JPH0227793U - - Google Patents
Info
- Publication number
- JPH0227793U JPH0227793U JP10589488U JP10589488U JPH0227793U JP H0227793 U JPH0227793 U JP H0227793U JP 10589488 U JP10589488 U JP 10589488U JP 10589488 U JP10589488 U JP 10589488U JP H0227793 U JPH0227793 U JP H0227793U
- Authority
- JP
- Japan
- Prior art keywords
- attached
- electronic component
- substrate
- mounting structure
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 1
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10589488U JPH0227793U (US06650917-20031118-M00005.png) | 1988-08-12 | 1988-08-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10589488U JPH0227793U (US06650917-20031118-M00005.png) | 1988-08-12 | 1988-08-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0227793U true JPH0227793U (US06650917-20031118-M00005.png) | 1990-02-22 |
Family
ID=31338915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10589488U Pending JPH0227793U (US06650917-20031118-M00005.png) | 1988-08-12 | 1988-08-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0227793U (US06650917-20031118-M00005.png) |
-
1988
- 1988-08-12 JP JP10589488U patent/JPH0227793U/ja active Pending
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