000 abstract 2
- 150000002367 halogens Chemical class 0.000 abstract 1
- 238000001723 curing Methods 0.000 description 19
- 238000006243 chemical reaction Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 5
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 4
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000002216 antistatic agent Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004412 Bulk moulding compound Substances 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- 239000003677 Sheet moulding compound Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 239000007870 radical polymerization initiator Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229940058015 1,3-butylene glycol Drugs 0.000 description 1
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 235000019437 butane-1,3-diol Nutrition 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 238000009787 hand lay-up Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000005457 ice water Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- INQOMBQAUSQDDS-UHFFFAOYSA-N iodomethane Chemical compound IC INQOMBQAUSQDDS-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- UDGSVBYJWHOHNN-UHFFFAOYSA-N n',n'-diethylethane-1,2-diamine Chemical compound CCN(CC)CCN UDGSVBYJWHOHNN-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- AUHHYELHRWCWEZ-UHFFFAOYSA-N tetrachlorophthalic anhydride Chemical compound ClC1=C(Cl)C(Cl)=C2C(=O)OC(=O)C2=C1Cl AUHHYELHRWCWEZ-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 238000005292 vacuum distillation Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、硬化時の作業性に優れ、且つ耐熱性及び帯電
防止性等に優れた硬化物を製造する際の原料として有用
な不飽和ポリエステル樹脂組成物に関する。Detailed Description of the Invention <Industrial Application Field> The present invention provides an unsaturated material useful as a raw material for producing a cured product that has excellent workability during curing and has excellent heat resistance, antistatic properties, etc. The present invention relates to a polyester resin composition.
〈従来の技術〉
一般に不飽和ポリエステル樹脂は、例えばガラス繊維又
は無機フィラー等と共に、ラジカル重合開始剤の存在下
、熱又は光により硬化させることにより種々の硬化成形
物が得られることが知られている。具体的には、不飽和
ポリエステル樹脂を用いて、シートモールデイングコン
パウンド(SMC)法やバルクモールディングコンパウ
ンド(BMC)法等の加熱硬化成形方法により自動車部
品、電気部品等が製造され、またハンドレイアップ法や
スプレーアップ法等の常温硬化方法により漁船、浄化槽
、プール壁等が製造されている。<Prior Art> It is generally known that various cured molded products can be obtained from unsaturated polyester resins by curing them with heat or light in the presence of a radical polymerization initiator together with, for example, glass fibers or inorganic fillers. There is. Specifically, automobile parts, electrical parts, etc. are manufactured using unsaturated polyester resin by heat-curing molding methods such as sheet molding compound (SMC) method and bulk molding compound (BMC) method, and hand lay-up. Fishing boats, septic tanks, pool walls, etc. are manufactured using room-temperature curing methods such as the method and the spray-up method.
これらの用途において硬化作業時にはサイクルアップの
ため、出来るだけ硬化速度が速い樹脂又は硬化系が求め
られ、又硬化物にあってはその耐熱性の向上及び帯電防
止性が求められている。In these applications, resins or curing systems that have as fast a curing speed as possible are required for cycle-up during curing operations, and cured products are required to have improved heat resistance and antistatic properties.
従来、不飽和ポリエステル樹脂の硬化速度を速くするた
めには、ラジカル重合開始剤の量を増加させるか又は硬
化温度を上昇させる等の方法が知られているが、該方法
では、得られる硬化物が脆くなる等の問題が生ずる。Conventionally, in order to increase the curing speed of unsaturated polyester resin, methods such as increasing the amount of radical polymerization initiator or raising the curing temperature are known, but with these methods, the resulting cured product This causes problems such as the material becoming brittle.
また硬化物の耐熱性を上昇させるためには、例えば不飽
和ポリエステル樹脂にアリールマレイミド類を添加する
方法や耐熱性の高いフィラーを添加する等の方法(特公
昭47−13058号公報)等が提案されており、一方
硬化物の帯電を防止するには1通常帯電防止剤を配合す
ることが知られている。しかしながら前記フィラーの添
加では、耐熱性の向上が認められるものの、他の特性が
低下し、またアリールマレイミド類を添加する場合、耐
熱性は改善されるが、帯電防止に問題が生ずる。In order to increase the heat resistance of the cured product, methods have been proposed, such as adding arylmaleimides to unsaturated polyester resins or adding fillers with high heat resistance (Japanese Patent Publication No. 13058/1982). On the other hand, in order to prevent the cured product from being charged, it is generally known to add an antistatic agent. However, when the filler is added, although an improvement in heat resistance is observed, other properties are degraded, and when an arylmaleimide is added, although heat resistance is improved, a problem arises in antistatic properties.
