JPH02279782A - Heat-sealable coating material for adhering styrene resin - Google Patents

Heat-sealable coating material for adhering styrene resin

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Publication number
JPH02279782A
JPH02279782A JP10139689A JP10139689A JPH02279782A JP H02279782 A JPH02279782 A JP H02279782A JP 10139689 A JP10139689 A JP 10139689A JP 10139689 A JP10139689 A JP 10139689A JP H02279782 A JPH02279782 A JP H02279782A
Authority
JP
Japan
Prior art keywords
heat
resin layer
acrylic resin
soln
sealable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10139689A
Other languages
Japanese (ja)
Other versions
JP2764212B2 (en
Inventor
Yoshitaka Kawamura
川村 吉孝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
READER KK
Original Assignee
READER KK
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Filing date
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Publication of JPH02279782A publication Critical patent/JPH02279782A/en
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Publication of JP2764212B2 publication Critical patent/JP2764212B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PURPOSE:To obtain the subject material exhibiting excellent heat-sealing properties to a styrene resin container when a covering material such as a metal foil is coated with this coating and forming a heat-sealing resin layer peelable at an interface between the heat-sealing resin layer and the container or an interface between said resin layer and the covering material when the covering is peeled off by adding a specified amt. of an inorg. filler to an acrylic resin soln. CONSTITUTION:The subject coating material is prepared by adding 2 to 25 pts.wt. inorg. filler (e.g. talc powder) based on 100 pts.wt. nonvolatile component of an acrylic resin soln. (e.g. n-butyl acrylate-methyl methacrylate-acrylic acid copolymer soln. in ethyl acetate and toluene) to said soln.

Description

【発明の詳細な説明】 (産業上の利用分¥f) 本発明はプラスチックフィルムや金属箔等の基材に塗布
してスチレン系樹脂に対して良好な熱封緘性を示す熱可
塑性樹脂層を形成し得る被覆剤に関し、更に詳しくは、
特にスチレン系樹脂製包装容器用蓋材としてのアルミニ
ウム箔に塗工することにより高い熱封緘強度を示す熱封
緘性樹脂層を形成することが出来る熱封緘性被覆剤を提
供するものである。
[Detailed description of the invention] (Industrial usage amount ¥f) The present invention provides a thermoplastic resin layer that is applied to a base material such as a plastic film or metal foil and exhibits good heat sealability against styrene resin. More specifically regarding the coating that can be formed,
In particular, the object of the present invention is to provide a heat-sealable coating material that can form a heat-sealable resin layer exhibiting high heat-sealing strength when applied to aluminum foil as a lid material for a styrene-based resin packaging container.

(従来の技術) 従来、封緘用熱板(ヒー1−シール バー)、高周波お
よび超音波等によってのプラスチック容器の蓋材を封緘
させることは広く行われている。その蓋材の一般的な形
態はアルミニウム箔に代表される金属箔、紙や耐熱性プ
ラスチックフィルム或いはそれらの紙やフィルムに金属
蒸着を施したちを基材とし、その一方の面に熱可塑性樹
脂を基本成分とする熱封緘性樹脂層を設けたものである
(Prior Art) Hitherto, it has been widely practiced to seal the lid of a plastic container using a sealing hot plate (heat-seal bar), high frequency waves, ultrasonic waves, or the like. The general form of the lid material is metal foil such as aluminum foil, paper, heat-resistant plastic film, or metal vapor-deposited paper or film as the base material, with thermoplastic resin on one side. A heat-sealable resin layer is provided as a basic component.

また、熱封緘性を向上させるなめに熱封緘性樹脂層と基
材との間に緩衝層としてポリエチレン樹脂層を設けたり
するなどの種々のバリエーションも行われている。他方
の面は一般に文字やデザインが印刷されており、その保
護のために耐熱性の透明な樹脂ワニスを塗工したり、耐
熱性プラスチックフィルムを積層したりされる。
In addition, various variations have been made in order to improve heat sealability, such as providing a polyethylene resin layer as a buffer layer between the heat sealable resin layer and the base material. The other side is generally printed with letters and designs, and to protect it, it is coated with a heat-resistant transparent resin varnish or laminated with a heat-resistant plastic film.

