JPH0227931B2 - PANERUNOBATSUKONIGOSEIJUSHIBANOITSUTAISEIKEISURUHOHO - Google Patents
PANERUNOBATSUKONIGOSEIJUSHIBANOITSUTAISEIKEISURUHOHOInfo
- Publication number
- JPH0227931B2 JPH0227931B2 JP15175584A JP15175584A JPH0227931B2 JP H0227931 B2 JPH0227931 B2 JP H0227931B2 JP 15175584 A JP15175584 A JP 15175584A JP 15175584 A JP15175584 A JP 15175584A JP H0227931 B2 JPH0227931 B2 JP H0227931B2
- Authority
- JP
- Japan
- Prior art keywords
- panel
- mold
- hole
- synthetic resin
- resin plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920003002 synthetic resin Polymers 0.000 claims description 24
- 239000000057 synthetic resin Substances 0.000 claims description 24
- 239000007788 liquid Substances 0.000 claims description 16
- 238000000465 moulding Methods 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 229920001187 thermosetting polymer Polymers 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 235000015110 jellies Nutrition 0.000 claims description 2
- 239000008274 jelly Substances 0.000 claims description 2
- 239000000243 solution Substances 0.000 description 9
- 229920001817 Agar Polymers 0.000 description 8
- 239000008272 agar Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- 229920003051 synthetic elastomer Polymers 0.000 description 6
- 239000005061 synthetic rubber Substances 0.000 description 6
- 230000007547 defect Effects 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000002344 surface layer Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 241000134916 Amanita Species 0.000 description 1
- 241001474374 Blennius Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- 229920000715 Mucilage Polymers 0.000 description 1
- 241000206572 Rhodophyta Species 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、金属パネルの抜孔に熱硬化性樹脂
液を流し込み、抜孔の中に合成樹脂板を一体に成
形する方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method of pouring a thermosetting resin liquid into a hole in a metal panel and integrally molding a synthetic resin plate into the hole.
（従来技術）
従来のこの方法では、平たい盆状の成形容器の
底にシリコン系の合成ゴム液を張り、その上に金
属製パネルを落とし込んでその抜孔に合成ゴム液
を侵入させ、その状態で合成ゴム液を冷却して固
化することによつて、パネルの抜孔の下部を封じ
る成形型を形成し、次いで抜孔に熱硬化性樹脂液
を流し込み、それを加熱して抜孔に合成樹脂板を
一体成形していた。(Prior art) In this conventional method, a silicone-based synthetic rubber liquid is spread on the bottom of a flat, tray-shaped molded container, a metal panel is dropped onto the bottom, the synthetic rubber liquid enters the holes in the panel, and the synthetic rubber liquid enters the hole. By cooling and solidifying the synthetic rubber liquid, a mold is formed that seals the lower part of the hole in the panel, and then a thermosetting resin liquid is poured into the hole and heated to integrate the synthetic resin plate into the hole. It was being molded.
しかし成形型にこのように合成ゴムを使用する
と、抜孔内周面との密着性が余り良くなく、熱硬
化性樹脂液が抜孔内周面と成形型との間の隙間か
ら裏側へ浸出し、合成樹脂板の成形が不体裁とな
る。特に成形型を２回以上使用すると、同じ型で
鋳造したパネルであつても少しづつ微妙に誤差が
あるため、成形不良が生じやすい。また反覆して
使用されると、温度変化を受けたり化学的に類似
した性質の熱硬化性樹脂液と接触する関係もあつ
て、脆く老化し弾力性を失うため、抜孔内周面と
の密着性が更に悪化し、益々成形不良が著しくな
るので、実際には２〜３回程度の使用が限度であ
つて、合成ゴムの価格とも相俟つて、パネル製品
がコスト高となるという欠点があつた。 However, when synthetic rubber is used in the mold, the adhesion to the inner surface of the hole is not very good, and the thermosetting resin liquid leaks out from the gap between the inner surface of the hole and the mold to the back side. The molding of the synthetic resin plate becomes unsightly. In particular, if a mold is used more than once, even if the panels are cast using the same mold, there will be slight errors, so molding defects are likely to occur. In addition, if it is used repeatedly, it will become brittle and age and lose its elasticity due to temperature changes and contact with thermosetting resin liquid with chemically similar properties. This further deteriorates the properties and the molding defects become more and more significant, so in reality, it can only be used two or three times, and combined with the price of synthetic rubber, the cost of panel products becomes high. Ta.