更に低分子の帯電防止剤を配合する場合には、経時的に
該帯電防止剤が硬化物からブリードアウトするという欠
点がある。Furthermore, when a low molecular weight antistatic agent is blended, there is a drawback that the antistatic agent bleeds out from the cured product over time.
〈発明が解決しようとする課題〉
本発明の目的は、硬化作業性に優れ、硬化速度が速く、
且つ得られる硬化物の耐熱性が高く、半永久的な帯電防
止性能を有する不飽和ポリエステル樹脂組成物を提供す
ることにある。<Problems to be Solved by the Invention> The objects of the present invention are to provide a material with excellent curing workability, a fast curing speed, and
Another object of the present invention is to provide an unsaturated polyester resin composition whose cured product has high heat resistance and semi-permanent antistatic properties.
〈課題を解決するための手段〉
本発明によれば不飽和ポリエステルと重合性ビニルモノ
マーとを含む不飽和ポリエステル樹脂100重量部に対
し、下記一般式(1)(式中R1及びR2は、夫々水素
原子、ハロゲン原子又はメチル基を表わし、Xは炭素数
1〜6のアルキル基、シクロヘキシレン基、フェニレン
基又は−CH2−0−を表わす。またR1. R4及び
R,は夫々炭素数1〜4の直鎖又は分枝アルキル基を表
わし、Yはハロゲン原子を表わす)で示されるマレイミ
ド化合物を0.2〜20重量部の割合で含有してなる不
飽和ポリエステル樹脂組成物が提供される。<Means for Solving the Problems> According to the present invention, the following general formula (1) (wherein R1 and R2 are each represents a hydrogen atom, a halogen atom or a methyl group, and X represents an alkyl group having 1 to 6 carbon atoms, a cyclohexylene group, a phenylene group or -CH2-0-; and R1.R4 and R each have 1 to 6 carbon atoms. An unsaturated polyester resin composition containing a maleimide compound represented by 4 (representing a straight chain or branched alkyl group, and Y representing a halogen atom) in a proportion of 0.2 to 20 parts by weight is provided.
以下本発明を更に詳細に説明する。The present invention will be explained in more detail below.
本発明の不飽和ポリエステル樹脂組成物は、特定の不飽
和ポリエステル樹脂と、特定のマレイミド化合物とを含
有することを特徴とする。The unsaturated polyester resin composition of the present invention is characterized by containing a specific unsaturated polyester resin and a specific maleimide compound.
本発明に用いる不飽和ポリエステル樹脂は、不飽和ポリ
エステルと重合性ビニルモノマーとを含むものであり、
該不飽和ポリエステルは、例えば無水マレイン酸、フマ
ル酸等の不飽和二塩基酸又は該不飽和二塩基酸及び無水
フタル酸、イソフタル酸、アジピン酸、テトラクロロ無
水フタル酸等の飽和二酸基酸の混合物と、エチレングリ
コール、プロピレングリコール、1,3−ブチレングリ
コール、1,4−ブタンジオール、ジエチレングリコー
ル、ジプロピレングリコール、ネオペンチルグリコール
、ビスフェノールジオキシエチルエーテル等の多価アル
コールとを常法により、好ましくは1:0.5〜2モル
の割合で配合し、例えば窒素雰囲気下、150〜250
℃で縮合させ、好ましくは反応液の酸価が、20〜80
になった時点で反応を終了させることにより得ることが
出来る。また前記ビニルモノマーとしては、例えばスチ
レン、0−クロルスチレン、ビニルトルエン、メタクリ
ル酸メチル、ジアリルフタレート、トリアリルシアヌレ
ート、ジアリルベンゼンホスホネート等を挙げることが
出来、これらは単独又は併用して用いることができる。The unsaturated polyester resin used in the present invention contains an unsaturated polyester and a polymerizable vinyl monomer,
The unsaturated polyester is, for example, an unsaturated dibasic acid such as maleic anhydride or fumaric acid, or the unsaturated dibasic acid and a saturated dibasic acid such as phthalic anhydride, isophthalic acid, adipic acid, or tetrachlorophthalic anhydride. and a polyhydric alcohol such as ethylene glycol, propylene glycol, 1,3-butylene glycol, 1,4-butanediol, diethylene glycol, dipropylene glycol, neopentyl glycol, bisphenol dioxyethyl ether, etc. by a conventional method. Preferably, it is blended in a ratio of 1:0.5 to 2 mol, for example, 150 to 250 mol in a nitrogen atmosphere.