(発明が解決しようとする問題点) プラスチックの中でもスチレン系樹脂を主成分とする容
器を使用し、開口部を蓋材で封緘する所謂、シールパッ
クは食品包装分野を中心にして諸分野に広く使用されて
いるが、それらの蓋材としてはアルミニウム箔に熱封緘
性の接着剤を塗工したものが多く使用されている。
(Problems to be solved by the invention) So-called seal packs, which use containers whose main component is styrene resin among plastics and seal the opening with a lid, are widely used in various fields, mainly in the food packaging field. However, the lid material for these is often aluminum foil coated with a heat-sealing adhesive.

スチレン系樹脂製容器用の蓋材の熱封緘性樹脂層を形成
するための被覆剤の主成分として種々の樹脂系のものが
検討されているが、その中ではアクリル樹脂系のものが
比較的良好な熱封緘性を示すものとして評価されている
Various resin-based materials are being considered as the main component of the coating material for forming the heat-sealable resin layer of the lid material for styrene-based resin containers, but among these, acrylic resin-based materials are relatively popular. It is evaluated as having good heat sealability.

しかしながら、熱封緘強度が必ずしも充分ではなく、改
良が求められているのが実状である。
However, the reality is that the heat sealing strength is not necessarily sufficient, and improvements are required.

(問題を解決するための手段) 本発明者等は種々の樹脂系およびそれらのブレンド系に
ついても検討した結果、本発明の目的であるスチレン系
樹脂製容器用の蓋材の熱封緘性樹脂層を形成するための
被覆剤の主成分としては、従来から認められているよう
にアクリル樹脂系が良好であることがわかった。さらに
アクリル系樹脂に他の系の樹脂をブレンドしたり、接着
促進側を添加したりするなど公知の手段により、場合に
よっては熱封緘強度が若干改良される結果も得られた。
(Means for Solving the Problem) As a result of studying various resin systems and blend systems thereof, the present inventors found that the heat-sealable resin layer of the lid material for styrene resin containers, which is the object of the present invention, It has been found that acrylic resins are suitable as the main component of the coating material for forming the coating material, as has been conventionally recognized. Furthermore, by using known means such as blending other types of resins with the acrylic resin or adding adhesion promoters, results were obtained in which the heat sealing strength was slightly improved in some cases.

しかし、熱封緘強度が向上するとスチレン系樹脂製容器
に熱封緘した蓋材を剥離する場合に蓋材の熱封緘性樹脂
層の凝集破壊を生じる傾向があり、破壊した樹脂層が内
容物を汚染したり、所謂、峰残りと称される容器の縁に
付着残存した樹脂層の断片が容器を食器として使用する
ときに不快感を与えたりするので実用上問題となる。
However, when the heat-sealing strength improves, there is a tendency for cohesive failure to occur in the heat-sealing resin layer of the lid when peeling off the lid that has been heat-sealed to a styrene-based resin container, and the destroyed resin layer contaminates the contents. In addition, fragments of the resin layer remaining attached to the edge of the container, so-called so-called ridges, cause discomfort when the container is used as tableware, which poses a practical problem.

本発明者等は前記の問題点を解決して、スチレン系樹脂
製容器に対する蓋材の熱封緘強度が充分に大きく、しか
も蓋を剥離する際に熱封緘性樹脂層の破壊を生ぜず熱封
緘性樹脂層と容器との界面または熱封緘性樹脂層と蓋材
の基材であるアルミニウム箔との界面で剥離することが
出来る熱封緘性樹脂層@層を形成する熱封緘性被覆剤を
得るべく研究を重ねた結果、アクリル系樹脂溶液を主成
分とする熱封緘性被覆剤のアクリル系樹脂溶液の不揮発
分100部に対し、無機質充填材を2−25部添加する
ことによりスチレン系樹脂製容器の蓋材の熱封緘強度と
して150°C前後の熱封緘温度に対して1 、0 k
g/15m+m以上の強度を常に示し、かつ熱封緘した
蓋材を剥離する時は凝集破壊を生ぜず、界面剥離する熱
封緘性樹脂層を形成し得る熱封緘性被覆剤を与えること
を見い出して本発明に到達したのである。
The present inventors solved the above-mentioned problems and created a lid material that has a sufficiently high heat-sealing strength for a styrene-based resin container, and that can be heat-sealed without causing destruction of the heat-sealing resin layer when the lid is peeled off. To obtain a heat-sealable coating that forms a heat-sealable resin layer that can be peeled off at the interface between the thermoplastic resin layer and the container or the interface between the heat-sealable resin layer and the aluminum foil that is the base material of the lid material. As a result of repeated research, we found that by adding 2 to 25 parts of an inorganic filler to 100 parts of the nonvolatile content of the acrylic resin solution of a heat-sealable coating material whose main component is an acrylic resin solution, it is possible to create a heat sealable coating material made of styrene resin. The heat sealing strength of the container lid material is 1.0 k at a heat sealing temperature of around 150°C.
It has been discovered that a heat-sealable coating material that always exhibits a strength of g/15m+m or more, does not cause cohesive failure when a heat-sealed lid material is peeled off, and can form a heat-sealable resin layer that peels off at the interface. The present invention has been achieved.