（発明が解決しようとする問題点）
この発明は上記のような欠点を解決したもの
で、非常に安価な材料によつて成形型を形成し、
その成形型の使用によつてパネルの抜孔に合成樹
脂板を極めて体裁良く成形できる方法を提供する
ことを目的としている。(Problems to be Solved by the Invention) This invention solves the above-mentioned drawbacks by forming a mold using a very inexpensive material.
The object of the present invention is to provide a method of molding a synthetic resin plate into a punched hole in a panel in an extremely attractive manner by using the mold.
（問題点を解決するための手段）
すなわちこの発明は、成形容器の底にゼリー状
物質の溶解液を張り、抜孔付きの金属製パネルの
表面部を下にしてその溶解液に浸漬し、溶解液を
ゼリー化することによつてパネルの抜孔の下部を
封じる成形型を形成し、成形型と組み合うパネル
の抜孔に熱硬化性樹脂液を流し込み、パネルに成
形型を付けたまま熱硬化性樹脂を加熱して硬化さ
せた後、成形型からパネルを抜き取ることをその
要旨とするものである。(Means for Solving the Problems) That is, in this invention, a solution of a jelly-like substance is applied to the bottom of a molded container, and a metal panel with perforations is immersed with its surface side down in the solution. By turning the liquid into a jelly, a mold is formed that seals the lower part of the hole in the panel, and the thermosetting resin liquid is poured into the hole in the panel that will be assembled with the mold, and the thermosetting resin is applied with the mold attached to the panel. The gist of this method is to heat and harden the material, and then remove the panel from the mold.
ゼリー状物質としては、寒天、布海苔、ゼラチ
ン等がある。 Examples of the jelly-like substance include agar, seaweed, and gelatin.
金属製パネルとしては、第１図に示すように、
喫茶店等における明り窓に使用するパネルのほ
か、玄関のスクリーン、欄間、門塀等の飾り窓に
使用するパネル等を挙げることができる。これ等
のパネルは一般的にアルミ合金の鋳物で造られ、
抜孔に明りが通る透明または半透明の合成樹脂板
が形成される。なお合成樹脂板を半透明にする手
段として、表面側に透明板を形成し、その裏側に
半透明板を形成することによつて合成樹脂板を二
重構造にすれば、表側から見てステンドガラス調
に見えるため、飾り用パネルとして体裁が良く適
切である。 As shown in Fig. 1, metal panels include:
In addition to panels used for bright windows in cafes, etc., examples include panels used for entrance screens, transoms, decorative windows such as gate walls, etc. These panels are generally made of aluminum alloy castings,
A transparent or translucent synthetic resin plate is formed that allows light to pass through the punched holes. In addition, as a means to make a synthetic resin board semitransparent, if the synthetic resin board is made into a double structure by forming a transparent plate on the front side and a semitransparent plate on the back side, it will look stained when viewed from the front side. Because it looks like glass, it looks good and is suitable as a decorative panel.
（実施例）
第１図および第２図は喫茶店の明り窓に使用す
るアルミ鋳物製のパネルＰを示したもので、その
パネルＰは、四角枠１の内側に波形の桟２や円形
のリング３を形成することにより形状が異なる多
数の抜孔４を設け、各抜孔４には合成樹脂板７が
形成され、合成樹脂板７は透明な表面層７ａと半
透明な裏面層７ｂとの二重構造になつている。ま
た各抜孔４は成形型５から抜き取りやすいように
内周面にテーパーを付けて表側に広くなつてい
る。なおPaは第３図の如くパネル単独を示す。(Example) Figures 1 and 2 show an aluminum casting panel P used for a light window in a coffee shop. 3, a large number of holes 4 with different shapes are provided, and a synthetic resin plate 7 is formed in each hole 4, and the synthetic resin plate 7 has a double layer of a transparent surface layer 7a and a translucent back layer 7b. It's structured. Further, each punching hole 4 has an inner circumferential surface tapered so that it becomes wider toward the front side so that it can be easily pulled out from the mold 5. Note that Pa indicates a single panel as shown in FIG.