The acid value of the reaction solution is preferably 20 to 80.
It can be obtained by terminating the reaction when the Examples of the vinyl monomer include styrene, 0-chlorostyrene, vinyltoluene, methyl methacrylate, diallyl phthalate, triallyl cyanurate, diallylbenzenephosphonate, etc., and these may be used alone or in combination. can.
本発明において前記不飽和ポリエステル樹脂を調製する
には、前記不飽和ポリエステルを、前記重合性ビニルモ
ノマーに溶解させることにより得ることができる。溶解
させる際の配合割合は、特に限定されるものではないが
、不飽和ポリエステル70〜40重量%、重合性ビニル
モノマー30〜60重量%の割合で配合するのが好まし
い。In the present invention, the unsaturated polyester resin can be prepared by dissolving the unsaturated polyester in the polymerizable vinyl monomer. Although the blending ratio during dissolution is not particularly limited, it is preferable to blend the unsaturated polyester in a ratio of 70 to 40% by weight and the polymerizable vinyl monomer in a ratio of 30 to 60% by weight.
本発明において、マレイミド化合物は、下記−般式(1
)で表わすことができ。In the present invention, the maleimide compound has the following general formula (1
) can be expressed as
式中R□及びR2は、夫々水素原子、ハロゲン原子又は
メチル基を表わし、Xは炭素数1〜6のアルキル基、シ
クロヘキシレン基、フェニレン基又は−CHI Oo−
を表わす。またR、 、 R4及びR7は夫々炭素数1
〜4の直鎖又は分枝アルキル基を表わし、Yはハロゲン
原子を表わす。この際、Xが炭素数7以上、R4及びR
sの炭素数が5以上の場合には、製造が困難となる。前
記一般式(1)で表わされるマレイミド化合物としては
、例えばN−[2−(N’ −ジエチル−N′−メチル
)アンモニウムエチルコマレイミド クロライド、N−
(2−(N’−ジエチル−N′−メチル)アンモニウム
エチルコマレイミド ヨウ化物、N−(3−(N’ −
ジエチル−N′−メチル)アンモニウムプロピルコマレ
イミド ヨウ化物、N−(3−(N’ −ジエチル−N
′−メチル)アンモニウムプロピルコマレイミド クロ
ライド、N−(4−(N’−トリメチル)アンモニウム
シクロヘキシルコマレイミド ブロマイド、N−(4−
(N’−トリメチル)アンモニウムシクロヘキシル)マ
レイミド ヨウ化物、N−(4−(N’トリメチル)ア
ンモニウムフェニルコマレイミドクロライド等を好まし
く挙げることが出来る。該マレイミド化合物は5例えば
無水マレイン酸と。In the formula, R□ and R2 each represent a hydrogen atom, a halogen atom, or a methyl group, and X is an alkyl group having 1 to 6 carbon atoms, a cyclohexylene group, a phenylene group, or -CHI Oo-
represents. In addition, R, , R4 and R7 each have 1 carbon number
-4 represents a straight chain or branched alkyl group, and Y represents a halogen atom. In this case, X has 7 or more carbon atoms, R4 and R
When the number of carbon atoms in s is 5 or more, manufacturing becomes difficult. Examples of the maleimide compound represented by the general formula (1) include N-[2-(N'-diethyl-N'-methyl)ammonium ethylcomaleimide chloride, N-
(2-(N'-diethyl-N'-methyl)ammoniumethylcomaleimide iodide, N-(3-(N'-
Diethyl-N'-methyl)ammoniumpropylcomaleimide iodide, N-(3-(N'-diethyl-N
'-Methyl)ammoniumpropylcomaleimide chloride, N-(4-(N'-trimethyl)ammoniumcyclohexylcomaleimide bromide, N-(4-
Preferred examples include (N'-trimethyl)ammoniumcyclohexyl)maleimide iodide, N-(4-(N'trimethyl)ammoniumphenylcomaleimide chloride, etc.).The maleimide compound is 5, for example, with maleic anhydride.