本発明に使用されるアクリル系樹脂溶液は公知の製造法
によって得られる。即ち、懸濁重合法、乳化重合法、塊
状型合法等任意の方法によって製造されたアクリル系樹
脂を適当な有機溶媒を選択して溶解するか、または適当
な有機溶媒中でアクリル系樹脂の構成成分の単量体を溶
液重合することによって得られるアクリル系樹脂溶液等
が使用される。
The acrylic resin solution used in the present invention can be obtained by a known manufacturing method. That is, the acrylic resin produced by any method such as suspension polymerization method, emulsion polymerization method, bulk type method, etc. is dissolved in an appropriate organic solvent, or the acrylic resin is formed in an appropriate organic solvent. An acrylic resin solution or the like obtained by solution polymerizing component monomers is used.

アクリル系樹脂の構成成分である単量体は一般にアクリ
ル系樹脂の製造に使用される公知の単量体が使用できる
0代表的なものとしてはC1−18アルキル(メタ)ア
クリレートがあるが、その他の単量体としてスチレン、
アクリロニトリル、酢酸ビニル等共重合性であって単独
重合体の二次転移点が20℃以上程度の硬質単量体や(
メタ〉アクリル酸以外の官能基を有する単量体類、例え
ばイタコン酸、クロトン酸、フマル酸等の重合性カルボ
ン酸、メチロール(メタ)アクリルアミドアルキルエー
テル類、ヒドロキシアルキル(メタ〉アクリレート類、
グリシジル(メタ)アクリレート類等がある。
The monomer that is a constituent component of acrylic resin can be any known monomer that is generally used in the production of acrylic resin. A typical example is C1-18 alkyl (meth)acrylate, but other monomers can be used. Styrene as a monomer,
Copolymerizable hard monomers such as acrylonitrile and vinyl acetate with a homopolymer secondary transition point of about 20°C or higher;
Monomers having functional groups other than meth>acrylic acid, such as polymerizable carboxylic acids such as itaconic acid, crotonic acid, and fumaric acid, methylol (meth)acrylamide alkyl ethers, hydroxyalkyl (meth)acrylates,
Examples include glycidyl (meth)acrylates.

アクリル系樹脂としては特に制約はないが、軟化点の低
過ぎるものはブロッキングを起こす恐れがあるから避け
るべきである。
There are no particular restrictions on the acrylic resin, but those with too low a softening point should be avoided as they may cause blocking.

無機質充填剤としてはは塗料や印刷インキに使用される
公知のものが使用可能であるが、それらの中でも例えば
、無水珪酸、タルク、クレー、沈降性硫酸バリューム、
アルミナ、炭酸カルシウム、亜鉛華等体質顔料と呼ばれ
るものが透明感があるので好ましい、しかし、その他の
有色顔料等も必要により使用することは自由である。
As the inorganic filler, known ones used in paints and printing inks can be used, but among them, for example, silicic anhydride, talc, clay, precipitated sulfuric acid barum,
External pigments such as alumina, calcium carbonate, and zinc white are preferred because of their transparency, but other colored pigments may also be used if necessary.

(作用および効果〉 本発明のスチレン系樹脂接着用熱封緘性被覆剤において
使用する無機質充填材の割合はアクリル系樹脂溶液の不
揮発分100部に対して2−25部の範囲が適当である
(Functions and Effects) The proportion of the inorganic filler used in the heat-sealable coating for styrene resin adhesive of the present invention is suitably in the range of 2 to 25 parts per 100 parts of nonvolatile content of the acrylic resin solution.

