JPH0227672A - Lead terminal connecting piece for connection and lead terminal connecting method - Google Patents
Lead terminal connecting piece for connection and lead terminal connecting methodInfo
- Publication number
- JPH0227672A JPH0227672A JP17695888A JP17695888A JPH0227672A JP H0227672 A JPH0227672 A JP H0227672A JP 17695888 A JP17695888 A JP 17695888A JP 17695888 A JP17695888 A JP 17695888A JP H0227672 A JPH0227672 A JP H0227672A
- Authority
- JP
- Japan
- Prior art keywords
- piece
- lead terminal
- lead
- connecting piece
- terminal connecting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 8
- 230000001105 regulatory effect Effects 0.000 claims description 14
- 239000000758 substrate Substances 0.000 abstract description 7
- 239000002184 metal Substances 0.000 abstract description 5
- 238000005476 soldering Methods 0.000 abstract description 4
- 238000002360 preparation method Methods 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000006071 cream Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 210000001503 joint Anatomy 0.000 description 2
- 239000003292 glue Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、回路基板上に形成されている固定端子にリ
ード端子を接合する方法及び該接合方法に好適なリード
端子連設片に関するものである。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a method of joining a lead terminal to a fixed terminal formed on a circuit board, and a lead terminal connecting piece suitable for the joining method. be.
（従来技術）
従来のり−・ド端子連接片は、第１図に示すように金属
薄基板連接帯（１）の−側方のみにリード接合片（２）
を櫛歯状に突出形成したものであって、この連接片を用
いて金属ベース回路基板（５）の固定端子（６）にリー
ド端子接合面（３）を接合させる場合、ハンダクリーム
（４）の粘着性を利用して一時的に仮着状態で固定させ
ハンダ付作業を行なっている。(Prior art) As shown in Fig. 1, the conventional glue/de terminal connecting piece has a lead connecting piece (2) only on the negative side of the metal thin board connecting band (1).
When connecting the lead terminal joint surface (3) to the fixed terminal (6) of the metal base circuit board (5) using this connecting piece, the solder cream (4) The adhesive properties of the adhesive are used to temporarily fix the parts and perform soldering work.
この方法では、ハンダクリームの粘着力が接着剤のよう
に強力でないから連接片自体が基板上から脱落したりハ
ンダ付作業中に連接片が動いて位置ズレを生じ易く作業
が容易でない他、各固定端子に対するリード端子接合面
の位置を正確に設定することが困難であった。In this method, the adhesive force of the solder cream is not as strong as that of adhesive, so the connecting piece itself may fall off the board, or the connecting piece may move during the soldering process and become misaligned, making the work difficult. It was difficult to accurately set the position of the lead terminal joint surface with respect to the fixed terminal.
（目的）
本発明は、このような作業の不能率性と不安定な定置性
を改善するためのものであって、連接片の弾性を利用し
てそれ自体に基板クリップ作用を与えて基板に連接片を
挟着支持させると共に連接片に形成されているリード端
子接合面を固定端子に対して自動的に位置設定して接合
作業を機械的に行なえるようにしたものである。(Purpose) The present invention is intended to improve such work impossibility and unstable emplacement, and utilizes the elasticity of the connecting piece to give itself a board-clipping action to attach the board to the board. The connecting piece is clamped and supported, and the lead terminal joining surface formed on the connecting piece is automatically positioned with respect to the fixed terminal, so that the joining work can be performed mechanically.
（構成）
本発明は、導電性金属薄片からなる連接帯の左右にリー
ド片と先端部に接合面を有する接合部片との対を所定間
隔で複数対連設させると共に前記接合部片側に回路基板
の裏面側に当接する位置規制片が連設されて一体的に形
成されてなる接合用リード端子連設片及び回路基板の表
面に形成されている接続用固定端子に対して前記リード
端子連接片の接合面を接触させると並に前記回路基板の
裏面に位置規制片を当接させて前記リード端子連接片を
前記回路基板に挟着支持させた状態で前記接合面と固定
端子とを接合させた後、前記リード片と前記接合部片を
切除するリード端子接合方法である。(Structure) The present invention includes a plurality of pairs of lead pieces and joint pieces each having a joint surface at the tip end arranged in series at a predetermined interval on the left and right sides of a connecting band made of a conductive metal thin piece, and a circuit is formed on one side of the joint part. A joining lead terminal connecting piece integrally formed with a position regulating piece that abuts the back side of the circuit board and a connecting fixed terminal formed on the front surface of the circuit board, the lead terminal connecting piece. When the joint surfaces of the pieces are brought into contact with each other, a position regulating piece is brought into contact with the back surface of the circuit board, and the lead terminal connecting piece is sandwiched and supported by the circuit board, and the joint surface and the fixed terminal are joined. This is a lead terminal joining method in which the lead piece and the joint piece are cut off after the lead piece and the joining piece are removed.