ジエチルアミノプロピルアミン等の第3級及び第1級ア
ミンからなるジアミンとを反応させ、第3級アミノ基を
含有するマレイミド化合物を調製し。A maleimide compound containing a tertiary amino group is prepared by reacting with a diamine consisting of tertiary and primary amines such as diethylaminopropylamine.
次いでハロゲン化アルキルを付加させ第4級アンモニウ
ム塩基とすることにより調製することができる。It can then be prepared by adding an alkyl halide to form a quaternary ammonium base.
本発明の不飽和ポリエステル樹脂組成物中の前記不飽和
ポリエステル樹脂とマレイミド化合物との配合割合は、
不飽和ポリエステル樹脂100重量部に対してマレイミ
ド化合物を0.2〜20重量部の割合で添加する。マレ
イミド化合物の配合割合が0.2重量部未満ではマレイ
ミド化合物の添加効果、即ち硬化速度の上昇や硬化物の
帯電防止効果が不十分であり、又、マレイミド化合物の
配合割合が0〜20重量部を越えると、硬化物が脆くな
るので前記配合割合とする必要がある。The blending ratio of the unsaturated polyester resin and maleimide compound in the unsaturated polyester resin composition of the present invention is as follows:
The maleimide compound is added in a proportion of 0.2 to 20 parts by weight based on 100 parts by weight of the unsaturated polyester resin. If the blending ratio of the maleimide compound is less than 0.2 parts by weight, the effect of adding the maleimide compound, that is, the increase in curing rate and the antistatic effect of the cured product, will be insufficient, and the blending ratio of the maleimide compound will be 0 to 20 parts by weight. If it exceeds this, the cured product will become brittle, so it is necessary to maintain the above-mentioned mixing ratio.
本発明の不飽和ポリエステル樹脂組成物を調製するには
、例えば不飽和ポリエステルを重合性ビニルモノマーに
溶解させて、不飽和ポリエステル樹脂を得た後1次いで
前記マレイミド化合物を添加溶解することにより得るこ
とが出来る。また前記不飽和ポリエステル樹脂として、
予め不飽和ポリエステルを重合性ビニルモノマーに溶解
した市販品を用いることもでき、更に、ポリエステル樹
脂組成物の保存時の経時安定性を向上させるために、ベ
ンゾキノン、ハイドロキノン等の重合禁止剤を、添加す
ることもできる。また無機フィラー膏剤、ガラス繊維等
の補強剤等を添加してコンパウンドの形態とすることも
できる。The unsaturated polyester resin composition of the present invention can be prepared by, for example, dissolving an unsaturated polyester in a polymerizable vinyl monomer to obtain an unsaturated polyester resin, and then adding and dissolving the maleimide compound. I can do it. Further, as the unsaturated polyester resin,
It is also possible to use a commercially available product in which unsaturated polyester is dissolved in a polymerizable vinyl monomer in advance. Furthermore, in order to improve the stability over time during storage of the polyester resin composition, a polymerization inhibitor such as benzoquinone or hydroquinone may be added. You can also. It is also possible to form a compound by adding an inorganic filler paste, a reinforcing agent such as glass fiber, and the like.
〈発明の効果〉
本発明の不飽和ポリエステル樹脂組成物は、硬化作業性
、特に硬化速度が速いので、サイクルアップすることが
できる。更に本発明の不飽和ポリエスル樹脂組成物を硬
化させて得られる硬化物は、耐熱性が高く、且つ半永久
的な帯電防止性を有するので、二次加工品及び成形品等
を製造する際に粉塵、ゴミ等の付着を防止することもで
きる。<Effects of the Invention> Since the unsaturated polyester resin composition of the present invention has high curing workability, particularly fast curing speed, it can be cycled up. Furthermore, the cured product obtained by curing the unsaturated polyester resin composition of the present invention has high heat resistance and semi-permanent antistatic properties, so it can be used to eliminate dust when producing secondary processed products and molded products. It is also possible to prevent the adhesion of dust, etc.
〈実施例〉
以下本発明を参考例、実施例及び比較例により更に詳細
に説明するが、本発明はこれらに限定されるものではな
い。尚例中の部は重量部を表わす。<Example> The present invention will be described in more detail below with reference to Reference Examples, Examples, and Comparative Examples, but the present invention is not limited thereto. Note that parts in the examples represent parts by weight.