無機質充填材の添加量がアクリル系樹脂溶液の不揮発分
100部に対して2部より少ない場合は熱封緘強度が充
分に向上せず、スチレン系樹脂に熱封緘後、剥離すると
きにa2集破壊を生じる傾向も改善されない。また、2
5部を超えると熱封緘温度が上昇して熱封緘が充分に行
われなくなるなめに熱封緘強度が低下する。
If the amount of inorganic filler added is less than 2 parts per 100 parts of non-volatile content of the acrylic resin solution, the heat sealing strength will not be sufficiently improved, and A2 failure will occur when peeling off after heat sealing the styrene resin. The tendency for this to occur is also not improved. Also, 2
If the amount exceeds 5 parts, the heat sealing temperature will rise and heat sealing will not be performed sufficiently, resulting in a decrease in heat sealing strength.

以下、実施例等によってさらに詳細に説明する。Hereinafter, the present invention will be explained in more detail with reference to Examples.

参考例 (アクリル系樹脂溶液Aの製造例) 撹拌機、還流冷却器、滴下漏斗および不活性ガス導入管
を備えた容量1リツトルの四ツロフラスコに次の配合組
成A、B、C,D、EおよびFを仕込み、撹拌を開始し
、不活性ガス導入管より窒素ガスを絹やかに導入して雰
囲気の置換を行う。
Reference example (manufacturing example of acrylic resin solution A) The following compositions A, B, C, D, and E were placed in a 1-liter four-bottle flask equipped with a stirrer, reflux condenser, dropping funnel, and inert gas introduction tube. and F are charged, stirring is started, and nitrogen gas is smoothly introduced from the inert gas introduction tube to replace the atmosphere.

A、  n−ブチルアクリレート   94 OgD 
メチルメタクリレート300.0gCアクリル酸   
        6.OgD 酢酸エチル      
  320.OgD ドルオール        24
0.OgD アゾビスイソブチロニトリル  24g続
いて加熱を開始し、30分間でフラスコの内温を70℃
に到達させ、そのまま70℃に2時間保持する。引き続
いて80℃に昇温して5時間保持した後、90℃まで昇
温させて3時間後、酢酸エチル20.0g、およびドル
オール20.0g、を添加し、冷却してアクリル系樹脂
溶液Aを得た。
A, n-butyl acrylate 94 OgD
Methyl methacrylate 300.0gC acrylic acid
6. OgD ethyl acetate
320. OgD Dollar All 24
0. OgD Azobisisobutyronitrile 24g Next, heating was started and the internal temperature of the flask was raised to 70°C in 30 minutes.
temperature and then held at 70°C for 2 hours. Subsequently, the temperature was raised to 80°C and held for 5 hours, then raised to 90°C for 3 hours, 20.0 g of ethyl acetate and 20.0 g of doluol were added, and the acrylic resin solution was cooled. I got an A.

不揮発分405%、粘度10ボイズであった。The nonvolatile content was 405% and the viscosity was 10 voids.

(アクリル系樹脂溶液Bの製造例) アクリル系樹脂溶液Aの製造例と同様のフラスコに次の
配合組成A、B、C,EおよびFを添加し、撹拌を開始
し、フラスコ内の雰囲気を窒素ガスで置換する。
(Production example of acrylic resin solution B) Add the following compositions A, B, C, E, and F to the same flask as in the production example of acrylic resin solution A, start stirring, and cool the atmosphere inside the flask. Replace with nitrogen gas.

A メチルメタアクリレート  260.OgD スチ
レン          31.0gCメタクリル酸 
        9.OgD 過酸化ベンゾイル   
    3.6gE メチルエチルケトン    30
0.0g。
A Methyl methacrylate 260. OgD Styrene 31.0gC Methacrylic acid
9. OgD benzoyl peroxide
3.6gE Methyl ethyl ketone 30
0.0g.

F ドルオール        2o○、Og。F Doror 2o○, Og.

加熱してフラスコの内温を75°Cに昇温させる9直ち
にD 過酸化ベンゾイル 36g4を別に準備したドル
オール100.0gに溶解させた78液51.8g、を
滴下漏斗から一時に添加して反応を開始し、75℃に2
時間保持した後、80℃に昇温し、10時間保持して反
応を完結させる。この開、80°Cに到達した時点から
5時間を要して、前記の過酸化ベンゾイルのドルオール
溶液の残部51.8gを均等に添加する9反応終了後、
メチルエチルケトン100.Og、を添加し、冷却して
アクリル樹脂ワニスを得る。
Heat to raise the internal temperature of the flask to 75°C 9. Immediately add 51.8 g of solution 78 in which 36 g of benzoyl peroxide 4 was dissolved in 100.0 g of doluol prepared separately from the dropping funnel. Start the reaction and heat to 75°C for 2
After holding for an hour, the temperature was raised to 80°C and held for 10 hours to complete the reaction. After the completion of 9 reactions, the remaining 51.8 g of the doluol solution of benzoyl peroxide was added evenly over a period of 5 hours from the time when the temperature reached 80°C.
Methyl ethyl ketone 100. Og is added and cooled to obtain an acrylic resin varnish.