本発明において、位置規制片は接合面又は接合部片と協
彷して基板に対してクリップ作用を発揮するものである
他、接合面を固定端子上に正確に位置させる作用を併有
するものである。In the present invention, the position regulating piece not only exerts a clipping effect on the board by cooperating with the joint surface or the joint part piece, but also has the function of accurately positioning the joint surface on the fixed terminal. be.
位置規制片の位置及び個数は、以下の実施例に示す如く
各接合部片間であってもよいし接合部片群の両側のみで
あってもよい。The position and number of the position regulating pieces may be between each joining piece as shown in the following embodiments, or may be only on both sides of the joining piece group.
また、第５図の如き嵌合定着手段が設けられている場合
は、連接帯の中間部のみであってもよい。Further, if a fitting fixing means as shown in FIG. 5 is provided, it may be provided only at the intermediate portion of the connecting band.
また、接合面部の形状は自由である。Further, the shape of the joint surface portion is free.
（実施例）
第２図以下の図において、（１０）はリード端子連接片
、（１１）は連接帯、（１２）はリード片、（１３）は
リード片と対称的に設けられた接合部片、（１４）は接
合面である。(Example) In the figures below in Figure 2, (10) is a lead terminal connecting piece, (11) is a connecting band, (12) is a lead piece, and (13) is a joint provided symmetrically with the lead piece. Piece (14) is the joint surface.
（１５）は位置規制片であって、位置決め用段部又は肩
部（１６）を介して基板裏面に当接する当接面（１７）
を備えて形成されている。(15) is a position regulating piece, and has a contact surface (17) that contacts the back surface of the board via a positioning step or shoulder (16).
It is formed with
以上の構成を有するリード端子連接片（１０）は基板の
固定端子列設縁に対して、第３図の如く装着される。The lead terminal connecting piece (10) having the above structure is attached to the edge of the fixed terminal array of the board as shown in FIG.
（２０）は回路基板、（２１）は金属板、（２２）は絶
縁層で形成されている基板の表面、（２３）は固定端子
、（２４）は基板の裏面、（２５）は基板の側面である
。(20) is a circuit board, (21) is a metal plate, (22) is the front surface of the board formed of an insulating layer, (23) is a fixed terminal, (24) is the back side of the board, (25) is the board It is a side.
接合面（１４）の間隔は基板上に列設されている固定端
子（２３）の間隔に一致させて形成されていると共に基
板側面に当接する位置規制片の段部（１６）は、接合面
（１４）が固定端子上の望ましい位置に到達するように
形成されている。The spacing between the bonding surfaces (14) is formed to match the spacing between the fixed terminals (23) arranged in a row on the board, and the stepped portion (16) of the position regulating piece that comes into contact with the side surface of the substrate is formed to match the spacing between the bonding surfaces (14). (14) is formed to reach a desired position on the fixed terminal.
また、段部（１６）の高さは装着される基板の厚みを考
慮して設定されることは勿論であって、接合面（１４）
と当接面（１７）との間に充分な挟持力が得られるよう
に設定されている。In addition, the height of the stepped portion (16) is of course set in consideration of the thickness of the board to be mounted, and the height of the stepped portion (16) is
The setting is such that a sufficient clamping force can be obtained between the contact surface (17) and the contact surface (17).
第５図は位置規制片の当接面（１７）に嵌合用突出部（
２７）を構成すると共に基板の裏面に長溝又は凹部（２
８）を穿設して嵌合定着手段とした場合である。この場
合においては位置規制片（１５）の弾性挟持力によって
突出部（２７）が溝又は凹部（２８）に嵌着して突出部
の前縁（２７ａ）及び後縁（２７ｂ）によって、位置規
制片（１５）と接合部片（１３）の長手方向の移動を阻
止するので段部（１６）を基板の側面（２５）に当接さ
せる必要がなくなる。Figure 5 shows the fitting protrusion (
27) and a long groove or recess (27) on the back side of the substrate.
8) is used as a fitting and fixing means. In this case, the protrusion (27) fits into the groove or the recess (28) due to the elastic clamping force of the position regulating piece (15), and the front edge (27a) and rear edge (27b) of the protrusion regulate the position. Since longitudinal movement of the piece (15) and the joint piece (13) is prevented, there is no need for the step (16) to abut against the side surface (25) of the substrate.
更にこの定着手段を設けた構成の連接片においては接合
面（１−４）の数が少ない場合は位置規制片（１５）は
中央の１個所でも充分である。Furthermore, in a connecting piece having a structure in which this fixing means is provided, if the number of joint surfaces (1-4) is small, it is sufficient to have one position regulating piece (15) in the center.
なお、嵌合定着手段としての溝又は突出部の側面形状は
山形、半円形など自由である。Note that the side surface shape of the groove or protrusion serving as the fitting and fixing means may be freely selected, such as a chevron shape or a semicircular shape.