ジメチルホルムアミド100mQ中に無水マレイン酸を
49g溶解した後、氷水浴で反応温度25℃以下となる
ように冷却しながらジエチルアミノエチルアミン58g
を30分間で滴下した。その結果茶色の結晶が得られた
。次いで得られた茶色の結晶に、ハイドロキノンを0.
1g添加して、減圧蒸溜を行なったところ、浴温180
℃において、ジメチルホルムアミドの溜出が、また0、
1mFIg120℃において、ジエチルアミノエチルマ
レイミドが溜出し、その結果融点約30℃の淡黄色固体
が56g得られた。次に得られた淡黄色固体20gを5
0−のアセトニトリルに溶解させ、撹拌下、メチルヨー
ド15gをアセトニトリル20mQに溶解させた溶液を
添加し、25℃で10時間反応させた後、多量のエタノ
ール中に添加し、黄色の固体、即ちN−((2−N’
−ジエチル−N′−メチル)アンモニウムエチルコマレ
イミドヨウ化物(以下AEIと略す)を得た。得られた
AEIの融点は146℃であった。得られた化合物の構
造1名称及び略号を表1に示す。After dissolving 49 g of maleic anhydride in 100 mQ of dimethylformamide, 58 g of diethylaminoethylamine was added while cooling in an ice water bath so that the reaction temperature was 25°C or less.
was added dropwise over 30 minutes. As a result, brown crystals were obtained. Next, 0.0% of hydroquinone was added to the obtained brown crystals.
When 1g was added and vacuum distillation was performed, the bath temperature was 180℃.
℃, the distillation of dimethylformamide is also 0,
At 1 mFIg and 120°C, diethylaminoethylmaleimide distilled out, resulting in 56 g of a pale yellow solid with a melting point of about 30°C. Next, 20g of the pale yellow solid obtained was
A solution of 15 g of methyl iodide dissolved in 20 mQ of acetonitrile was added under stirring to react at 25°C for 10 hours, and then added to a large amount of ethanol to form a yellow solid, i.e., N- ((2-N'
-diethyl-N'-methyl)ammonium ethylcomaleimide iodide (hereinafter abbreviated as AEI) was obtained. The melting point of the obtained AEI was 146°C. Structure 1 names and abbreviations of the obtained compounds are shown in Table 1.
見i旌Iユ主
参考例1の方法に準じて、表1に示すマレイミド化合物
を調製した。得られた化合物の構造、名称及び略号を表
1に示す。According to the method of Reference Example 1, maleimide compounds shown in Table 1 were prepared. Table 1 shows the structures, names and abbreviations of the obtained compounds.
(以下余白)
去W
撹拌機、温度計、窒素ガス吹込み管及びコンデンサーを
備えた4つロフラスコに、無水マレイン酸78部、無水
フタル酸178部及びプロピレングリコール167部を
添加し、窒素ガスを流しながら撹拌し徐々に加熱した。(Left below) 78 parts of maleic anhydride, 178 parts of phthalic anhydride, and 167 parts of propylene glycol were added to a four-bottle flask equipped with a stirrer, thermometer, nitrogen gas blowing tube, and condenser, and nitrogen gas was added. The mixture was stirred and gradually heated under running water.
約1時間かけて150℃まで加熱しその後1時間撹拌を
続けた。徐々に反応温度を上昇させ、210℃に保ち、
縮合水の留出が止まった後1反応液の酸価を測定し、酸
価が40となった時点で反応を終了して冷却し、不飽和
ポリエステルの反応液を得た。次に該反応液にスチレン
モノマー200部と参考例1で調製したAEI20部と
を添加し均一に撹拌した。その後ヒドロキノン0.05
部を添加し淡黄色の不飽和ポリエステル樹脂組成物を得
た。The mixture was heated to 150° C. over about 1 hour, and stirring was continued for 1 hour. Gradually raise the reaction temperature and keep it at 210 ° C.
After distillation of condensed water stopped, the acid value of one reaction solution was measured, and when the acid value reached 40, the reaction was terminated and cooled to obtain an unsaturated polyester reaction solution. Next, 200 parts of styrene monomer and 20 parts of AEI prepared in Reference Example 1 were added to the reaction solution and stirred uniformly. Then hydroquinone 0.05
A pale yellow unsaturated polyester resin composition was obtained.