前記アクリル樹脂ワニスを取り出し、別に調製しfS塩
化ビニル−酢酸ビニル共重合体く米国UCC社製、ビニ
ライトVMCH)の酢酸エチル/メチルエチルケトンく
1対1)混合溶媒の30部溶)浅130Hz、を添加混
合してアクリル系樹脂溶液Bを得た。
The acrylic resin varnish was taken out, and a separately prepared fS vinyl chloride-vinyl acetate copolymer (vinylite VMCH, manufactured by UCC, USA, dissolved in 30 parts of a 1:1 mixed solvent of ethyl acetate/methyl ethyl ketone) was added at a shallow frequency of 130 Hz. By mixing, acrylic resin solution B was obtained.

不揮発分29.8%、粘度11.3ボイズであった。The nonvolatile content was 29.8%, and the viscosity was 11.3 voids.

実施例1 参考例のアクリル系樹脂溶液Aの300gを秤取し、タ
ルク粉末(日本タルク社製;ミクロエースL−1)を2
7.6g、添加、容量800 ccのバッチ式卓上型サ
ンドミルを使用して20分間、分散させて熱封緘性被覆
剤を得た。
Example 1 300 g of acrylic resin solution A of the reference example was weighed out, and 2 g of talc powder (manufactured by Nippon Talc Co., Ltd.; Micro Ace L-1) was weighed out.
A heat-sealable coating was obtained by adding 7.6 g and dispersing for 20 minutes using an 800 cc batch tabletop sand mill.

この熱封緘性被覆剤を厚さ50μの軟質アルミニウム箔
に乾燥塗工量が約5g/ro”になるように塗工し、雰
囲気温度180°Cの乾燥炉中で10秒間加熱乾燥させ
て熱封緘性樹脂層を形成し/、こ塗工アルミニウム箔を
作成した。
This heat-sealable coating was applied to a soft aluminum foil with a thickness of 50 μm to a dry coating amount of approximately 5 g/ro”, and dried by heating for 10 seconds in a drying oven at an ambient temperature of 180°C. A sealing resin layer was formed and a coated aluminum foil was prepared.

次に得られた塗工アルミニウム箔を厚さ0.5間のハイ
インパクトポリスチレン(1−(I P S )シート
(旭ダウ社製、スタイロン#470)に対して、それぞ
れ熱封緘温度130℃、150°Cおよび170℃にお
いて圧力3.0kg/cm2、圧着時間10秒の条件下
で熱封緘を行い、熱封緘強度測定用試料とした。
Next, the obtained coated aluminum foil was applied to a high impact polystyrene (1-(I P S ) sheet (manufactured by Asahi Dow Co., Ltd., Styron #470) with a thickness of 0.5 mm at a heat sealing temperature of 130°C. Heat sealing was performed at 150° C. and 170° C. under conditions of a pressure of 3.0 kg/cm 2 and a crimping time of 10 seconds to prepare a sample for heat sealing strength measurement.

前記熱封緘強度測定用試料′についてオートグラフ(島
津製作所製)を使用して180度制離試験(引張り速度
200謔/min、)を行い、熱封緘温度130°C1
150℃および170°Cに対する強度として、それぞ
れ1.177.1,180および1.220g、/15
随の値を得た。
A 180 degree release test (pulling speed 200 cm/min) was performed on the heat sealing strength measurement sample' using an Autograph (manufactured by Shimadzu Corporation), and the heat sealing temperature was 130°C1.
Strength at 150°C and 170°C: 1.177.1,180 and 1.220g, /15 respectively
I got the value.

また剥離はアルミニウム箔と熱封緘性樹脂層との間で起
こっており、凝集破壊を起こして縁残りを生じる傾向は
全く見られなかった。
Moreover, peeling occurred between the aluminum foil and the heat-sealable resin layer, and there was no tendency at all to cause cohesive failure and leave edge residue.