リード端子連接片（１０）を装着した状態で固定端子部
にハンダクリームを塗布してハンダリフロー炉において
ハンダクリームを溶融することによってハンダ（２６）
を残して固化接合することができる。なお、ハンダバス
浸漬法によっても行なえることは勿論である。Solder (26) is applied by applying solder cream to the fixed terminal part with the lead terminal connecting piece (10) attached and melting the solder cream in a solder reflow oven.
can be solidified and bonded by leaving behind. Incidentally, it goes without saying that the solder bath immersion method can also be used.
ハンダ接合が行われた後、接合部片（１３）及びリード
片（１２）を除く不要な部材即ち連接帯＜１１）が位置
規制片（１５）と共には単独で切断除去され、第６図の
如くリード端子が接続されている基板が得られるのであ
る。After the solder joint is performed, unnecessary members other than the joint piece (13) and the lead piece (12), that is, the connecting band <11) are cut and removed alone together with the position regulating piece (15), as shown in FIG. Thus, a substrate to which lead terminals are connected can be obtained.
第７図は他の実施例の一部断面であってクリップ作用が
強化される。FIG. 7 is a partial cross-section of another embodiment in which the clipping action is enhanced.
（効果）
本発明リード端子連接片付従来品と同様に技術成型によ
って簡単に製作できると共に接合面と位置規制片とによ
って得られる挟着力によって基板への装着が強固且つ確
実に行なえるのでハンダ付準備作業が能率よく行なえる
利点がある。(Effects) Like conventional products with lead terminal connecting pieces of the present invention, they can be easily produced by technical molding, and can be firmly and reliably attached to the board by the clamping force obtained by the joint surface and position regulating piece, so it can be easily soldered. This has the advantage that preparation work can be done efficiently.
第１図は従来のリード端子連接片の平面図、第２図は本
発明連接片の一部斜視図、第３図は基板装着状態の斜視
図、第４図及び第５５！ｉは位置規制片の要部断面図、
第６図は製品の一部斜視図、第７図は他の実施例の一部
断面図である。
（１１）は連接帯、（１３）は接合部片、（１４）は接
合面、（１５）は位置規制片、（１６）は段部、（１７
）は基板裏面当接面。
第
因
第
園Fig. 1 is a plan view of a conventional lead terminal connecting piece, Fig. 2 is a partial perspective view of the connecting piece of the present invention, Fig. 3 is a perspective view of the connecting piece attached to a board, Figs. 4 and 55! i is a sectional view of the main part of the position regulating piece;
FIG. 6 is a partial perspective view of the product, and FIG. 7 is a partial sectional view of another embodiment. (11) is a connecting band, (13) is a joint piece, (14) is a joint surface, (15) is a position regulating piece, (16) is a step, (17)
) is the back contact surface of the board. Indaien
Claims (2)
る接合部片との対を所定間隔で複数対連設させると共に
前記接合部片側に回路基板の裏面側に当接する位置規制
片が連設されて一体的に形成されてなる接合用リード端
子連接片。(1) A plurality of pairs of lead pieces and joint pieces having joint surfaces at their tips are arranged at predetermined intervals on the left and right sides of the connecting band, and a position regulating piece that contacts the back side of the circuit board on one side of the joint part. A lead terminal connecting piece for joining that is integrally formed by being connected in series.
に対して請求項第１項記載のリード端子連接片の接合面
を接触させると共に前記回路基板の裏面に位置規制片を
当接させて前記リード端子連接片を前記回路基板に挟着
支持させた状態で前記接合面と固定端子とを接合させた
後、前記リード片と前記接合部片を切除することを特徴
とするリード端子接合方法。(2) Bringing the bonding surface of the lead terminal connecting piece according to claim 1 into contact with the fixed connection terminal formed on the surface of the circuit board, and also bringing the position regulating piece into contact with the back surface of the circuit board. The lead terminal connecting piece is sandwiched and supported by the circuit board and the bonding surface and the fixed terminal are bonded together, and then the lead piece and the bonding piece are cut off. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17695888A JPH0227672A (en) | 1988-07-18 | 1988-07-18 | Lead terminal connecting piece for connection and lead terminal connecting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17695888A JPH0227672A (en) | 1988-07-18 | 1988-07-18 | Lead terminal connecting piece for connection and lead terminal connecting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0227672A true JPH0227672A (en) | 1990-01-30 |
Family
ID=16022689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17695888A Pending JPH0227672A (en) | 1988-07-18 | 1988-07-18 | Lead terminal connecting piece for connection and lead terminal connecting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0227672A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6579107B1 (en) * | 2002-01-10 | 2003-06-17 | Osram Sylvania | Connector pin for an edge of a circuit board |
-
1988
- 1988-07-18 JP JP17695888A patent/JPH0227672A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6579107B1 (en) * | 2002-01-10 | 2003-06-17 | Osram Sylvania | Connector pin for an edge of a circuit board |
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