次にこのパネルPaに合成樹脂板７を上記のよ
うに成形する方法を順序を追つて具体的に説明す
る。 Next, a method for molding the synthetic resin plate 7 on the panel Pa as described above will be explained in detail in a step-by-step manner.
成形型５の材料として寒天を使用した。寒天は
テングサ等の紅藻類の粘質物を熱水で浸出させ、
それを冷却してゼリー状に固めたものを天然の寒
気を利用して凍結乾燥したものであるが、これを
使用するときは、まず釜で水と共に加熱して液状
に溶解し、第４図の如くその溶解液６を平たい盆
状の成形容器Ｖに移して浅く張る。そして冷めな
いうちに第５図の如く溶解液６にパネルPaを浸
ける。この場合、パネルPaは表面部を下にして
抜孔４の下部を溶解液６によつて封じ、その上に
凹所８が残るようにするので、この状態になるよ
うに溶解液６は予め計量して容器Ｖに入れられ
る。 Agar was used as the material for the mold 5. Agar is made by leaching the mucilage of red algae such as Amanita with hot water.
It is cooled and solidified into a jelly-like form, which is then freeze-dried using natural cold air.When using this, first, it is heated with water in a pot to dissolve it into a liquid state, as shown in Figure 4. The solution 6 is transferred to a flat tray-shaped molded container V, and the container is spread shallowly. Then, before it cools down, the panel Pa is immersed in the solution 6 as shown in Fig. 5. In this case, the panel Pa is placed with its surface facing down, and the lower part of the hole 4 is sealed with the solution 6, leaving a recess 8 above it, so the solution 6 is measured in advance to achieve this state. and placed in container V.
溶解液６にパネルPaを浸けた後は、溶解液６
を常温でまたは強制的に冷やす。冷えると溶解液
６はゼリー状に固まつて成形型５が形成されるの
で、成形型５にパネルPaを付けたままその抜孔
４上部の凹所８にアミン系の硬化剤を適量配合し
たエポキシ樹脂の透明な液を第６図の如く合成樹
脂板の表面層７ａとして流し込む。次にそのまま
容器Ｖを加熱炉に入れ、加熱炉では40℃で２時間
ほど加熱することによつてエポキシン樹脂液を熱
硬化させる。次に加熱炉から容器Ｖを取り出し、
その中の成形型５からパネルPbを抜き取る。そ
うすると第８図に示すようにパネルPbの抜孔４
に透明な合成樹脂板７ａが形成され、その上に更
に浅い凹所９ができているから、今度はその凹所
９に着色された半透明のエポキシ樹脂液を裏面層
７ｂとして流し込む（第９図）。しかし今度は寒
天の成形型をパネルPcから取り外してある関係
で加熱炉における温度制限は受けないので、パネ
ルPcを加熱炉に入れて80℃の高温度で加熱する
ことによつて１時間の短時間で熱硬化させた後、
加熱炉から出した。 After soaking the panel Pa in the solution 6,
at room temperature or force cooling. When cooled, the solution 6 solidifies into a jelly-like form to form the mold 5, so with the panel Pa attached to the mold 5, fill the recess 8 above the hole 4 with epoxy containing an appropriate amount of an amine curing agent. A transparent liquid resin is poured into a synthetic resin plate as a surface layer 7a as shown in FIG. Next, the container V is put into a heating furnace as it is, and the epoxy resin liquid is thermally cured by heating at 40° C. for about 2 hours in the heating furnace. Next, take out the container V from the heating furnace,
The panel Pb is extracted from the mold 5 therein. Then, as shown in Figure 8, the hole 4 of panel Pb
A transparent synthetic resin plate 7a is formed on the plate 7a, and a shallow recess 9 is formed thereon.Now, a colored translucent epoxy resin liquid is poured into the recess 9 as the back layer 7b (No. 9). figure). However, this time, since the agar mold has been removed from the panel Pc, it is not subject to the temperature restrictions in the heating furnace, so by putting the panel Pc in the heating furnace and heating it at a high temperature of 80℃, it is possible to reduce the temperature by one hour. After heat curing for hours,
Removed from the oven.