少なくとも熱封緘温度150℃前後において熱封緘強度
として1 、 OOOg、/15wm以上の値が得られ
れば実用上充分であるとされるから前記の値は満足すべ
きものである。
It is said that it is practically sufficient if a value of 1.00g,/15wm or more is obtained as a heat sealing strength at least at a heat sealing temperature of around 150°C, so the above value should be satisfied.

実施例2 実施例1においてタルク粉末の量を6.0g、に変更し
た以外は全く同様の操作を行い、熱封緘強度測定用試料
について180度剥離試験の結果として熱封緘温度13
0℃、150℃および170℃に対して、それぞれ1.
047.1.173および1 、310 g、/15m
の強度を得た。
Example 2 Exactly the same operation as in Example 1 was performed except that the amount of talc powder was changed to 6.0 g, and as a result of a 180 degree peel test on a sample for heat sealing strength measurement, the heat sealing temperature was 13.
1. for 0°C, 150°C and 170°C, respectively.
047.1.173 and 1, 310 g, /15m
The strength was obtained.

また剥離はアルミニウム箔と熱封緘性樹脂層との間で起
こっており、凝集破壊を起こして縁残りを生じる傾向は
全く見られなかった。
Moreover, peeling occurred between the aluminum foil and the heat-sealable resin layer, and there was no tendency at all to cause cohesive failure and leave edge residue.

比較例1 実施例1においてタルク粉末を本発明の添加量の範囲の
上限を超えて、36.0g、添加した以外は同様の操作
を行った。熱封緘強度測定用試料についての180度剥
離試験の結果は剥離面は全てアルミニウム箔と熱封緘性
樹脂層との間で起こっており、凝集破壊は起こしていな
かったが、熱封緘温度130″C1150°Cおよび1
70℃に対する強度はそれぞれ447.568および6
60g、 /15mの値しか得られなかった。
Comparative Example 1 The same operation as in Example 1 was performed except that 36.0 g of talc powder was added, exceeding the upper limit of the range of addition amount of the present invention. The results of a 180 degree peel test on samples for heat sealing strength measurement showed that all peeling occurred between the aluminum foil and the heat sealable resin layer, and no cohesive failure occurred, but the heat sealing temperature was 130"C1150 °C and 1
The strength at 70°C is 447.568 and 6, respectively.
A value of only 60g/15m was obtained.

比較例2 実施例1においてタルク粉末をてんかせずに同様に操作
を行った。
Comparative Example 2 The same operation as in Example 1 was carried out without stirring the talc powder.

熱封緘強度測定用試料についての180度剥離試験の結
果は、それぞれ熱封緘温度が130°C5150℃およ
び170℃の場合に対して、それぞれ693.840お
よび943 g、/15碓の強度しか得られず、また剥
離は熱封緘性樹脂層内の凝集破壊によって起こっており
剥離面に縁残りが生じていた。
The results of the 180 degree peel test on the samples for heat sealing strength measurement showed that when the heat sealing temperature was 130°C, 5150°C, and 170°C, the strengths were only 693.840 and 943 g/15°C, respectively. Moreover, the peeling occurred due to cohesive failure within the heat-sealable resin layer, leaving edge residue on the peeled surface.

実施例3 実施例1においてアクリル系樹脂溶液Aの代わりに参考
例のアクリル系樹脂溶液8400gを使用し、タルク粉
末の代わりにシリカ粉末(富士デビソン社製;サイロイ
ド#24)6.0g、添加して実施例1と同様に操作し
て熱封緘強度測定用試料を作成した9 前記熱封緘強度測定用試料について実施例1と同様に1
80度剥離試験を行ったが、熱封緘温度130℃、15
0℃および170℃に対する熱封緘強度として、それぞ
れ1,251.1,366および1.420 g、/1
5鴫の値を得た。
Example 3 In Example 1, 8400 g of the acrylic resin solution of the reference example was used instead of acrylic resin solution A, and 6.0 g of silica powder (manufactured by Fuji Davison Co., Ltd.; Cyroid #24) was added instead of talc powder. A sample for measuring heat sealing strength was prepared in the same manner as in Example 1. 9 A sample for measuring heat sealing strength was prepared in the same manner as in Example 1.
An 80 degree peel test was conducted, but the heat sealing temperature was 130℃, 15
Heat seal strength at 0°C and 170°C: 1,251.1,366 and 1.420 g/1, respectively
A value of 5 yen was obtained.