尖五涯l二土
表2に示す市販の不飽和ポリエステル樹脂(重合性ビニ
ルモノマーとしてスチレンを含む)に。To the commercially available unsaturated polyester resin (containing styrene as a polymerizable vinyl monomer) shown in Table 2.
夫々表2に示す参考例1〜3で得られたマレイミド化合
物を添加、溶解し、不飽和ポリエステル樹脂組成物を調
製した。使用した不飽和ポリエステル樹脂、マレイミド
化合物及びこれらの配合量を表2に示す。The maleimide compounds obtained in Reference Examples 1 to 3 shown in Table 2 were added and dissolved to prepare unsaturated polyester resin compositions. Table 2 shows the unsaturated polyester resin and maleimide compound used, and their blending amounts.
試1」1−二i
実施例1〜4で調製した不飽和ポリエステル樹脂組成物
を用いて表3に示す硬化条件で硬化反応を行い成形物を
作製した。得られた成形物のパーコール硬度をJIS
K−6901に従い測定した。また、同様に120X
12X3mの注形榎を作製し、熱変形温度及び摩擦帯電
圧を測定した。Trial 1" 1-2i Using the unsaturated polyester resin compositions prepared in Examples 1 to 4, a curing reaction was carried out under the curing conditions shown in Table 3 to produce molded products. The Percoll hardness of the obtained molded product is determined by JIS
Measured according to K-6901. Also, similarly 120X
A 12×3 m cast mold was prepared, and the heat deformation temperature and frictional charging voltage were measured.
各測定結果及び硬化条件を表3に示す。Table 3 shows the measurement results and curing conditions.
ル敗に腹五工、1
表3に示すマレイミド化合物を含まない市販の不飽和ポ
リエステル樹脂組成物を用いた以外は。Except that a commercially available unsaturated polyester resin composition containing no maleimide compound shown in Table 3 was used.
表3に示す硬化条件で成形物及び注形板を作製し、試験
例1〜6と同様に各測定を行った。各測定結果及び硬化
条件を表3に示す。Molded products and cast plates were produced under the curing conditions shown in Table 3, and measurements were performed in the same manner as in Test Examples 1 to 6. Table 3 shows the measurement results and curing conditions.
(以下余白)(Margin below)
Claims (1)
飽和ポリエステル樹脂100重量部に対し、下記一般式
( I ) ▲数式、化学式、表等があります▼・・・( I ) (式中R_1及びR_2は、夫々水素原子、ハロゲン原
子又はメチル基を表わし、Xは炭素数1〜6のアルキル
基、シクロヘキシレン基、フェニレン基又は▲数式、化
学式、表等があります▼を表わす。またR_3、R_4
及びR_5は夫々炭素数1〜4の直鎖又は分枝アルキル
基を表わし、Yはハロゲン原子を表わす)で示されるマ
レイミド化合物を0.2〜20重量部の割合で含有して
なる不飽和ポリエステル樹脂組成物。[Claims] For 100 parts by weight of an unsaturated polyester resin containing an unsaturated polyester and a polymerizable vinyl monomer, the following general formula (I) ▲There are mathematical formulas, chemical formulas, tables, etc.▼...(I) ( In the formula, R_1 and R_2 each represent a hydrogen atom, a halogen atom, or a methyl group, and X represents an alkyl group having 1 to 6 carbon atoms, a cyclohexylene group, a phenylene group, or ▲a mathematical formula, a chemical formula, a table, etc.▼. Also R_3, R_4
and R_5 each represent a linear or branched alkyl group having 1 to 4 carbon atoms, and Y represents a halogen atom). Resin composition.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10166889A JPH02281071A (en) | 1989-04-24 | 1989-04-24 | Unsaturated polyester resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10166889A JPH02281071A (en) | 1989-04-24 | 1989-04-24 | Unsaturated polyester resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02281071A true JPH02281071A (en) | 1990-11-16 |
Family
ID=14306750
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10166889A Pending JPH02281071A (en) | 1989-04-24 | 1989-04-24 | Unsaturated polyester resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02281071A (en) |
-
1989
- 1989-04-24 JP JP10166889A patent/JPH02281071A/en active Pending
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