この一連の作業により製品としての第１図およ
び第２図の如きパネルＰが得られたが、その抜孔
４には表面層７ａと裏面層７ｂとからなる二重構
造の合成樹脂板７が一体に形成され、アルミ製パ
ネルPaとの結合力については抜孔内周面に対す
る合成樹脂板７の接着力が極めて大きく完全に一
体化されており、しかも樹脂材料が外へ食み出て
いることもなく、成形が非常に良好であつた。 Through this series of operations, a panel P as shown in FIGS. 1 and 2 was obtained as a product, in which a double-structured synthetic resin plate 7 consisting of a surface layer 7a and a back layer 7b was integrally inserted into the punched hole 4. Regarding the bonding force with the aluminum panel Pa, the adhesive force of the synthetic resin plate 7 to the inner peripheral surface of the punched hole is extremely large and completely integrated, and the resin material may protrude outward. The molding was very good.
寒天は40℃では解けないので、合成樹脂板の表
面層７ａの熱硬化中においても成形型５の形状は
保持されているから、成形型５に他のパネルを組
み合わせることによつて反覆使用できる。寒天は
軟かいので、パネルを組み合わせるときは、慎重
に操作する必要がある。しかし寒天は合成樹脂と
は化学的性質が異なり、また氷点より高く寒天の
溶解温度より低い範囲で温度変化があつても性質
が何ら劣化せず、変わらない弾力性を具備する。
そのため新たに他のパネルを組み合わせても、パ
ネルの荷重を接触面で平均して受けることになる
ので、成形型５とパネルの抜孔４内周面との間に
隙間が生ずることなく、慎重に扱えば数十回の使
用によつても成形不良が生じない。また成形型５
に形崩れが生じても、それを加熱して溶解するこ
とによつて再利用できる。 Since agar does not melt at 40°C, the shape of the mold 5 is maintained even during the heat curing of the surface layer 7a of the synthetic resin plate, so it can be used repeatedly by combining other panels with the mold 5. . Agar is soft, so you need to be careful when assembling panels. However, agar has different chemical properties from synthetic resins, and even if there is a temperature change in the range above the freezing point and below the melting temperature of agar, its properties do not deteriorate at all and it maintains its elasticity.
Therefore, even if another panel is newly combined, the load of the panel will be averaged on the contact surface, so there will be no gap between the mold 5 and the inner peripheral surface of the punch hole 4 of the panel. If you handle it, it will not cause molding defects even after being used several dozen times. Also, mold 5
Even if it loses its shape, it can be reused by heating and melting it.