また剥離はアルミニウム箔と熱封緘性樹脂層との間で生
じていた。
Further, peeling occurred between the aluminum foil and the heat sealable resin layer.

実施例4 実施例3において無機質充填剤としてシリカ粉末の代わ
りに沈降性硫酸バリュウム24.0g、を使用した以外
は全く同様にして熱封緘強度測定用試料を得、180度
剥離試験を行い、熱封緘温度130℃、150℃および
170℃の場合に対する強度として、それぞれ1,10
5.1,237および1 、340 g、/15mの値
を得た。
Example 4 A sample for heat sealing strength measurement was obtained in the same manner as in Example 3 except that 24.0 g of precipitated barium sulfate was used instead of silica powder as the inorganic filler, and a 180 degree peel test was conducted. The strength for sealing temperatures of 130°C, 150°C and 170°C is 1 and 10, respectively.
Values of 5.1,237 and 1,340 g,/15m were obtained.

剥離面はアルミニウム箔と熱封緘性樹脂層との間であっ
て縁残りは見られなかった。
The peeled surface was between the aluminum foil and the heat-sealing resin layer, and no edge residue was observed.

実施例5 実施例3において無機質充填剤としてシ1ツカわ)末の
代わりに亜鉛華2号を12.0g、使用した以外は全く
同様にして熱封緘強度測定用試料を1得た。
Example 5 A sample for heat sealing strength measurement was obtained in exactly the same manner as in Example 3 except that 12.0 g of Zinc White No. 2 was used instead of Shitsukawa) powder as the inorganic filler.

180度剥離試験は熱封緘温度130°C1150℃お
よび170°Cに対して強度として、それぞれ1.31
0.1.384および1.417 g、/15mmの値
を得た。
In the 180 degree peel test, the strength was 1.31 at heat sealing temperatures of 130°C, 1150°C, and 170°C, respectively.
Values of 0.1.384 and 1.417 g,/15mm were obtained.

また剥離面はアルミニウム箔と熱封緘性樹脂層との間で
あって熱封緘性樹脂層の凝集破壊番よ見られなかった。
Further, the peeled surface was between the aluminum foil and the heat-sealable resin layer, and no cohesive failure of the heat-sealable resin layer was observed.

株式会社 リーダーLeader Co., Ltd.

Claims (1)

【特許請求の範囲】[Claims] アクリル系樹脂溶液の不揮発分100部(重量部、以下
同様)に対し、無機質充填材を2−25部添加してなる
スチレン系樹脂接着用熱封緘性被覆剤。
A heat-sealable coating for adhesion to styrenic resins, which is made by adding 2 to 25 parts of an inorganic filler to 100 parts (parts by weight, same hereinafter) of non-volatile content of an acrylic resin solution.
JP10139689A 1989-04-20 1989-04-20 Heat sealable coating for styrene resin bonding Expired - Fee Related JP2764212B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10139689A JP2764212B2 (en) 1989-04-20 1989-04-20 Heat sealable coating for styrene resin bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10139689A JP2764212B2 (en) 1989-04-20 1989-04-20 Heat sealable coating for styrene resin bonding

Publications (2)

Publication Number Publication Date
JPH02279782A true JPH02279782A (en) 1990-11-15
JP2764212B2 JP2764212B2 (en) 1998-06-11

Family

ID=14299576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10139689A Expired - Fee Related JP2764212B2 (en) 1989-04-20 1989-04-20 Heat sealable coating for styrene resin bonding

Country Status (1)

Country Link
JP (1) JP2764212B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003082315A (en) * 2001-09-12 2003-03-19 Dainippon Printing Co Ltd Adhesive composition and thermal transfer sheet
WO2003099552A1 (en) * 2002-05-29 2003-12-04 Alcan Technology & Management Ltd. Foil made an aluminum material
JP2006199720A (en) * 2004-12-20 2006-08-03 Riidaa:Kk Heat sealing adhesive and lid material using the adhesive

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003082315A (en) * 2001-09-12 2003-03-19 Dainippon Printing Co Ltd Adhesive composition and thermal transfer sheet
WO2003099552A1 (en) * 2002-05-29 2003-12-04 Alcan Technology & Management Ltd. Foil made an aluminum material
JP2006199720A (en) * 2004-12-20 2006-08-03 Riidaa:Kk Heat sealing adhesive and lid material using the adhesive

Also Published As

Publication number Publication date
JP2764212B2 (en) 1998-06-11

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