（発明の効果）
この発明は、以上説明した如くであつて、パネ
ルの抜孔に合成樹脂板を成形する方法において成
形型にゼリー状物質を使用するので、成形型を反
覆使用してもそれと抜孔内周面との密着性が非常
に良好であり、熱硬化性樹脂液を抜孔に流し込ん
だ時にそれが裏側に浸出することもないため、合
成樹脂板が抜孔から食み出るような成形不良を防
止できる。また成形型はゼリー状物質が溶解した
水溶液の固まつたもので、表面が極めて滑らかで
あるから、その平滑面によつて合成樹脂板の前面
を非常に滑らかに形成できる。更に成形型を反覆
して使用できるばかりか、溶解して再成形でき、
しかもゼリー状物質はシリコンゴム等と比較して
非常に安価であるので、抜孔に合成樹脂板を一体
成形したパネルを安価に提供し得る等の顕著な効
果がある。(Effects of the Invention) As explained above, this invention uses a jelly-like substance in the mold in the method of molding a synthetic resin plate into the hole in the panel, so even if the mold is used repeatedly, it will The adhesion to the inner circumferential surface is very good, and when the thermosetting resin liquid is poured into the hole, it does not seep out to the back side, which prevents molding defects such as the synthetic resin plate protruding from the hole. It can be prevented. Furthermore, since the mold is made of a hardened aqueous solution containing a jelly-like substance and has an extremely smooth surface, the front surface of the synthetic resin plate can be formed extremely smoothly. Furthermore, not only can the mold be used repeatedly, but it can also be melted and remolded.
Furthermore, since the jelly-like substance is much cheaper than silicone rubber or the like, it has remarkable effects such as being able to provide a panel in which a synthetic resin plate is integrally molded in the hole at a low cost.
図面はこの発明の一実施例を示し、第１図は抜
孔に合成樹脂板を一体成形された飾りパネルの平
面図、第２図は第１図Ａ−Ａ線矢視の断面図、第
３図はパネル単独の断面図、第４図ないし第９図
はパネルの抜孔に合成樹脂板を二重構造に一体成
形する手順を示す断面図である。
Ｖ……成形容器、Ｐ……パネル、４……抜孔、
５……成形型、６……溶解液、７……合成樹脂
板。
The drawings show an embodiment of the present invention, in which FIG. 1 is a plan view of a decorative panel in which a synthetic resin plate is integrally molded into a punched hole, FIG. 2 is a sectional view taken along the line A-A in FIG. 1, and FIG. The figure is a sectional view of the panel alone, and FIGS. 4 to 9 are sectional views showing the procedure for integrally molding a synthetic resin plate into a double structure in the punched hole of the panel. V...molded container, P...panel, 4...pull hole,
5... Molding mold, 6... Solution, 7... Synthetic resin plate.
Claims (1)
り、抜孔付きの金属製パネルの表面部を下にして
その溶解液に浸漬し、溶解液を冷却してゼリー化
することによつてパネルの抜孔の下部を封じる成
形型を形成し、成形型と組み合うパネルの抜孔に
熱硬化性樹脂液を流し込み、パネルに成形型を付
けたまま熱硬化性樹脂を加熱して硬化させた後、
成形型からパネルを抜き取ることを特徴とするパ
ネルの抜孔に合成樹脂板を一体成形する方法。1 A solution of a jelly-like substance is placed on the bottom of a molding container, a metal panel with perforations is immersed in the solution with its surface facing down, and the solution is cooled to form a jelly. A mold is formed to seal the lower part of the punched hole, a thermosetting resin liquid is poured into the punched hole in the panel that will be assembled with the mold, and the thermosetting resin is heated and cured with the mold attached to the panel.
A method of integrally molding a synthetic resin plate into a hole in a panel, which is characterized by extracting the panel from a mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15175584A JPH0227931B2 (en) | 1984-07-20 | 1984-07-20 | PANERUNOBATSUKONIGOSEIJUSHIBANOITSUTAISEIKEISURUHOHO |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15175584A JPH0227931B2 (en) | 1984-07-20 | 1984-07-20 | PANERUNOBATSUKONIGOSEIJUSHIBANOITSUTAISEIKEISURUHOHO |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6129513A JPS6129513A (en) | 1986-02-10 |
| JPH0227931B2 true JPH0227931B2 (en) | 1990-06-20 |
Family
ID=15525582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15175584A Expired - Lifetime JPH0227931B2 (en) | 1984-07-20 | 1984-07-20 | PANERUNOBATSUKONIGOSEIJUSHIBANOITSUTAISEIKEISURUHOHO |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0227931B2 (en) |
-
1984
- 1984-07-20 JP JP15175584A patent/JPH0227931B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6129513A (en) | 1986-02-10 |
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